Apple Inc.

Saint-gobain Ceramics & Plastics, Inc.

Palaniappan Chinnakaruppan

Brahmanandam V Tanikella

Robert A Rizzuto

Ramanujam Vedantham

Matthew A Simpson

Isaac K Cherian

Srikanth Kamireddi

Erik G De Jong

Dale N Memering

Jing Jing Zhang

Michael M Li

Sawako Kamei

Jeffrey C Mylvaganam

Feng Min

Xiang Du

Sai Feng Liu

Xiao Bing Cai

Jong Kong Lee

Jody R Akana

Takashi Kato

Marwan Rammah

Masashige Tatebe

Takahiro Oshima

Kenichi Nakajima

Jairam Manjunathaiah

Tushar S Deshpande

Yulei Sun

Shigehiro Sanichi

Koji Takano

Phillip W Hum

Elizabeth Thomas

Jadwiga Jaroniec

Eric Virey

Frank L Csillag

A glass member for a housing of an electronic device may include an aluminosilicate glass substrate defining a first surface of the glass member, the first surface having a first surface roughness, a fused composite coating bonded to a portion of the aluminosilicate glass substrate and defining a second surface of the glass member, the second surface having a second surface roughness greater than the first surface roughness, a first ion-exchanged layer extending into the glass member and through the fused composite coating, and a second ion-exchanged layer extending into the glass member from the first surface. The fused composite coating may include an amorphous glass matrix and a crystalline material dispersed in the amorphous glass matrix.

Chemically strengthened and textured glass housing member

A laser-textured glass cover member suitable for use in an electronic device is disclosed. The laser-textured surface of the glass cover member may provide a smooth feel to an external surface of the electronic device without introducing a perceptible visual texture. Methods for making the laser-textured glass cover members are also disclosed.

Electronic devices including laser-textured glass cover members

A cover for an electronic device and methods of forming a cover is disclosed. The electronic device may include a housing, and a cover coupled to the housing. The cover may have an inner surface having at least one of an intermediate polish and a final polish, a groove formed on the inner surface, and an outer surface positioned opposite the inner surface. The outer surface may have at least one of the intermediate polish and the final polish. The cover may also have a rounded perimeter portion formed between the inner surface and the outer surface. The rounded perimeter portion may be positioned adjacent the groove. The method for forming the cover may include performing a first polishing process on the sapphire component using a polishing tool, and performing a second polishing process on the groove of the sapphire component forming the cover using blasting media.

Sapphire cover for electronic devices

A ceramic material, such as sapphire, is irradiated using a laser-based process to form a cut. In some implementations, a region of the ceramic material adjacent to the cut may be heated. The region may be removed to form an edge feature. In various implementations, the region of the ceramic material adjacent to the cut may be shielded from an outer portion of a laser beam used in the laser-based process using a shield, such as a polyethylene film. This removal and/or shielding operations may improve the mechanical strength of the ceramic material.

Enhancing strength in laser cutting of ceramic components

A ceramic component and methods for making a ceramic component are disclosed. In particular, a sapphire component may be polished by positioning a compliant pad adjacent to a surface of the sapphire component. An abrasive slurry may be disposed or introduced between the compliant pad and the surface. The compliant pad may be moved with respect to the surface to produce a polished surface. The abrasive slurry may include a liquid component having a high pH level and medium-sized abrasive particulates.

Polishing a ceramic component using a formulated slurry

A polishing system and method for polishing a channel formed within a component is disclosed. The polishing system may include a tooling element operable to be positioned within a recess formed partially through a component. The tooling element may include an outer surface having a geometry corresponding to a geometry of the recess formed in the component. The tooling element forms a channel between the recess of the component and the tooling element when positioned in the recess. The system may also include a first member in fluid communication with a first opening of the channel, and a second member in fluid communication with a second opening of the channel. The second opening may be in fluid communication with the first opening via the channel. Additionally, the first and second member may be configured to continuously vary a pressure within the channel to move an abrasive slurry within the channel.

Polishing features formed in components

A sapphire substrate includes a generally planar surface having a crystallographic orientation selected from the group consisting of a-plane, r-plane, m-plane, and c-plane orientations, and having a nTTV of not greater than about 0.037 &#x3bc;m/cm, wherein nTTV is total thickness variation normalized for surface area of the generally planar surface, the substrate having a diameter not less than about 9.0 cm.

Sapphire substrate

Sapphire substrates and methods of making same

Wafer suitable for semiconductor deposition application can be fabricated to have low bow, warp, total thickness variation, taper, and total indicated reading properties. The wafers can be fabricated by cutting a boule to produce rough-cut wafers, lapping the rough-cut wafers, etching the lapped wafers to remove a defect, deformation zone and relieve residual stress, and chemically mechanically polishing the etched wafers to desired finish properties. Etching can be performed by immersion in a heated etching solution comprising sulfuric acid or a mixture of sulfuric and phosphoric acids. A low pH slurry utilized in chemical mechanical polishing of the spinel wafer can comprise &#x3b1;-AlOand an organic phosphate.

Spinel wafers and methods of preparation

Growing community of inventors

Cupertino, CA, United States of America

Palaniappan Chinnakaruppan