Samsung Electronics Co., Ltd.

Fns Tech Co., Ltd.

Pal Kon Kim

Seung Taek Oh

Si Hyeong Kim

Young Jun Yoo

Bong Su Ahn

Jin Ok Moon

Yoon Ho Kim

A recycled polishing pad includes an upper layer pad and a supplementary pad. The upper layer pad includes a first surface and a second surface opposite to the first surface. The first surface has a plurality of first grooves and the second surface has a plurality of second grooves. The upper layer pad further includes a connecting body connecting the first grooves and the second grooves. The supplementary pad is in contact with the second surface of the upper layer pad. A depth of each of the first grooves is less than a depth of each of the second grooves.

Recycled polishing pad

Growing community of inventors

Cheonan-si, South Korea

Pal Kon Kim