Micron Technology Incorporated

Avago Technologies Ecbu IP (singapore) Pte. Ltd.

Texas Instruments Corporation

Pak Hong Yee

Wee Sin Tan

Teck Kheng Lee

Siu Waf Low

Kian Teng Eng

Min Yu Chan

Chee Kiang Yew

Jing Sua Goh

Boon Pew Chan

Tuck Fook Toh

Wuu Yean Tay

Peng Yam Ng

Jing Zhang

Rani Ramamoorthy Saravanan

Kuldeep Kumar Saxena

Sin Heng Lim

Deng Peng Chen

Teck Chai Goh

Basoor Suresh

A touch input system includes a light-emitting device, a bent light guide and a light detector. The light-emitting device emits light. The bent light guide receives the light emitted by the light-emitting device and guides the light to travel in a direction across a face of a display screen. The light detector detects the light.

Touch input system using light guides

A transceiver having a light source die, a photodetector die and a substrate is disclosed. The substrate has a first well in which the light source die is mounted and a second well in which the photodetector die is mounted. The substrate has a reflective surface which blocks light leaving the light source from reaching the photodetector unless the light is reflected by an object external to the transceiver. The reflecting surface of the second well in the substrate is shaped to concentrate light received from outside the transceiver onto the photodetector, and in one aspect of the invention it comprises a non-imaging optical element. The light source is powered by applying a potential between first and second contacts on the light source die. A signal is generated between first and second contacts on the photodetector die in response to illumination of the photodetector die.

Optical transceiver with reduced height

A semiconductor device for dissipating heat generated by a die during operation and having a low height profile, a semiconductor die package incorporating the device, and methods of fabricating the device and package are provided. In one embodiment, the semiconductor device comprises a thick thermally conductive plane (e.g., copper plane) mounted on a thin support substrate and interfaced with a die. Thermally conductive via interconnects extending through the substrate conduct heat generated by the die from the conductive plane to conductive balls mounted on traces on the opposing side of the substrate. In another embodiment, the semiconductor devices comprises a thick thermally conductive plane (e.g., copper foil) sandwiched between insulative layers, with signal planes (e.g., traces, bonding pads) disposed on the insulative layers, a die mounted on a first signal plane, and solder balls mounted on bonding pads of a second signal plane. A thermally conductive via interconnect extends through the substrate to provide a thermal path from the die and signal plane (traces) through the thick conductive plane and into the solder balls and external device (e.g., mother board). The present semiconductor device provides effective heat dissipation without the attachment of an external heat sink or spreader.

Intrinsic thermal enhancement for FBGA package

Multiple devices that operate at different wavelengths of light are incorporated into a single composite assembly to reduce the amount of space that is needed to incorporate the assembly into a consumer electronics device. In addition, by implementing the devices in a single composite assembly, costs associated with manufacturing, assembly and shipping the assembly can be reduced. The composite assembly includes filtering mechanisms that prevent undesired wavelengths of light from impinging on the devices.

Composite receiver assembly having a circuit board on which multiple receiver devices that operate on different sets of wavelengths are mounted

An RC receiver device and an ambient light photosensor (ALPS) device are mounted on a single mounting device (e.g., circuit board or lead frame substrate) such that they are part of a single composite assembly. This reduces the amount of space that is consumed in electronic devices in which the assemblies are installed, which allows the electronic devices to be made smaller in size. In addition, implementing both the RC receiver device and the ALPS device in a single composite assembly lowers costs associated with manufacturing, assembling and shipping the composite assembly.

Remote control receiver device and ambient light photosensor device incorporated into a single composite assembly

A testing apparatus and method for testing integrated circuits is disclosed wherein a device under test is continuously maintained at a desired set point temperature by an included thermal body. The thermal body has an enclosed phase change material which provides latent heat to the device under test such that there is negligible temperature variation realized by integrated circuits being tested.

Integrated circuit (IC) test assembly including phase change material for stabilizing temperature during stress testing of integrated circuits and method thereof

A method and apparatus for producing an integrated circuit package ( ) comprising a substrate ( ) having an opening ( ) and first and second surfaces ( ), a plurality of routing strips ( ) being integral with the substrate ( ) and extending into the opening ( ), a plurality of pads ( ) disposed on the first and second surfaces ( ) are electrically connected with at least one of the routing strips ( ), wire bonding ( ) electrically connecting at least one bonding pad ( ) to at least one of the routing strips ( ) and a silicon chip ( ) attached to the printed circuit board ( ) by an adhesive material ( ) that provide a seal between silicon chip ( ) and printed circuit board ( ) is disclosed.

Method for adhering and sealing a silicon chip in an integrated circuit package

Integrated circuit package

A method and apparatus for producing an integrated circuit package (30) comprising a substrate (70) having an opening (86) and first and second surfaces (92, 94), a plurality of routing strips (82) being integral with the substrate (70) and extending into the opening (86), a plurality of pads (100) disposed on the first and second surfaces (92, 94) are electrically connected with at least one of the routing strips (82), wire bonding (80) electrically connecting at least one bonding pad (120) to at least one of the routing strips (82) and a silicon chip (50) attached to the printed circuit board (70) by an adhesive material (60) that provide a seal between silicon chip (50) and printed circuit board (70) is disclosed.

Growing community of inventors

Singapore, Singapore

Pak Hong Yee