Intel Corporation

Paik Wen Ong

Bok Eng Cheah

Jackson Chung Peng Kong

Kooi Chi Ooi

Eng Huat Goh

Yun Ji

Xingjian Cai

Jimmy Huat Since Huang

Kean Huat Leong

Chun Kit See

Sheng Jian Darren Tan

Herh Nan Chen

An electronic apparatus and an electronic system may include a first power delivery network (PDN) and a second PDN. The first PDN may include a first inductor as a segment of a power rail of the first PDN, while the second PDN may include a second inductor as a segment of a power rail of the second PDN. The first inductor and the second inductor may form a magnetically coupled inductor. The magnetically coupled inductor may provide migrated impedance Zto the first PDN induced by the magnetically coupled inductor. The migrated impedance Zto the first PDN may help the first PDN to reduce its voltage noise. Other embodiments may be described and/or claimed.

Voltage noise reduction of power delivery networks for integrated circuits

Ring-in-ring stiffeners on a semiconductor package substrate includes a passive device that is seated across the ring stiffeners. The ring-in-ring stiffeners are also electrically coupled to traces in the semiconductor package substrate through electrically conductive adhesive that bonds a given ring stiffener to the semiconductor package substrate. The passive device is embedded between the two ring stiffeners to create a smaller X-Y footprint as well as a lower Z-direction profile.

Ring-in-ring configurable-capacitance stiffeners and methods of assembling same

A semiconductor package substrate has a cavity on the land side among the ball-grid array, and a support structure inserted into the cavity as well as covering at least one device that is seated on the land side. The cavity is an enclave or an exclave. The support structure takes on several useful compositions as well as shapes and sizes.

Semiconductor package substrate support structures for ball-grid array cavities, and methods of assembling same

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Taiping, Malaysia

Paik Wen Ong