International Business Machines Corporation

Other

Paige A Poore

Caroline A Kovac

Michael J Palmer

Hiroshi Ito

Martin J Goldberg

Mark F Bregman

Roger Alan Pollak

Paul Andrew Moskowitz

Alfred Viehbeck

Stephen L Buchwalter

Timothy C Reiley

Harry R Bickford

Karl Hermann

Structure for mounting electronic devices thereon. The structure is fabricated from a plurality of substrates each having a thermally and/or electrically conductive core surrounded by a dielectric material. The substrates can be adherently placed together with the electrically conductive cores providing ground and power planes or the substrates can be mounted together with connectors electrically interconnecting adjacent substrates and spacing the adjacent substrates apart providing a space through which a fluid can flow to extract heat generated by the electronic devices mounted thereon. The conductive cores provide both power and ground planes to the structure and a means for thermally dissipating the generated heat.

Multi-level circuit card structure

A chemical solder is described that includes an organometallic complex or compound which thermally degrades within a predetermined temperature range to a metal and volatile compounds. The solder also includes a polymeric matrix that decomposes within the same temperature range to volatile fractions, thereby leaving only the metal. A method for bonding first and second bodies is disclosed wherein a chemical solder, as above-described, is disposed between the first and second bodies and heat is applied to elevate the solder to the predetermined temperature range to thermally degrade the organometallic compound and to decompose the polymeric matrix. The remaining metal bonds the first and second bodies.

Bonding method employing organometallic interconnectors

A chemical solder is described that includes an organometallic which thermally degrades within a predetermined temperature range to a metal and volatile compounds. The solder also includes a polymeric matrix that decomposes within the same temperature range to volatile fractions, thereby leaving only the metal. A method for bonding first and second bodies is disclosed wherein a chemical solder, as above-described, is disposed between the first and second bodies and heat is applied to elevate the solder to the predetermined temperature range to thermally degrade the organometallic compound and to decompose the polymeric matrix. The remaining metal bonds the first and second bodies.

Chemical solder comprising a metal salt, polyphthalaldehyde and a solvent

An integrated circuit device package in which integrated circuit devices are mounted with active faces placed facing each other to form a double-device structure. Input/output terminals on the active faces of each device can be electrically interconnected by placing an interconnection means between the chips to electrically interconnect input/output terminals on the active faces of the first and second device. Beam leads, each having an inner and outer lead bond site, project outwardly from between the devices where each of the inner lead bond site is solderlessly bonded between conducting patterns on each device bonded. A series of double-device structures can be formed on a tape having a plurality of sets of beam lead patterns thereon. Each beam lead of each set having an inner and outer lead bond site, projects outwardly from between the double-device structure, the inner lead bond site being solderlessly bonded between conducting patterns on each device.

Double electronic device structure having beam leads solderlessly bonded

Growing community of inventors

Durham, NC, United States of America

Paige A Poore