Winbond Electronics Corporation

Pai-Chun Tsai

Tzu-Ming Ou Yang

Po-Han Wu

Shu-Ming Lee

A method includes forming a stack of material layers to cover an array region and a periphery region of a substrate. A first patterned mask layer is formed, and the pattern of the first patterned mask layer is transferred to the stack of material layers, thereby forming a first array pattern and a first periphery pattern respectively in the array and periphery regions. A second patterned mask layer is provided above the first array and periphery patterns. The pattern of the second patterned mask is not aligned with the pattern of the first patterned mask. The pattern of the second patterned mask layer is transferred to form the first and second sacrificial patterns respectively in the array and periphery regions. The first array pattern, the first and second sacrificial patterns, and the first periphery pattern are simultaneously transferred to form a second array pattern and a second periphery pattern.

Growing community of inventors

Hsinchu, Taiwan

Pai-Chun Tsai