Robert Boschgmbh

Paeivi Lehtonen

Stephan Geise

Denis Gugel

Jens Ackermann

Guenter Haag

Philipp Liedl

Thomas Kaden

Robert Wieland

Patricia Maris-Haug

Thomas Suenner

Holger Nalop

Tim Behrens

Istvan Denes

Stephan Althaus

An electronic assembly includes a leadframe (), a semiconductor component (), and an electrically conductive connecting element () made of a composite material (). The connecting element () has a solderable metallization () on the composite material () on a surface that is directed towards the semiconductor component (). A thermal conductivity of the composite material () of the connecting element () is greater than a thermal conductivity of the semiconductor component () and less than a thermal conductivity of the leadframe (). The connecting element () is provided only locally in the region of the semiconductor component ().

Electronic assembly with improved thermal management

A measuring device for an injection molding system for ascertaining a batch-specific characteristic number of a plasticized plastic includes a flow channel which is situated between a plasticizing unit of an injection molding machine and an injection molding tool, a first pressure sensor and a second pressure sensor and a first temperature sensor and a second temperature sensor being situated along the flow channel. The flow channel has a taper between the first pressure sensor and the second pressure sensor.

Measuring device and measuring method for an injection molding machine for ascertaining a batch-specific characteristic number

Growing community of inventors

Fellbach, Germany

Paeivi Lehtonen