Analog Devices International Unlimited Company

Analog Devices Global

Analog Devices,inc.

Analog Devices Global Unlimited Company

Raychem International

Padraig Fitzgerald

Raymond C Goggin

Alan J O'Donnell

Eoin Edward English

Javier Calpe Maravilla

Michael P Lynch

Jo-ey Wong

Mark Schirmer

Michael James Twohig

Bernard Patrick Stenson

Oliver J Kierse

Jochen Schmitt

Jan Kubik

Gavin Patrick Cosgrave

Denis Ellis

Shaun Bradley

Alfonso Berduque

Robert Guyol

Michael John Flynn

Maria Jose Martinez

Stanislav Jolondcovschi

Jan Kubík

Richard Eckl

Eric James Carty

Philip Brennan

Bruce A Hecht

Padraig McDaid

Brendan Normoyle

Derek Nolan

Jonathan Ephraim David Hurwitz

Lei Wang

Srivatsan Parthasarathy

Michael C W Coln

George Redfield Spalding, Jr

John Jude O'Donnell

Denis Martin O'Connor

Laurence Brendan O'Sullivan

Ying Zhao

Check F Lee

Ramji Lakshmanan

James Thomas Sheeran

Patrick F M Poucher

Olly J Kierse

Paul W Stevens

David Rohan

Dragoslav Culum

Naveen Dhull

Javier Alejandro Salcedo

Colin Gerard Lyden

Patrick Martin McGuinness

Paul Martin Lambkin

William Hunt

Michael J Cusack

Frank Poucher

John G Macnamara

Patrick Elebert

Jean-Christophe Bouche

Mark Leyden

Nigel James Hayes

John Dixon

James Lee Lampen

Erkan Acar

Randy Oltman

Richard Tarik Eckl

Raymond Goggin

Aspects of this disclosure relate to adjusting fluid flow using magnetically sensitive particles. Fluid can flow through an opening in a container. Magnetically sensitive particles can be confined within the container. A magnetic field can be applied to move the magnetically sensitive particles in the container to adjust flow of the fluid through the opening.

Flow adjustment based on particle movement in response to magnetic field

Aspects of this disclosure relate to particles that can move in response to a magnetic field. A system can include a container, particles within the container, and a magnetic structure integrated with the container. The magnetic structure can magnetically interact with both an external magnetic field and the particles. Related methods are disclosed including magnetic field detection methods based on detection of particles within a container.

Magnetically sensitive particles and magnetic structure

Aspects of this disclosure relate to one or more particles that move within a container in response to a magnetic field. A measurement circuit is configured to output an indication of the magnetic field based on position of the one or more particles.

Magnetic field measurement using container with particle

The present disclosure relates to integrated circuits which include various structural elements. In particular, a combination of trenches and cavities are used to mechanically isolate the integrated circuit from the surrounding substrate. The trenches may be formed such that they surround the integrated circuit, and the cavities may be formed under the integrated circuit. As such, the integrated circuit may be formed on a portion of the substrate that forms a platform. In order that the platform does not move, it may be tethered to the surrounding substrate.

Devices and methods for reducing stress on circuit components

Microelectromechanical systems (MEMS) switches are disclosed. The MEMS switch may have an actuation voltage greater than the expected voltage of a signal being passed by the MEMS switch in normal operation. The MEMS switches may include a distributed hinge structure in some embodiments. Radial contact pads are included in some embodiments, with or separate from the distributed hinge.

Microelectromechanical systems (MEMS) switch and related methods

An apparatus is provided that is implemented to enable multiple tests of different types, such as a direct current (DC) test and/or a radio frequency (RF) test of a semiconductor device. The apparatus includes a microelectromechanical systems (MEMS) switch block coupled between the semiconductor device and automatic testing equipment (ATE). The apparatus is configured to enable/disable a DC path or an RF path to switch between a DC test and an RF test without reconfiguring the connections between the semiconductor device and the ATE. The DC path is used to perform a DC contact test for one or more pins of the semiconductor device. The RF path is used to perform an RF test for the semiconductor device.

Apparatuses and methods for testing semiconductor circuitry using microelectromechanical systems switches

An integrated circuit package can contain a semiconductor die and provide electrical connections between the semiconductor die and additional electronic components. The integrated circuit package can reduce stress placed on the semiconductor die due to movement of the integrated circuit package due to, for example, temperature changes and/or moisture levels. The integrated circuit package can at least partially mechanically isolate the semiconductor die from the integrated circuit package.

Integrated circuit packages to minimize stress on a semiconductor die

Magnetic field sensing based on particle position within container

A magnetic device may include a magnetic structure, a device structure, and an associated circuit. The magnetic structure may include a patterned layer of material having a predetermined magnetic property. The patterned layer may be configured to, e.g., provide a magnetic field, sense a magnetic field, channel or concentrate magnetic flux, shield a component from a magnetic field, or provide magnetically actuated motion, etc. The device structure may be another structure of the device that is physically connected to or arranged relative to the magnetic structure to, e.g., structurally support, enable operation of, or otherwise incorporate the magnetic structure into the magnetic device, etc. The associated circuit may be electrically connected to the magnetic structure to receive, provide, condition or process of signals of the magnetic device.

Devices, systems and methods including magnetic structures and micromechanical structure

Electrical overstress protection of microelectromechanical systems (MEMS) are disclosed herein. In certain embodiments, a MEMS radio frequency system includes a MEMS device electrically connected along a radio frequency signal path that handles a radio frequency signal, and an electrical overstress protection circuit in shunt with the radio frequency signal path and operable to protect the MEMS device from an electrical overstress event, such as an electrostatic discharge (ESD) event received on the radio frequency signal path. The electrical overstress protection circuit includes a metal conductor configured to resonate about at a fundamental frequency of the radio frequency signal.

Electrical overstress protection of microelectromechanical systems

A phase shifter that includes an RF splitter is disclosed. The RF splitter is arranged so that an RF input signal is provided to, and split over portions of, a feed line that connects an antenna element with a radio transmitter/receiver/transceiver, thus realizing a feed line splitter. Feed line splitters described herein are provided with switches that allow changing a point at which the RF input signal is fed to the feed line, where the switches may be semiconductor-based or MEMS-based switches. The point at which the RF input signal is provided to the feed line to be split defines the electrical path length that the RF energy will travel down each respective path of the feed line splitter, which, in turn, changes the phase shift realized at each output of the feed line splitter. Different antenna elements may be coupled to different outputs of the feed line splitter.

Phase shifters using switch-based feed line splitters

The present disclosure relates to integrated circuits which include various structural elements designed to reduce the impact of strain on the electronic components of the circuit. In particular, a combination of trenches and cavities are used to mechanically isolate the integrated circuit from the surrounding substrate. The trenches may be formed such that they surround the integrated circuit, and the cavities may be formed under the integrated circuit. As such, the integrated circuit may be formed on a portion of the substrate that forms a platform. In order that the platform does not move, it may be tethered to the surrounding substrate. By including such mechanical elements, variation in the electrical characteristics of the integrated circuit are reduced.

Optically isolated micromachined (MEMS) switches and related methods are described. The optically isolated MEMS switches described herein may be used to provide isolation between electronic devices. For example, the optically isolated MEMS switches of the types described herein can enable the use of separate grounds between the receiving electronic device and the control circuitry. Isolation of high-voltage signals and high-voltage power supplies can be achieved by using an optical isolator and a MEMS switch, where the optical isolator controls the state of the MEMS switch. In some embodiments, utilizing optical isolators to provide high voltages, the need for electric high-voltage sources such as high-voltage power supplies and charge pumps may be removed, thus removing the cause of potential damage to the receiving electronic device. In one example, the optical isolator and the MEMS switch may be co-packaged on the same substrate.

System comprising a package having optically isolated micromachined (MEMS) switches with a conduit to route optical signal to an optical receiver and related methods

Growing community of inventors

Mallow, Ireland

Padraig Fitzgerald