Applied Materials, Inc.

Padmanaban Krishnaraj

Tetsuya Ishikawa

Michael Santiago Cox

Tom K Cho

Canfeng Lai

Laxman Murugesh

Yaxin Wang

Lily L Pang

Sudhir R Gondhalekar

Alan W Collins

Feng Gao

Narendra Dubey

In a method of cleaning process residues formed on surfaces in a substrate processing chamber, a sacrificial substrate comprising a sacrificial material is placed in the chamber, a sputtering gas is introduced into the chamber, and the sputtering gas is energized to sputter the sacrificial material from the substrate. The sputtered sacrificial material reacts with residues on the chamber surfaces to clean them. In one version, the sacrificial substrate comprises a silicon-containing material that when sputtered deposits silicon on the chamber walls that reacts with and cleans fluorine-containing species that are left behind by a chamber cleaning process.

Cleaning residues from surfaces in a chamber by sputtering sacrificial substrates

A substrate processing chamber comprising a first gas distributor adapted to provide a process gas into the chamber to process the substrate , a second gas distributor adapted to provide a cleaning gas into the chamber to clean the chamber, and an exhaust to exhaust the process gas or cleaning gas from the chamber

Directing a flow of gas in a substrate processing chamber

Growing community of inventors

San Francisco, CA, United States of America

Padmanaban Krishnaraj