Xilinx, Inc.

P Hugo Lamarche

Steven P Young

Trevor J Bauer

F Erich Goetting

Raymond C Pang

Paul Ying-Fung Wu

Kwansuhk Oh

Bruce E Talley

Patrick J McGuire

Venu M Kondapalli

Wei Guang Lu

A method and apparatus is provided to implement rapid reconfiguration during either a full, or partial, reconfiguration of a programmable logic device (PLD). Rapid reconfiguration is facilitated by a massively parallel configuration data bus that is created to simultaneously reconfigure the entire height of a reconfiguration memory space. A direct link may be provided to the configuration memory space of the PLD by utilizing interconnect and input/output resources to form the massively parallel configuration data bus. An indirect link may also be provided to the entire configuration memory space by utilizing existing random access memory (RAM) resources within the PLD as configuration bitstream buffers.

Apparatus and method for reconfiguring a programmable logic device

An integrated circuit die (e.g., a programmable logic device (PLD) die) is manufactured that has the capability of being configured as at least two differently-sized family members. The IC die is tested prior to packaging. If a first portion of the IC die is fully functional, but a second portion includes a localized defect, then the IC die is packaged with a product selection code that configures the IC die to operate as only the first portion of the die. The second portion of the die is deliberately rendered non-operational. Therefore, the IC die can still be sold as a fully functional packaged IC.

Yield-enhancing methods of providing a family of scaled integrated circuits

A multi-product integrated circuit die includes at least two different portions, of which at least one portion can be deliberately rendered non-operational in some manner (e.g., non-functional, inaccessible, and/or non-programmable) within the package. A selection code storage circuit stores a product selection code. A first value of the product selection code selects the option where both the first and second portions of the first die are operational. A second value of the product selection code selects the option where only the first portion of the first die is operational. The selection code storage circuit can include non-volatile memory or a fuse structure, or the product selection code can be configured as a package bonding option. The product selection code can also enable boundary scan for the operational portion of the die, and omit from the boundary scan chain any portions of the die that are deliberately rendered non-operational.

Multi-product die configurable as two or more programmable integrated circuits of different logic capacities

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Campbell, CA, United States of America

P Hugo Lamarche