Airbus Defence and Space Gmbh

Siemens Aktiengesellschaft

Öztzan Akif

Maxime Coquel

Randolf Mock

Thomas Vontz

Thomas Vonz

A laying die, for picking up and laying of substrates, comprising an elastically deformable substrate receiving structure providing an engagement surface for releasable receiving of substrates, an attaching element comprising a gas channel for providing positively or negatively pressurized gas for picking up and blowing off the substrates, and a carrier body made from elastically deformable material and sandwiched between the substrate receiving structure and the attaching element which is arranged to distribute the positively or negatively pressurized gas over the carrier body. The carrier body comprises breakthroughs to transfer the pressurized gas from the attaching element to the substrate receiving structure that comprises an elastically deformable distribution plate to distribute the positively or negatively pressurized gas over the engagement surface. Also, a laying device which changes the position and/or orientation of substrates to predetermined values can comprise the laying die and a method for manufacturing the laying die.

Laying die, laying device and method for manufacturing a laying die

A device for generating a flow of air, particularly for cooling electronic components, with an annular piezo element and an emitter element, wherein the annular piezo element can be vibrated radially by applying an alternating voltage, the emitter element is coupled radially to the annular piezo element, and wherein the radial vibration of the annular piezo element is configured so as to set the emitter element into axial vibration to generate the air flow which thereby permits a device of small dimensions for generating the an air flow to be created that is simultaneously characterized by low energy consumption and a long service life.

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Munich, Germany

Öztzan Akif