Hewlett-packard Development Company, L.p.

Ozgur E Yildirim

Mike Steed

Garrett E Clark

Anthony M Fuller

Joseph R Elliot

Bradley D Chung

Volker Smektala

Bhavin Shah

Arun K Agarwal

Jules G Moritz

Julie J Cox

Ralph L Stathem

James A Feinn

Matthew David Giere

Satya Prakash

James Pingel

Gilbert G Smith

David William Jenkins

Elizabeth A Fellner

Julie Jo Cox

Jules G Moritz Iii

A cartridge may include a fluid reservoir, a print head to eject fluid from the reservoir through nozzles and bubblers. The print head may include a fluid feed slot to supply fluid from the reservoir to the nozzles. The bubblers are opposite the fluid feed slot.

Bubbler

A bubbler may be provided between nozzles. The bubbler may be provided opposite a standpipe.

Bubblers may be provided between nozzles. Such bubblers may have elongated cross-sections.

A fluid-dispensing head includes a plenum configured to house fluid; at least one dispensing head orifice in fluid communication with the ink plenum; and at least one heating element configured to heat fluid in the head such that gas bubbles disposed within the fluid increase in surface area.

System for priming a fluid dispenser by expanding gas bubbles

A heating element of a fluid ejection device includes an insulative layer, a resistor portion interposed between and spaced apart from a pair of conductive portions, and an upper structure defining a fluid chamber above the resistor portion. The insulative layer defines a shoulder portion adjacent a side edge of the resistor portion, the shoulder portion vertically spaced below a top surface of the resistor portion by a distance of no more than twice a thickness of the resistor portion.

Heating element

Embodiments of a heating element of a fluid ejection device are disclosed.

A method of making a printhead comprises forming a resistor strip in a heating region of the printhead. In a first portion of the heating region, a resistive layer is formed including a central resistor region interposed between two spaced apart conductive elements. In the method, a conductive layer is removed from a bus region of the printhead while protecting the first portion of the heating region.

A fluid ejection device includes a fluid chamber, a fluid restriction communicated with the fluid chamber, and a fluid channel communicated with the fluid restriction. The fluid restriction has a fluid restriction parameter defined as (2*W+2*H)*L/(H*W), wherein W is a width of the fluid restriction, H is a height of the fluid restriction, and L is a length of the fluid restriction. As such, the fluid restriction parameter is in a range of 1.5 to 5.75.

Fluid ejection device

A fluid ejection device includes a fluid chamber, a fluid restriction communicated with the fluid chamber, and a fluid channel communicated with the fluid restriction, wherein a width of the fluid restriction is in a range of approximately 8 microns to approximately 16 microns, and a length of the fluid restriction is in a range of approximately 5 microns to approximately 20 microns.

Methods and systems for managing bubbles in a micro electro mechanical systems device are described. One exemplary system includes a fluid-feed channel configured to supply fluid to a plurality of ejection chambers, individual ejection chambers comprising a resistor configured to eject fluid from the individual ejection chamber. The system further includes a processor configured to cause an individual resistor to be energized at a first intensity sufficient to eject fluid from a respective ejection chamber, the processor further configured to cause the resistor to be energized at a second lower intensity which heats the resistor but does not cause fluid to be ejected from the respective ejection chamber, and wherein the processor can energize, at the second lower intensity level, individual resistors in a pattern designed to detach a bubble from a surface defining a portion of the fluid-feed channel.

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Albany, OR, United States of America

Ozgur E Yildirim