Broadcom Corporation

Owen Hynes

Jonathan Alois Schmitt

Yong Lu

Roy Milton Carlson

A differential bit cell includes two memory elements that are configured to have different states. Each of the two memory elements is connected to a respective switching element. Each of these switching elements may have process variances, which may result in a degradation of read and/or write margins. To mitigate the effect of such variances, another switching element is coupled to the two memory elements and their respective switching elements in a manner that couples the aforementioned switching elements in a parallel fashion. In this way, the mismatch effects between the switching elements can be negated during read operations. During programming operations, such a configuration allows for the programming of both memory elements to different states with a single current pulse and also reduces the effective resistance of the programming path.

Differential bit cell

A programmable memory cell including a thick oxide spacer transistor, a programmable thin oxide anti-fuse disposed adjacent to the thick oxide spacer transistor, and first and second thick oxide access transistors. The thick oxide spacer transistor and first and second thick oxide access transistors can include an oxide layer that is thicker than an oxide layer of the programmable thin oxide anti-fuse. The programmable thin oxide anti-fuse and the thick oxide spacer transistor can be natively doped. The first and second thick oxide access transistors can be doped so as to have standard threshold voltage characteristics.

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Gilbert, AZ, United States of America

Owen Hynes