Infineon Technologies Ag

Infineon Technologies Bipolar Gmbh & Co. Kg

Oskar Neuhoff

Klaus Elian

Reiner Barthelmess

Michael Larisch

Norbert Martin Haueis

Dirk Pikorz

Tobias Gamon

Franz Reithner

Ludwig Heitzer

Bernd Stadler

Johann Strasser

Uwe Kellner-Werdehausen

Johannes Lodermeyer

Cyrus Ghahremani

Derek Debie

Peter Roider

Johann Breu

Christian Gottswinter

Harald Kuhn

Norbert Haueis

A microelectromechanical systems (MEMS) package assembly and a method of manufacturing the same is provided. The MEMS package assembly includes a substrate, a housing coupled to the substrate to form a cavity, wherein the housing includes a transparent plate disposed above and parallel to the substrate and is configured to permit a transmission of light therethrough, and a MEMS chip disposed within the cavity and including a first main surface proximal to the transparent plate and a second main surface opposite to the first main surface and coupled to the substrate. The MEMS chip is oriented such that the first main surface is tilted at a tilt angle with respect to the transparent plate.

Tilted chip assembly for optical devices

A system produces devices that include a semiconductor part and a non-semiconductor part. A front end is configured to receive a semiconductor part and to process the semiconductor part. A back end is configured to receive the processed semiconductor part and to assemble the processed semiconductor part and a non-semiconductor part into a device. A transfer device is configured to automatically handle the semiconductor part in the front end and to automatically transfer the processed semiconductor part to the back end.

System and method for producing devices including a semiconductor part and a non-semiconductor part

The invention relates to a packaging system having a tool for inserting electronic components into a carrier tape, which has passage openings. The tool has a pick-up device to pick up the components from a carrier film and position them in the passage openings by means of a lifting movement. The packaging system has a guide plate for the linear sliding conveyance of the carrier tape populated with electronic components, and in each case devices for applying upper and lower cover films to the carrier tape. The invention additionally relates to a method of populating the carrier tape with electronic components.

Packaging system with a tool for enclosing electronic components and method of populating a carrier tape

The covering device covers a ceramic module with electronic components arranged between a ceramic substrate and an upper covering plate of the covering device. The covering device is spaced apart by spacers from the surface of the ceramic substrate fitted with components. The covering device is fixed on the ceramic module by snap-in elements which engage in lateral cutouts in the ceramic substrate.

Covering device for ceramic modules

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Nittendorf, Germany

Oskar Neuhoff