Apple Inc.

Seagate Technology Incorporated

Oscar Woo

Michael D Hillman

Gregory L Tice

Amir Salehi

Jonathan Neal Urquhart

Anwyl M McDonald

Richard Lidio Blanco

Michael Richard Fabry

Ronald Jack Smith

Sean A Bailey

Chau Chin Low

Terry Junge

Jonathan E Olson

Tiang Fee Yin

Choon An Aw

Clayton R Anderson

James M Crowder

Jeffrey J Van Norden

Embodiments of a method for applying a thermal-interface material are described. During this method, a first surface of a heat-removal device and a second surface of a semiconductor die are prepared. Next, a region on a given surface, which is at least one of the first surface and the second surface, is defined. Then, the thermal-interface material is applied to at least the region, where the thermal-interface material includes a material that is a liquid metal over a range of operating temperatures of the semiconductor die.

Spray dispensing method for applying liquid metal

Packaged surface mount (SMT) chips having matched top contacts and bottom contacts are stacked. Chip features are selected to provide the desired connectivity between chip layers with a greater ease of manufacture. In one embodiment, additional spacing and routing layers are optionally provided between layers. In another, chips are differentiated by optionally providing different conductor and/or nonvolatile cell configurations. In yet another, a minority of a substrate's contacts are configured for aligning with a dielectric region of a spacing layer or substrate to create very low capacitance signal paths between stacked chips.

Surface mount IC stacking method and device

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Santa Cruz, CA, United States of America

Oscar Woo