Alpha Assembly Solutions Inc.

Fry's Metals, Inc.

Alpha Metals, Inc.

Other

Lucent Technologies Inc.

Advanced Packaging Center Bv

Oscar Khaselev

Bawa Singh

Michael T Marczi

Nitin Vithalbhai Desai

Monnir Boureghda

Anna Lifton

Siuli Sarkar

Brian Lewis

Bin Mo

Ranjit Pandher

Sathish Kumar

Sutapa Mukherjee

Remya Chandran

Pavan Vishwanath

Ashok Pachamuthu

Shamik Ghosal

Yun Zhang

Rahul Raut

Michael James Liberatore

Ravi Bhatkal

Nirmalya Kumar Chaki

Paul Koep

Sachin Parashar

Girard Sidone

Paul Salerno

Angelo Gulino

Bogdan Bankiewicz

Igor S Zavarine

Ellen Schwartz Tormey

Morgana De Avila Ribas

Carl Bilgrien

Steven Dane Prokopiak

Supriya Deverajen

Nitin Desai

Mike Marczi

Eef Boschman

Morgana Ribas

Matthew James Siebenhuhner

Michael Liberatore

Paul J Koep

A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.

Sintering powder

Methods for die attachment of multichip and single components may involve printing a sintering paste on a substrate or on the back side of a die. Printing may involve stencil printing, screen printing, or a dispensing process. Paste may be printed on the back side of an entire wafer prior to dicing, or on the back side of an individual die. Sintering films may also be fabricated and transferred to a wafer, die or substrate. A post-sintering step may increase throughput.

Sintering materials and attachment methods using same

A solder material comprising a solder alloy and a thermal conductivity modifying component. The solder material has a bulk thermal conductivity of between about 75 and about 150 W/m-K and is usable in enhancing the thermal conductivity of the solder, allowing for optimal heat transfer and reliability in electronic packaging applications.

Solder material and method for die attachment

A method of making a combined sinter-ready silver film and carrier comprises the steps of: a) creating a carrier comprising designed openings; b) casting a silver film layer into the designed openings, for example casting a silver paste; and c) drying the carrier and silver film layer to form the combined sinter-ready silver film and carrier. The carrier may comprise a plastic carrier, which may be created by permanently bonding two plastic films, using a plasma bonding process or using a temperature stable glue. The carrier may comprise a stencil layer and a backing layer. The stencil layer may define the designed openings. The backing layer may be configured for sealing a bottom of the designed openings, wherein at the start of step b), a top of the designed openings may be open for receiving the cast silver film layer.

Sinter-ready silver films

Methods for attachment and devices produced using such methods are disclosed. In certain examples, the method comprises disposing a capped nanomaterial on a substrate, disposing a die on the disposed capped nanomaterial, drying the disposed capped nanomaterial and the disposed die, and sintering the dried disposed die and the dried capped nanomaterial at a temperature of 300&#xb0; C. or less to attach the die to the substrate. Devices produced using the methods are also described.

Methods for attachment and devices produced using the methods

A silver film for die attachment in the field of microelectronics, wherein the silver film is a multilayer structure comprising a reinforcing silver foil layer between two layers of sinterable particles. Each layer of sinterable particles comprises a mixture of sinterable silver particles and reinforcing particles. The reinforcing particles comprise glass and/or carbon and/or graphite particles. A method for die attachment using a silver film.

Composite and multilayered silver films for joining electrical and mechanical components

A method of die and clip attachment includes providing a clip, a die and a substrate, laminating a sinterable silver film on the clip and the die, depositing a tack agent on the substrate, placing the die on the substrate, placing the clip on the die and the substrate to create a substrate, die and clip package, and sintering the substrate, die and clip package.

Method for die and clip attachment

Sintering paste

Materials for die attachment such as silver sintering films may include reinforcing, modifying particles for enhanced performance. Methods for die attachment may involve the of such materials.

A jettable etchant composition includes 1 to 90 wt % active ingredient, and a remainder containing any combination of the following: 10 to 90 wt % solvent, 0 to 10 wt % reducing agents, &#x3c;1 to 20 wt % pickling agent, 0 to 5 wt % surfactant, and 0 to 5 wt % antifoam agent. The composition can also include a soluble compound containing at least one element which when dissolved has a higher standard electrode potential than a metal to be etched or a soluble compound containing a group IA element, and a soluble platinum group metal. An ink composition can include a group VA compound or a group IIIA compound in a solvent system formulated to be jettable on a surface at a drop volume of about 5 to about 10 picoliters and to achieve a final sheet resistance of less than about 20 &#x3a9;/&#x3b1; of the surface upon activation.

Jettable inks for solar cell and semiconductor fabrication

Conductive patterns and methods of using and printing such conductive patterns are disclosed. In certain examples, the conductive patterns may be produced by disposing a conductive material between supports on a substrate. The supports may be removed to provide conductive patterns having a desired length and/or geometry.

Conductive patterns and methods of using them

Growing community of inventors

Monmouth Junction, NJ, United States of America

Oscar Khaselev