Intel Corporation

Osborne A Martin, Iii

Liang Zhang

Robert F Wiedmaier

Zhihua Zou

Inspection of microelectronic devices is described using near infrared light. In one example, a dielectric material layer on a substrate is illuminated with a near infrared light beam. The substrate has at least one contact land, the dielectric material layer overlies at least a portion of the contact land, and the substrate has at least one via defined in the dielectric material layer, the via exposing at least a portion of the contact land. Reflected near infrared light is reflected from the substrate at a camera. The position of the via is determined relative to the contact land from the reflected light beam using an image processing device.

Growing community of inventors

Maricopa, AZ, United States of America

Osborne A Martin, Iii