Sharp Kabushiki Kaisha Corporation

Tokin Corporation

Osamu Yamazaki

Shigeo Onishi

Katsunori Kumasaka

Kazuyo Nakamura

Hiroshi Shima

Yoshiyuki Abe

Keiichiro Uda

Noriaki Ikezawa

Kouichi Shuta

Hiromi Hattori

Nobutaka Fukushima

In the present invention, a device is provided with a main surface member, a piezoelectric body plate, a first support part, and a housing. The main surface member is used as a vibration plate. The piezoelectric body plate vibrates according to an electric signal. The first support part supports the piezoelectric body plate. The housing has a second support part that supports the main surface member and extends in a prescribed direction that intersects the main surface member. The first support part is secured to the second support so that the second support part vibrates in the prescribed direction according to the vibration of the piezoelectric body plate. The vibration of the piezoelectric body plate is transmitted to the main surface member via the first support part and the second support part, and due to this the main surface member vibrates to generate a sound.

Device generating sound

A method for manufacturing a semiconductor device comprising forming a titanium or titanium compound film by a CVD method which uses a material gas containing an organic titanium compound of the formula (I) ##STR1## wherein R is a hydrogen atom, a lower alkyl group, a C.sub.8-13 condensed polycyclic hydrocarbonyl group or a silyl group which is substituted with a lower alkyl and/or an aryl, and a reducing gas.

Method for manufacturing a semiconductor device comprising titanium

Growing community of inventors

Sendai, Japan

Osamu Yamazaki