Murata Manufacturing Co., Ltd.

Osamu Yamaguchi

Shinichiro Banba

Hideki Ueda

Shinya Mizoguchi

Akihiro Muranaka

Koji Yasojima

Tsubasa Nishida

Yoshihito Otsubo

Noriyuki Ueki

Takafumi Kusuyama

Motohiko Kusunoki

An electronic component module is provided that includes a substrate, an electronic component, a heat dissipating member, and a sealing resin. The electronic component is mounted on the substrate. The heat dissipating member includes a flat plate and columnar bodies. The sealing resin covers a side of a first main surface of the substrate and the electronic component. Moreover, the heat dissipating member, except for a top surface of the flat plate, is covered with the sealing resin. The columnar bodies are disposed at an outer peripheral of the flat plate, and have a shape protruding from a bottom surface of the flat plate. The columnar bodies include a root connected to the flat plate, and a tip connected to the substrate. In a plan view of the electronic component module, the tip is not outside the root.

Electronic component module

A radio communication module is provided that includes a circuit board, a first radiation conductor, and an insulating resin. In the circuit board, a first main surface and a second main surface are included, and a second radiation conductor is provided on the second main surface of the circuit board. The first radiation conductor is flat and is provided near the first main surface. The insulating resin is provided near the first main surface side. The thickness of the first radiation conductor is larger than the thickness of the second radiation conductor.

Radio communication module

A radiation conductor is constructed of a metal plate having a pair of main surfaces pointing in opposite directions. Each main surface of the pair of main surfaces includes a first surface region that includes at least part of a peripheral edge portion of the main surface. At least one main surface of the pair of main surfaces includes a second surface region that is a region other than the first surface region. A dielectric member holds the radiation conductor in such a manner that the first surface region of each main surface of the pair of main surfaces is sandwiched between portions of the dielectric member in a thickness direction of the radiation conductor. The second surface region of the at least one main surface is exposed.

Antenna device, antenna module, and communication apparatus

A high-frequency moduleincludes: a substrate; a first componentmounted on an upper surfaceof the substrate; a second componentmounted on a lower surfaceof the substrate; an upper sealing resin layerand a lower sealing resin layer; a conductor pin; and a shield layer. The conductor pinincludes a terminal portionexposed from a lower surfaceof the lower sealing resin layerand connected to a ground electrode of an outer substrate, and a shield connection portionexposed from a side surfaceof the lower sealing resin layerand connected to the shield layer. As a result of the terminal portionof the conductor pinbeing connected to the ground electrode, the shield layeris connected to a ground potential with the shortest distance therebetween.

High-frequency module and manufacturing method thereof

A radiation conductor is constructed of a metal plate having a pair of main surfaces pointing in opposite directions. Each main surface of the pair of main surfaces includes a first surface region that includes at least part of a peripheral edge portion of the main surface. At least one main surface of the pair of main surfaces includes a second surface region that is a region other than the first surface region. A dielectric member holds the radiation conductor in such a manner that the first surface region of each main surface of the pair of main surfaces is sandwiched between portions of the dielectric member in a thickness direction of the radiation conductor. A housing supports and accommodates the dielectric member. The second surface region of the at least one main surface is exposed.

Growing community of inventors

Kyoto, Japan

Osamu Yamaguchi