Fujitsu Corporation

Osamu Yamaguchi

Yasunori Fujimoto

Kazuyuki Imamura

Atsushi Kikuchi

Yoshiyuki Yoneda

Toshiya Akamatsu

Masaharu Minamizawa

Muneharu Morioka

Nobutaka Shimizu

Masaru Nukiwa

Takumi Ihara

Yukihiro Kuriki

Masaki Uchida

A manufacturing method of a semiconductor device incorporating a passive element includes the steps as follows: a redistribution board forming step forms a redistribution board incorporating the passive element on a base board; a semiconductor element mounting step mounts at least one semiconductor element formed on an opposite side surface of the redistribution board with regard to the base board; a base board separating step separates the base board from the redistribution board and exposes the other surface of the redistribution board; a redistribution board mounting step mounts the redistribution board on a package board via electrode pads exposed from the other surface of the redistribution board.

Manufacturing method of a semiconductor device incorporating a passive element and a redistribution board

In a method for mounting an electronic part on a mounting substrate in that projection electrodes provided on the electronic part are welded by fusion to join connection terminals provided on the mounting substrate, the flux paste includes a base flux and metal grains having diameters smaller than the diameters of projection electrodes and having a thickness so as to form a space between the flux paste and the electronic part when the electronic part is mounted on the mounting substrate and the flux paste is arranged on the mounting substrate. A resin is sealed in the space formed between the electronic part and the mounting substrate after the projection electrodes are joined to the connection terminals.

Method for mounting electronic part and paste material

Growing community of inventors

Kawasaki, Japan

Osamu Yamaguchi