Toa Nenryo Kogyo Kabushiki Kaisha

Osamu Watanebe

Hiroshi Inoue

Makoto Miyazaki

Shinkichi Murakami

Sadahisa Wada

A new thermocurable composition is disclosed which comprises a Bisphenol A-type epoxy resin having a number average molecular weight of 650-1300, 10-40% by weight of the Bisphenol A-type epoxy resin having an epoxy equivalent of 180-195; and a curing agent capable of cross-linking the epoxy resin. The curing agent is preferably a compound represented by the following general formula: ##STR1## wherein X is --CR.sub.1 R.sub.2 --, --CO--, --COO--, --SO.sub.2 --, --SO--, --S--, --O--, --NR.sub.1 --, --SiR.sub.1 R.sub.2 -- or --POR.sub.1 -- where R.sub.1 and R.sub.2 each stands for hydrogen, a lower alkyl or a phenyl; Y and Y' each stands for hydrogen, a lower alkyl or an electron attractive group; R is a lower alkyl; and m and n each is an integer of 1-4, or a mixture thereof with a primary amine, a phenolic compound or an acid anhydride.

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Iruma, Japan

Osamu Watanebe