Toshiba Tec Kabushiki Kaisha

Sony Corporation

Shinkawa Ltd.

Mitsubishi Denki Kabushiki Kaisha

Oki Data Corporation

Ihi Corporation

Canon Kabushiki Kaisha

Dai Nippon Printing Co., Ltd.

Valqua, Ltd.

Nec Corporation

Kyocera Corporation

Yamaha Corporation

Kumiai Chemical Industry Co., Ltd.

Tokuriki Honten Co., Ltd.

Kabushiki Kaisha Toshiba

Osamu Watanabe

Tomonori Nakamura

Kazuhiro Fushimi

Hiroyasu Ishii

Yoshimi Urushibata

Teruyuki Ochiai

Yukihiro Tamura

Tetsugo Inada

Hideshi Yamada

Yoji Okita

Chiyuki Nakamata

Yoshihito Hagiwara

Teruyuki Nakahashi

Seiji Kubo

Toru Maeda

Yoshihiro Nishida

Satoru Nagai

Hiroshi Matsumoto

Kazumasa Ito

Takeshige Miyazawa

Tsuyoshi Abe

Takashi Nara

Tomoyuki Horio

Hiroshi Kawasaki

Ryo Fujii

Yoshihiro Saeki

Takahiro Fujimori

Ryo Kawamura

Masafumi Kurashige

Hidekazu Maruta

Sho Suzuki

Yuichiro Noguchi

Yuichiro Kawabe

Kentaro Takagi

Nobuyuki Kume

Kazuaki Ikeda

Tanio Nagasaki

Kotaro Yoshimura

Tadashi Fujiwara

Katsumi Gocho

Masataka Fukuda

Shinsuke Koyama

Yasuhiro Moriyama

Masatsugu Yamamoto

Kazuo Yonekura

Fumiko Oguni

Kozo Nita

Yuji Kanai

Tomomi Nakajima

Hiroki Kawanishi

Koji Nishi

Tetsuya Otani

Atsuhide Suzuki

Shigemi Togashi

Jun Kaneki

Toshihiro Fujiwara

Mutsumi Kimura

Michiaki Takei

Daichi Sasaki

Toshihiro Matsuura

Junko Kuroiwa

Tatsuya Kozakai

Kosuke Komatsu

Eizo Yamazaki

Sorin Den

Kiyoto Ohkawa

Yoshiteru Nakamura

Masaichi Ishibashi

Keisuke Endou

Atsushi Washio

Keita Iwahara

Takanobu Tadaki

Kio Mizuno

Yuichi Hayatsu

Mitsuaki Maeno

Kuniaki Nomata

Kojiro Akagawa

Keiichi Saito

Hisao Fujihashi

To provide an antireflection member which not only has a low reflectance, but also is enhanced in scratch resistance, and an image display device comprising the antireflection member. An antireflection membercomprising a low refractive index layeron a transparent substrate, in which the low refractive index layerincludes a binder resin and silica particlesand, a ratio of Si element attributed to the silica particles, obtained by analysis of a surface region of the low refractive index layerby X-ray photoelectron spectroscopy, is 10.0 atomic percent or more and 18.0 atomic percent or less and a ratio of C element under the assumption that the ratio of Si element is defined to be 100 atomic percent is 180 atomic percent or more and 500 atomic percent or less.

Antireflective member, and polarizing plate, image display device and antireflective article each equipped with same

The present invention provides a decorative sheet that exhibits excellent scratch resistance under high-load conditions and excellent bending workability; and provides a decorative plate containing the decorative sheet. Specifically, the present invention provides a decorative sheet that contains, in sequence, a first olefin resin layer, a second olefin resin layer, and a surface-protecting layer, wherein indentation hardness Hof the second olefin resin layer and indentation hardness Hof the surface-protecting layer satisfy the following formulas (1) and (2): H≥100 MPa (1), and H>H(2). The invention also provides a decorative plate containing the decorative sheet.

Decorative sheet and decorative panel

According to one embodiment, a wireless tag reading device includes a product placing portion on which a product is placed, an antenna which is installed in a vicinity of the product placing portion and emits radio waves toward a wireless tag attached to the placed product, and an antenna moving mechanism for moving the antenna along a locus of a concave curve.

Wireless tag reading device

A PTFE sheet in which PTFE fibers having a diameter of 1 &#x3bc;m or less are spun, the PTFE sheet having a Gurley value in the range of 1 s/100 cc/into 3 s/100 cc/inand a shrinkage factor in a direction orthogonal to a sheet winding direction of no more than 10% when heated to 300&#xb0; C. The PTFE sheet makes a die adsorbable via a tool, which is for heating the die when the die is mounted on a mounting body, by being sandwiched between the die and the tool, and suppresses the adhesion, to an adsorption surface of the tool or to the die, of an adhesion member for fixing the die to the mounted body. Through this configuration, a PTFE sheet capable of stabilizing vacuum adsorption and improving maintainability and a method for mounting a die are provided.

PTFE sheet and method for mounting die

A bonding apparatus bonds a semiconductor die, which has a first mam surface provided with a bump electrode, to a substrate by means of thermo-compression, with a thermo-compression film being interposed therebetween. The bonding apparatus includes: an intermediate stage that has a die placing surface on which the semiconductor die is placed such that the die placing surface faces the first main surface; and a bonding tool which detachably holds a second main surface of the semiconductor die that is placed on the intermediate stage, the second main surface being on the reverse side of the first main surface. The intermediate stage has a push-up mechanism which applies, to the first main surface of the semiconductor die, a force for separating the semiconductor die therefrom in the normal direction of the die placing surface (in a Z-axis direction).

Bonding apparatus and bonding method

Provided is a method for setting the conditions for heating a semiconductor chip during bonding of the semiconductor chip using an NCF, wherein a heating start temperature and a rate of temperature increase are set on the basis of a viscosity characteristic map that indicates changes in viscosity with respect to temperature of the NCF at various rates of temperature increase and a heating start temperature characteristic map that indicates changes in viscosity with respect to temperature of the NCF when the heating start temperature is changed at the same rate of temperature increase.

Method for setting conditions for heating semiconductor chip during bonding, method for measuring viscosity of non-conductive film, and bonding apparatus

A bonding apparatus and a bonding method are provided. The bonding apparatus bonds a semiconductor die to a substrate by thermocompression through an adhesive material. This bonding apparatus is provided with: a bonding tool which has a bonding surface that holds the semiconductor die through a first portion of a tape, and a pair of first tape constraining surfaces that are arranged so as to sandwich the bonding surface and constrain a second portion of the tape: tape constraining mechanisms which have a second tape constraining surface that presses the tape against the first tape constraining surfaces; and a control part which controls the movements of the bonding tool and the tape constraining mechanisms.

A method of mounting a die includes: preparing a die having a bump formation surface on which a plurality of bump electrodes are formed; disposing a vacuum suction tool having a suction surface above the die such that the suction surface faces toward the bump formation surface; sandwiching a porous sheet between the suction surface and the bump formation surface and suctioning the die by the vacuum suction tool; and mounting the die that has been suctioned by the vacuum suction tool in a bonding region of a substrate with an adhesive material interposed therebetween, the porous sheet having a thickness equal to or greater than the protrusion height of the bump electrodes on the bump formation surface. Stabilization and ease of maintenance of vacuum suction can thereby be improved.

Method of mounting die

A self-service point-of-sale terminal including a cover section having an inverted U-shape open in a front side and a bottom side, a casing that is movable with respect to the cover section and includes a lock configured to fix a relative position of the casing with respect to the cover section, and a coin and bill depositing and dispensing machine housed within the casing.

Self-service point-of-sale terminal

[Problem] To bond an electronic component on a substrate via an adhesive material satisfactorily. [Solution] A bonding devicefor thermally bonding an electronic componentto a substrateor to another electronic component via an adhesive material, the bonding device being provided with: a bonding toolcomprising a bonding distal-end portionwhich includes a bonding surfaceand tapered side surfacesformed in a tapering shape becoming narrower toward the bonding surface, the bonding surfacehaving a first suction holefor suction-attaching the electronic componentvia an individual piece of a porous sheet, the tapered side surfaceshaving second suction holesfor suction-attaching the porous sheet; and a bonding control unitwhich controls the first suction holeand the second suction holesindependently from each other.

A printer includes a main body having a first opening through which a roll of paper can be inserted for installation within the main body and a second opening through which a roll of paper can be inserted for installation within the main body, a first cover configured to open and close the first opening, a second cover configured to open and close the second opening, a printing head attached to the first cover and configured to print an image on paper supplied from the roll of paper, and a roller attached to the second cover and configured to convey the paper from the roll of paper installed within the main body to the printing head. The paper is conveyed by the roller and printing is performed by the printing head when both the first and second covers are closed.

Printer

A label printer according to an embodiment includes a support unit that supports a roll of a backless label paper; a conveying unit that conveys and reverse conveys the backless label paper along a conveying path; a printing unit positioned on the conveying path and including a print head that prints on a surface of the backless label paper; a cutting unit, positioned on the conveying path downstream of the printing unit in a conveying direction, that cuts the backless label paper; and a control unit that controls the conveying unit to reverse convey the backless label paper in a reverse conveying direction after the cutting unit cuts the backless label paper sheet so that a tip of the backless label paper is stopped at a predetermined position downstream from the print head in the conveying direction.

Label printer

The cooling effectiveness of a turbine blade that a gas turbine engine or the like is provided with is further increased by providing a convex portion that is arranged in the inner portion of a cooling air hole and that is provided projecting out from the inner wall surface of the cooling air hole.

Turbine blade

A point-of-sale (POS) terminal includes a main body, a door attached to the main body, an electric lock attached to one of the main body and the door and including a first movable part configured to move between a lock position and an unlock position using electric power, and a manual lock attached to the other one of the main body and the door and including a second movable part that is manually movable between a lock position and an unlock position. When the door is in a closed state and the first and second movable parts are both at the lock position, the first and second movable parts restrict movement of the door. When the door is in the closed state and at least one of the first and second movable parts is at the unlock position, the door is movable.

Point-of-sale (POS) terminal having a lock system

Growing community of inventors

Tokyo, Japan

Osamu Watanabe