Nippondenso Co., Ltd.

Toyota Jidosha Kabushiki Kaisha

Osamu Takenaka

Shigeru Sakamoto

Ichiharu Kondo

Takao Yoneyama

Junichi Takeda

Yasunori Taga

Masami Yamaoka

Hisayoshi Fujikawa

Kenji Kondo

Takeshi Ohwaki

Junji Sugiura

Junji Ishikawa

Masatosi Suzuki

Kazuo Tanaka

Ryoichi Narita

Tetsuya Ogawa

Norihiko Okochi

Toshio Sonobe

Hitoshi Ito

A method and apparatus conduct a performance evaluation test for a vehicle in which an actuator that applies a depressing force to a control member to be operated by a vehicle operator is controlled by a controller. The controller controls the actuator to automatically apply the depressing force to the control member for conducting a performance evaluation test for the vehicle, and changes control of the actuator in accordance with an actual state of the vehicle.

Vehicle performance evaluation test method and apparatus

A method and apparatus for conducting a vehicle performance evaluation test by automatically depressing a control member of the vehicle to be depressed by a vehicle operator uses an actuator of a vehicle performance evaluation test apparatus. The actuator depresses the control member, the actuator having a first end and a second end. The first end of the actuator is fixed to a seat of the vehicle. The second end of the actuator is engaged with the control member of the vehicle. The actuator is caused to exert a depressing force to depress the control member relative to the seat so as to automatically depress the control member.

Disclosed is a nickel layer formed on a substrate by sputtering, in which nickel layer a percent ratio of an X-ray diffraction peak intensity of the (200) plane of the nickel layer to that of the (111) plane of the nickel layer is not less than 10%. This nickel layer has a reduced stress, and therefore, lessens a bending of a substrate. The nickel layer is formed by a process for sputtering nickel on a substrate, comprising supplying an argon gas into a vacuum chamber, adjusting a pressure of the argon gas in the vacuum chamber to a predetermined value, ionizing the argon gas, bombarding a target containing nickel with the ionized argon gas, to sputter nickel atoms, and depositing the sputtered nickel atoms onto the substrate, wherein the predetermined pressure of the argon gas is not lower than 12 mTorr.

Sputter-deposited nickel layer

Surface treated structure for solder joint

A semiconductor element mounted on a substrate is sealed with a silicone gel which has a complex modulus of elasticity such that breakage of solder bumps due to thermal fatique occurs preferentially by shear stress thereto due to a difference between thermal expansion coefficients of the semiconductor element and the substrate, not by tension thereto due to thermal expansion of the silicone gel between the semiconductor element and the substrate.

Semiconductor element sealing structure

A gas composition detector, particularly an oxygen concentration detector includes a metal oxide an electrical resistance or an electromotive force of which is changed by oxygen ions which are conducted in accordance with a difference between an oxygen concentration of gas being examined and an oxygen concentration of a reference gas. A surface of the metal oxide is coated with a conductive metal electrode, and a metal which is the same as or different than the conductive metal penetrates into the metal oxide at the interface of the metal oxide and the conductive metal, whereby the tear-off of the electrode is prevented.

Method for manufacturing gas composition detector

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Kariya, Japan

Osamu Takenaka