Fuji Electric Co., Ltd.

Osamu Sugiyama

Akio Izumi

Nobuo Hirata

Toshio Yamamoto

Hajime FuKamura

Hideo Shimizu

A semiconductor device module is provided that prevents adhesion defects from causing in bonding a semiconductor sensor chip to a sensor stage with an adhesive and improving the reliability thereof. The semiconductor device module includes a sensor stage and a semiconductor optical sensor chip mounted on the sensor stage. The sensor stage includes a U-groove formed in an upper central surface portion of a bottom wall thereof. The sensor chip is bonded to the sensor stage with a thermosetting and UV-curing adhesive coated in the U-groove. The U-groove, includes an island-shaped flat pedestal located at a central bottom portion of the U-groove for mounting the sensor chip thereon. Pins are preferably disposed on both sides of the pedestal to hold the sensor chip horizontally, and the side walls of the U-grooveare preferably slanted such that the adhesive coated in the U-groove is prevented from splashing to the outside.

Semiconductor device module

A semiconductor device in which accuracy in mounting and positioning a semiconductor chip onto a package is improved without being affected by operation of a mounting unit such as a die bonder. The semiconductor device includes a semiconductor chip disposed on a die pad section of the package using guide projections and spring projections provided around the die pad section. The semiconductor chip is die bonded while being aligned with reference to the guide projections.

Semiconductor device

A semiconductor optical sensing apparatus is formed of a casing made of an electrically insulative material and having at least one opening at a bottom portion; a wiring device extending from an inside to an outside of the casing; a semiconductor optical sensor chip bonded to the bottom portion of the casing; and a connecting device for connecting a terminal of the sensor chip and the wiring device. A transparent filler is filled in a space inside the casing to cover the sensor chip, wherein the opening absorbs a volume change of the transparent filler caused by expansion or contraction thereof. A focusing device is connected to the casing and located at a position to focus an image on the sensor chip. The focusing device and casing are made of the same material or materials having substantially same thermal expansion coefficients. The semiconductor apparatus has a simple structure less affected by temperature variations and facilitates preventing deterioration and variation of optical characteristics, elongating life and improving reliability of the apparatus.

Semiconductor optical sensing apparatus with reliable focusing means and casing structure

A range finder includes an improved module structure, that facilitates injecting a transparent filler uniformly into the entire light guide spaces neither leaving any unfilled region nor impairing the characteristics thereof. A channel of flow (or U-groove) is formed across a partition wall, connecting light guide spaces arranged side by side. This feature allows smooth flow of transparent filler into the range finder module without an unfilled region and consequently no overflow of the transparent filler onto outer wall of the plastic module and onto terminal portion of the lead frame. Another feature of this invention is the presence of shield walls along the channel of flow protruding from the side walls of the channel of flow in an inter-digitated fashion, to prevent the stray light from one light guide space entering the other light guide space through the channel of flow.

Range finder structure allowing easier filling of the transparent filler

The range finder measures the distance to the object based on the principle of triangulation, and includes a pair of lenses; a lens supporting frame; a CCD supporting plate; CCD packages supported by the plate; and temperature sensors. One sensor is positioned on the frame between the lenses, and the other is positioned on the plate between the CCD packages. Each CCD package includes a CCD chip located at a focal plane of the lens, a casing and a transparent plate. The lenses, frame, casing and transparent plates are made of the same plastic material so that the thermal expansion of the entire range finder caused by the temperature change may not affect to the distance measurement. Bonding ribs connected to the transparent plate are located near an image ray hole to face each other and on the line perpendicular to the optical axis of the CCD chip and the plane containing the optical axes of the CCD chips. Therefore, the thermal deformation of the transparent plate in the base line direction of the range finder may not affect significantly. The range finder of the invention can reduce the distance measurement error caused by nonuniform thermal deformations of the parts.

Thermal deformation compensating range finder

A measuring instrument is formed of an image pickup device having a pair of image-forming lenses and photosensor arrays; and an arithmetic device using two images of a measured object photographed by the image pickup device to calculate the distance to the object based on the principle of triangulation. The image-forming lenses, a first holding member for the image-forming lenses and a second holding member for the photosensor arrays are formed of the same plastic material without hygroscopicity. Changes in size of the measuring instrument by ambient temperature and humidity are prevented to increase distant measurement accuracy.

Distance measuring instrument

A distance measuring apparatus of the invention includes an arithmetic operation device which uses the degree of shift detected when the distance to a reference object is measured and a known distance to the reference object, to determine the difference between the offsets of image-forming positions on optical sensor arrays caused by a windshield present between a measuring object and the optical sensor arrays. The arithmetic operation device uses the difference between the offsets of the image-forming positions, an optical characteristic amount of the image-forming lenses, and the amount of shift detected when the distance to the measuring object is measured, to determine the distance to the measuring object.

Growing community of inventors

Nagano, Japan

Osamu Sugiyama