Hoya Corporation

Honda Kosan Co., Ltd.

Shinto Chemitron Co., Ltd.

Osamu Sugihara

Kazuaki Hashimoto

Tameyuki Suzuki

Junichi Yasukawa

Hiroshi Masuda

Mitsugu Imai

Shogo Tsukazaki

Toshio Mitsuhara

Toshiaki Ohta

An ion-exchanged glass article manufacturing method includes an ion-exchange step of bringing a glass article with a composition containing Li into contact with a molten salt dissolved solution containing an alkali metal element having an ionic radius larger than an ionic radius of the Li contained in the glass article, thereby ion-exchanging the Li in the glass article with the alkali metal element in the molten salt dissolved solution. At least one kind of additive selected from the group consisting of NaF, KF, KAlF, NaCO, NaHCO, KCO, KHCO, NaSO, KSO, KAl(SO), NaPO, and KPOis added to the molten salt dissolved solution so that the ion-exchange step is carried out while the additive is in a solid state.

Method of manufacturing an ion-exchanged glass article

A contacting component has a probe contact formed by plating and adapted to be contacted with a target portion. The contacting component includes an insulating substrate, a conductive circuit formed on one surface of the insulating substrate, and the probe contact is made of a conductive material and formed on the other surface of the insulating substrate. The conductive circuit and the probe contact are electrically connected in a through hole penetrating the insulating substrate. The probe contact includes a bump contact of a convex shape, the bump contact is formed by plating and having a surface which has a shape of a semispherical protrusion to be contacted with the target portion. The bump contact is made of a material containing a metal and carbon, the content of carbon falling within a range between 0.2 at % and 1.2 at %, both inclusive.

Contacting component, method of producing the same, and test tool having the contacting component

Polycrystalline contacting component and test tool having the contacting component

A server and data stored in a memory element or a storage medium can be protected from harmful electromagnetic waves from the outside. Shield fingers are arranged along the circumferences of openings of a front doorof an upper main bodyhousing servers and a router in an internal space. In addition, a shield finger is arranged along the circumference of an opening of a lower front doorof a lower main body housing a main body of an electric circuit component such as filter. The main bodies and the doors are made of steel and have predetermined thicknesses (40 mm in a bent portion and 21 mm in other portions). In addition, an optical fiber is used as a data line, which is led in an internal spaceof the upper main body through a conduit

Server rack

In a method of manufacturing a contact element, provision is made of a laminated body which has an insulating film, an electrically conductive layer stacked on the insulating film, and bump holes opened. A treatment is carried out so as to remove organic materials and the like from an interior of the bump holes and/or a surface of the insulating film before bumps are formed on the bump holes. The treatment may be a plasma treatment or an X-ray irradiation.

Method of manufacturing a contract element and a multi-layered wiring substrate, and wafer batch contact board

Multilayer wiring board, manufacturing method thereof, and wafer block contact board

In a method of manufacturing a contact element, provision is made of a laminated body which has an insulating film, an electrically conductive layer stacked on the insulating film, and bump holes opened. A treatment is carried out so as to removen organic materials and the like from an interior of the bump holes and/or a surface of the insulating film before bumps are formed on the bump holes. The treatment may be a plasma treatment or an X-ray irradiation.

Method of manufacturing a contact element and a multi-layered wiring substrate, and wafer batch contact board

Disclosed is a microprobe-provided circuit substrate for use as a probe assembly or the like, and a method for producing the same. The microprobes in the circuit substrate are constituted by pillar-shaped conductors provided in respective fine through holes formed in a base and having one ends projected out of the respective fine through holes. The circuit substrate having microprobes of such a structure as described above can be produced by the method for producing a microprobe-provided circuit substrate in which pillar-shaped conductors as precursors of microprobes are provided by an electroless plating method or the like in fine through holes formed in a base by a photographic method or the like, and then the microprobes are formed by projecting one ends of the respective pillar-shaped conductors out of a surface of the base by etching treatment or the like. Thus, it is possible to eliminate difficulties in fining microprobes, in positioning the respective microprobes accurately, in diversifying the arrangement of the microprobes, and the like, which are caused by the conventional process of producing a circuit substrate by manually fixing electrically conductive metals as precursors of microprobes at predetermined positions on a base.

Microprobe provided circuit substrate and method for producing the same

A probe assembly for testing semiconductor wafer chips includes microprobes embedded in a circuit substrate. The microprobes are pillar-shaped conductors formed in through holes in a base of the substrate. One end of the microprobe is flush with the base surface contacts and is electrically connected through a reinforcing substrate to a probe assembly test head which generates various test signals. The other end of the pillar-shaped microprobes projects beyond the base to make contact with and deliver test signals to various electrodes of a chip to be tested.

The present invention relates to a process for producing a transparent substrate having thereon transparent conductive pattern elements separated by a light-shielding insulating film, as well as to a process for producing a surface-colored material by utilizing said process.

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Tokyo, Japan

Osamu Sugihara