Tokyo Electron Limited

Other

Taisei Corporation

Nichias Co., Ltd.

Osamu Suenaga

Sadao Kobayashi

Tadahiro Ohmi

Naoki Mori

Wataru Okase

Takenobu Matsuo

Makoto Yamamoto

Koji Suzuki

Yoshihide Wakayama

Kiyoshi Komiyama

Isao Terada

Kaoru Fujihara

Hiromu Itoh

Yuji Matumura

Akitoshi Tsuji

Hiromu Ito

Kazuo Yamamoto

Minoru Tanaka

Power consumption of electric equipment used in a semiconductor manufacturing apparatus () is obtained and the total amount is displayed as calories by a display means. The semiconductor manufacturing apparatus is configured so that the equipment is set up inside a housing (). The amount of heat discharged from the inside to the outside (a clean room) via the housing is obtained, and further, the amount of heat removed by exhaust from the interior of the housing and the amount of heat removed by cooling water that cools the equipment is also obtained, and the total amount of heat is displayed. Additionally, factors pertaining to operating costs such as power consumption are measured and their cost obtained, the amount of power consumed is multiplied by a crude oil conversion coefficient to obtain the amount of COgenerated, and the result is displayed. The factors to be measured are measured by a thermocouple, an anemometer and an power meter, and the measurements are input to a personal computer () via a conversion module ().

Managing apparatus and managing method of a semiconductor manufacturing apparatus

A method of cleaning air, including a humidifying operation for humidifying the air containing chemical contaminants by a humidifier and taking a part of the gaseous contaminants in the air into excessive moisture to remove the contaminants from the air, and a dehumidifying operation for dehumidifying the humidified air by a condenser and taking the gaseous chemical contaminants remaining, without being removed, in the humidifying operation into condensed water for removal. By using an oblique honeycomb having both front and rear faces and both upper and lower faces disposed in open state, air is led from the front opening part of the oblique honeycomb and water is fed from the upper opening part thereof to one or both of the humidifier and condenser.

Method and device for cleaning air

A thermal insulator can change a heat insulation characteristic partially with a simple structure. The thermal insulator is divided into a plurality of parts in accordance with a temperature of a heat source which is insulated by the thermal insulator. The plurality of parts are formed of different honeycomb structures, respectively, so as to provide different heat insulation characteristics. The plurality of parts may be formed by different materials, or a shape or dimension such as a cell pitch of the honeycomb structure may be varied. Heat is collected from air within the honeycomb cells, and is transferred to other parts for heating.

Thermal insulator having a honeycomb structure and heat recycle system using the thermal insulator

A semiconductor manufacturing facility has a proper strength and an anti-vibration effect. The semiconductor facility contains processing apparatuses, installation tables and an installation floor. An apparatus having a vibration source is installed on an installation table having a rigid structure. The installation table is installed on the installation floor having a floor construction including a plurality of columns, which support a floor member extending in horizontal directions. An interval of the columns is 4 m to 12 m.

Semiconductor manufacturing facility and a semiconductor manufacturing method

An air-supply machine cleans outside air. The cleaned outside air is dehumidified by cooling by performing heat exchange between the cleaned outside air and an exhaust air from a lithography apparatus by a first heat-pipe. The dehumidified outside air is heated by performing heat treatment between the dehumidified outside air and an exhaust air from a vertical heat treatment apparatus by a second heat-pipe. The heated outside air is supplied to inside the housing of the vertical heat treatment apparatus. Thereby, the consumption of air in the clean room is reduced and the running cost of the clean room is reduced.

Device and method for feeding treating air

An amount of energy consumption in a semiconductor fabrication facility can be reduced by using cooling water drained from a semiconductor fabrication apparatus as a heat source of another semiconductor fabrication apparatus. Cooling water of 80&deg; C. drained from a heating furnace of a heat processing apparatus ( ) is supplied to a deionized water heating apparatus ( ) of a cleaning apparatus ( ). The deionized water heating apparatus ( ) raises a temperature of deionized water of a room temperature to 60&deg; C. through heat exchange with the cooling water of 80&deg; C. The cooling water, whose temperature falls to 30&deg; C. after the heat exchange, is reutilized for cooling of the heating furnace ( ).

System and method for utilization of waste heat of semiconductor equipment and heat exchanger used for utilization of waste heat of semiconductor equipment

A heat exchange section ( ) is provided in the middle of a circulation water path ( ) connecting between a temperature-controlled water tank ( ) and a semiconductor manufacturing apparatus body ( ) so as to perform a heat exchange with air of a clean room ( ). The heat exchange section ( ) is installed near an exit of an air circulation path ( ) above a fan-filter unit ( ) of the clean room as a temperature stabilized area off an atmosphere of the clean room ( ). Additionally, as another method, a temperature of a chemical fluid from a chemical fluid tank ( ) is controlled to be a temperature of the air in the clean room by a heat exchange section ( ) provided in a location the same as above without using the temperature-controlled water so as to supply the chemical fluid to the semiconductor manufacturing apparatus body ( ).

Device and method for manufacturing semiconductor

A semiconductor manufacturing facility is provided, which can reduce a thermal load in a clean room and reduce an amount of energy thereof. Semiconductor manufacturing equipment, which generates heat when it is used, is installed in the clean room and is covered by a housing. The housing is configured to be capable of introducing the air inside the clean room into an interior thereof. The air inside the housing is exhausted outside the clean room through a plurality of exhaust passage members. A heat insulating material is associated with the housing to reduce the release of heat from the housing to the air inside the clean room. A space between the housing and the semiconductor manufacturing equipment may be hermetically sealed, and an air introducing member may be connected to the housing to take air outside the clean room into the hermetically sealed space.

Semiconductor manufacturing facility, semiconductor manufacturing apparatus and semiconductor manufacturing method

A heat generating part ( ) of semiconductor manufacturing equipment is cooled by cooling water. An inner fluid passage ( ) having an inlet port ( ) of the cooling water on a vertically lower portion thereof is formed so as to surround a periphery of the heat generating part ( ). An outer fluid passage ( ) having an outlet port ( ) of the cooling water on a vertically upper portion thereof is formed so as to surround a periphery of the inner fluid passage ( ) and be capable of exchanging heat with the cooling water in the inner fluid passage. A communication passage ( ) is provided to connect a vertically upper portion of said inner fluid passage and a vertically lower portion of said outer fluid passage. The cooling water flowing out of the outlet port ( ) of the outer fluid passage ( ) is supplied to the inlet port ( ) of the inner fluid passage ( ).

A cooling jacket unit ( ) is provided to a periphery of a heating furnace of a heat treatment apparatus. A cooling unit has a double water jacket comprising an inner fluid passage ( ) and an outer fluid passage ( ), and cooling water supplied to the outer fluid passage exits from the inner fluid passage. The temperatures of the inlet port and the outlet port of the cooling jacket unit ( ) are set to, for example, 40&deg; C. and 85&deg; C., respectively, and the cooling water (warmed exhaust water) from the outlet port is supplied to a heat recovery part ( ). Heat is recovered from the cooling water by the heat recovery part ( , and the recovered heat is reused for heating a boiler water and the like. The warmed exhaust water from which the heat is recovered is supplied again to the cooling jacket unit ( ) as the cooling water.

Growing community of inventors

Nirasaki, Japan

Osamu Suenaga