Asahi Kasei Microdevices Corporation

Osamu Shirata

Yusuke Hidaka

Semiconductor module

To achieve a size reduction of a semiconductor package while securing stability in mounting. Three terminals t, t, and tare individually arranged on a semiconductor packagehaving a rectangular shape as viewed in plan in such a manner that the center in the longitudinal direction of the semiconductor packageof each of the three terminals t, t, and tand the center in the longitudinal direction of each of the other terminals are not overlapped with each other as viewed from the side of the long side. The terminal tand the other terminals tand tare arranged in such a manner that the terminal tand the other terminals tand tare present on mutually different sides across a line segment M passing through the center in the width direction, an angle θ formed by two line segments connecting the center of gravity of the terminal t, the position in the longitudinal direction of which is the center, and the center of gravity of each of the other terminals tand tis 60° or more, and a width Lof the semiconductor packageand a distance Lt between the rightmost end position of the terminal tarranged at the rightmost end in the width direction of the semiconductor packageand the leftmost end position of the terminal tor tarranged at the leftmost position in the width direction satisfy Lt/L≥0.5.

Semiconductor package and camera module

To achieve a size reduction of a semiconductor package while securing stability in mounting. Three terminals t, t, and tare individually arranged on a semiconductor packagehaving a rectangular shape as viewed in plan in such a manner that the center in the longitudinal direction of the semiconductor packageof each of the three terminals t, t, and tand the center in the longitudinal direction of each of the other terminals are not overlapped with each other as viewed from the side of the long side. The terminal tand the other terminals tand tare arranged in such a manner that the terminal tand the other terminals tand tare present on mutually different sides across a line segment M passing through the center in the width direction, an angle &#x3b8; formed by two line segments connecting the center of gravity of the terminal t, the position in the longitudinal direction of which is the center, and the center of gravity of each of the other terminals tand tis 60&#xb0; or more, and a width Lof the semiconductor packageand a distance Lt between the rightmost end position of the terminal tarranged at the rightmost end in the width direction of the semiconductor packageand the leftmost end position of the terminal tor tarranged at the leftmost position in the width direction satisfy Lt/L1&#x2265;0.5.

To achieve a size reduction of a semiconductor package while securing stability in mounting. Three terminals t, t, and tare individually arranged on a semiconductor packagehaving a rectangular shape as viewed in plan in such a manner that the center in the longitudinal direction of the semiconductor packageof each of the three terminals t, t, and tand the center in the longitudinal direction of each of the other terminals are not overlapped with each other as viewed from the side of the long side. The terminal tand the other terminals tand tare arranged in such a manner that the terminal tand the other terminals tand tare present on mutually different sides across a line segment M passing through the center in the width direction, an angle &#x3b8; formed by two line segments connecting the center of gravity of the terminal t, the position in the longitudinal direction of which is the center, and the center of gravity of each of the other terminals tand tis 60&#xb0; or more, and a width Lof the semiconductor packageand a distance Lt between the rightmost end position of the terminal tarranged at the rightmost end in the width direction of the semiconductor packageand the leftmost end position of the terminal tor tarranged at the leftmost position in the width direction satisfy Lt/L&#x2264;0.5.

Growing community of inventors

Tokyo, Japan

Osamu Shirata