Alps Electric Co., Ltd.

Osamu Sakai

Keiji Takagi

Takeshi Watanabe

Minoru Hirota

Paste comprising metallic organic compound, in particular, gold-based metallic organic compound is used as a conductive material for repairing open defects in a metal pattern. After applying the paste, the paste is baked to deposit a metal film. This can produce a very thin metallic film having low electric resistance. Further, a semiconductor laser is used as a heating unit to heat only the paste applied to the open defect. A heating profile having a multi-step baking process includes a provisional baking and main baking process followed by a cooling process to produce a high-quality thin metallic film having no cracks and a dense texture.

Substrate having repaired metallic pattern and method and device for repairing metallic pattern on substrate

Paste comprising metallic organic compound, in particular, gold-based metallic organic compound is used as a conductive material for repairing the broken defective part and is baked. This can produce a very thin metallic film having low electric resistance. Further, a semiconductor laser is used as a heating unit to heat only the broken defective part, and a heating profile having a baking process of provisional baking and main baking and a cooling process is provided to produce the high-quality thin metallic film having no crack and a dense texture.

A coordinate input device including a flexible upper substrate mounted on a rigid lower substrate and having a centrally-located input operating portion. The upper substrate includes a first resistance layer laminated thereon and X-axis electrodes formed on the first resistance layer on opposite sides of the input operating portion. The lower substrate includes a second resistance layer laminated thereon and Y-axis electrodes formed on the second resistance layer on opposite sides of the input operating portion. A spacer group is mounted between the upper and lower substrates to maintain a predetermined clearance, with spacers of the spacer group being having a height of 4 .mu.m or less, and being arranged at a pitch in the range of 0.3 to 1.0 mm. A position detecting circuit is provided for locating a depressed portion of the upper substrate by measuring a change in voltage caused by contact between the first and second resistance layers. A method is also provided for making the coordinate input device.

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Miyagi-ken, Japan

Osamu Sakai