Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Panasonic Intellectual Property Management Co., Ltd.

Osamu Okuda

Akira Kabeshita

Naoyuki Kitamura

Hiroshi Uchiyama

Yoshihiro Yoshida

Noriaki Yoshida

Naoto Mimura

Takeyuki Kawase

Satoshi Shida

Yoshihiro Mimura

Wataru Hirai

Kazuo Mori

Nobuyuki Kakita

Makoto Sueki

Yoichi Tanaka

Yuzuru Inaba

Kazunobu Sakai

Eyri Watari

Hiroshi Furuya

Minoru Yamamoto

Tadashi Endo

Shigeki Imafuku

Hideki Uchida

Kazuo Kido

Takashi Yazawa

Muneyoshi Fujiwara

Hirofumi Obara

Atsushi Tanabe

Hirokazu Honkawa

Kazunori Kanai

Takanori Yoshitake

Toshiyuki Kino

Haneo Iwamoto

Yuji Tanaka

Tomoyuki Nakano

Kazuhide Nagao

Takeshi Takeda

Mamoru Inoue

Kazuhiko Narikiyo

Takahiro Noda

Seiichi Mogi

Takahiro Kurokawa

Shiro Oji

Youichi Tanaka

Koji Odera

Akira Noudo

Tetsutarou Hachimura

Akiko Ida

Hideaki Katou

Kanji Uchida

Tomio Tanaka

Hiroshi Ogata

Izumi Miura

Hiroyoshi Saitoh

Kazuyuki Yoshidomi

Tetsutaro Hachimura

Hiroharu Tokunaga

A nozzle holder that detachably holds a nozzle in a lower end portion of a main shaft is configured to have a tubular shape having an insertion hole into which an installed portion of the nozzle is inserted, and to include a holder tube portion in which an opening portion leading to the insertion hole is formed on one side surface of the holder tube portion, a clamp lever which has an engaging portion engaged via the opening portion with the installed portion of the nozzle inserted into the insertion hole, and a clamp spring which biases the engaging portion to the installed portion of the nozzle inserted into the insertion hole.

Electronic component installing device

A component placing device has a configuration where a plurality of nozzle shafts are moved in turn to a plurality of stations including a component holding and placing station and a component detecting station by rotating a rotating object having the plurality of nozzle shafts, in which nozzles are installed, about a rotation axis. A configuration where a flow path switcher, which selectively connects a suction path of each of the nozzles to a positive pressure source and to a negative pressure source by movement of a spool, is disposed on an inside of a corresponding one of the nozzle shafts, and air for power to drive the spool is supplied to the rotating object via a manifold, in which a communication plug for power air that comes into contact with an exterior surface of the rotating object is provided, is adopted.

Component placing device and component placing method

A nozzle holder is configured to include an insertion hole for inserting and storing a cartridge from an entrance thereof, a tubular holder tube portion having a vent hole for introducing a negative pressure into the insertion hole, and a clamp lever in which an engaging portion engaged with an engaged portion of the nozzle inserted into the insertion hole in a state where the entrance of the insertion hole is blocked, is formed. Accordingly, when the nozzle is detached from the nozzle holder, the clamp lever prevents the cartridge from coming off the insertion hole by being displaced toward the insertion hole.

Electronic component installing device and cartridge for electronic component installing device

A component mounter includes: a nozzle having a nozzle main body and a reflecting part provided behind the nozzle main body and reflecting light from the front, the nozzle main body including a greatest outer periphery section provided to a front section of the nozzle main body, and the greatest outer periphery section of an outer periphery of the nozzle main body provided in front on the reflecting part; a first illuminating unit provided in front of the reflecting part and illuminating the reflecting part from the front with light; and an imaging unit provided in front of the nozzle and capturing the greatest outer periphery section positioned in front of the nozzle main body, using the light from the first illuminating light and reflected off the reflecting part.

Component mounting position correcting method

A problem that the present invention is to solve is to provide a parts mounting related work device which can prevent the occurrence of an unexpected operation failure and an erroneous stopping of the whole system which are attributed to an error in combination of working head and working equipment. A storage part () stores combinations of types of working heads (H) and types of working equipment (E) which correspond to contents of work that is performed on a board (PB), and a determination part () determines whether or not the combination of the type of the working head (H) which is currently detected by a head type detector and the type of the working equipment which is currently detected by an equipment type detector coincides with any of combinations stored in the storage part (). An action restriction part () restricts a moving action of a moving stage () by an action control part () in case the determination part () determines that the combination of the type of the working head (H) which is currently attached to the moving stage () and the type of the working equipment which is currently mounted in a base platform () coincides with non of the combinations stored in the storage part ().

Parts mounting related work device

In an electronic component mounting apparatus that is used in an electronic component mounting line for producing a mounted substrate by mounting electronic components on a substrate and that subjects the substrate to predetermined operation, a working unit attachment sectionis provided within a range of movement of a working head, such as a loading head and a paste coating head, wherein a nozzle stockerand a paste trial coating unitcan be removably attached as a working unit for performing specific additional operation appropriate for working function of the working head. The nozzle stokerand the paste trial coating unitare attached to the working unit attachment sectionaccording to the type of working head.

Electronic component mounting apparatus

There is provided a paste application device which can solve problems of an increased exclusively occupied space attributed to an arrangement of a syringe and of deterioration of a tube. In a paste application unit(a paste application device) for applying a pastestored in a syringeto an application target material, a configuration is adopted in which a pump mechanismfor sending the pasteunder pressure is formed by causing a discharge thread portionprovided at a lower portion of a rotary memberto rotate about an axis AX within a discharge spaceprovided in a casing portion, in which a discharge port, which communicates with the discharge space, is provided at an end portion of the casing portion, and in which the syringeis disposed coaxially with the rotary memberfor detachable connection thereto. By adopting this configuration, the problems can be solved of the increased exclusively occupied space that would occur when the syringeis disposed in parallel to the pump mechanismand of deterioration of the tube.

Paste application device

There is provided a control means for controlling movement positions and movement timings of a nozzle elevating means and a nozzle moving means. The control means stores positions and heights of obstacles located between a component supply unit and a circuit board in advance. The control means moves down a nozzle in sync with the time when the nozzle has finished passing over each obstacle after an electronic component has been photographed by a component camera. Alternatively, the control means moves the nozzle in a path to avoid the obstacles. In addition, in a component mounting region, the nozzle moves at a component mounting region movement height and the component is mounted by the nozzle moved down from the component mounting region movement height. Accordingly, it is possible to shorten an elevating stroke of the nozzle (). In addition, the nozzle can be elevated in an arc trajectory.

Component mounting method

A method by which the height of an electronic component sucked and held by a nozzle can be detected with high accuracy and high efficiency is a component height measurement method applied to a mounter () equipped with a transfer head () having a component-sucking-and-holding nozzle (), for transferring a component P and mounting the component P onto a board (), and includes: lowering the component P to within the high-accuracy range of a first line sensor () for measuring the height of the component P; and measuring the height of the component P using the first line sensor ().

Electronic component mounter and mounting method

For determining the types of component holding members equipped to a plurality of holding-member equipping sections, a detection sensor having a detection optical axis in a direction intersecting with the arrayed direction of the respective holding-member equipping sections is used, and the respective holding-member equipping sections have a first detection position where interrupting of the detection optical axis is detectable only when a second component holding member is equipped and a second detection position where interrupting of the detection optical axis is detectable when the component holding member of any type is equipped. Consequently, by sequentially positioning the detection optical axis at the respective detection positions and detecting the presence of interrupting, the type of the equipped component holding member is determined only by the detection sensor.

Component mounting apparatus and method for determining component holding members

In estimating a curved surface model by approximating the shape of the board surface of a circuit board, auxiliary measurement spots are set other than measurement spots on the board surface, eligibility as a sampling displacement magnitude in estimating a curved surface model is determined according to a difference in a displacement magnitude from a work reference surface. When the sampling displacement magnitude is determined to be ineligible, a new measurement spot is reset. By this operation, a local increase and decrease in the displacement magnitude due to a discontinuity of the board surface exerts no influence on the estimation of the curved surface model, and the curved surface model approximated more closely to the shape of the actual board surface is estimated, leading to an improvement in the work quality with the working height adjusted to the proper height.

Working apparatus and working method for circuit board

A component placing method uses a first component image-pickup unit capable of capturing an image of a component held by a component holding member from a direction along central axes of the component holding members, and a second component image-pickup unit capable of capturing an image of the held component from a direction generally orthogonal to the central axes of the component holding members, the images of the component are captured by the first component image-pickup unit and the second component image-pickup unit from the two directions generally orthogonal to each other, and holding postures of the components are recognized on the basis of the images.

Component placing method

An X-Y robot having a structure that linearly deforms along an X-axis direction and a Y-axis direction, a camera reference mark, and a control unit are provided. The X-Y robot causes no displacement of warp or the like and linearly deforms along only the X-axis direction and the Y-axis direction even if heat takes effect due to continuous operation. Therefore, if the amount of expansion and contraction of the X-Y robot due to heat is obtained by picking-up an image of the camera reference mark by a board recognition camera and the component placing position is corrected on the basis of the amount of expansion and contraction, then an electronic component can be mounted in a prescribed position or almost in the prescribed position.

When two mounting units for performing a series of component mounting operations constituted of component holding, component recognition, and component placing are arranged, operational control is executed so that, while a component recognition or board recognition operation is performed in either one of the two mounting units, the component placing or component holding operation is not performed in the other of the mounting units.

An object of the present invention is to provide a component mounting apparatus and a component mounting method in which a movement time of a nozzle can be shortened so that production efficiency can be improved. There is provided a control means for controlling movement positions and movement timings of a nozzle elevating means and a nozzle moving means. The control means stores positions and heights of obstacles located between a component supply unit and a circuit board in advance. The control means moves down a nozzle in sync with the time when the nozzle has finished passing over each obstacle after an electronic component has been photographed by a component camera. Alternatively, the control means moves the nozzle in a path to avoid the obstacles. In addition, in a component mounting region, the nozzle moves at a component mounting region movement height and the component is mounted by the nozzle moved down from the component mounting region movement height. Accordingly, it is possible to shorten an elevating stroke of the nozzle (). In addition, the nozzle can be elevated in an arc trajectory.

Device for mounting component

Growing community of inventors

Yamanashi, Japan

Osamu Okuda