Anelva Corporation

Bridgestone Corporation

Taiyo Yuden Co., Ltd.

Osamu Okada

Atsushi Sekiguchi

Takashi Ishiguro

Naruhiko Mashita

Akiko Kobayashi

Toshiki Takizawa

Tomoaki Koide

Hiroshi Tsutagaya

Shinya Kusumi

Ko Sang Tae

A radio wave absorber that can be bonded securely to a flexible cable or a flexible printed circuit board eliminates the need for a release film. A radio wave absorber comprising a thermosetting adhesive sheetthat is cured into a flexible material, and a Sendust-containing curable resin composition layerthat is cured into a flexible material, wherein the curable resin composition layer is formed on either surface of the thermosetting adhesive sheet. The average particle diameter of Sendust is in the range of 30 to 100 &#x3bc;m. The content ratio of Sendust in the curable resin composition layer is in the range of 50 to 85 wt %.

Radio wave absorber

In the field of depositing a metal film for wiring purposes on a substrate by means of single-substrate processing CVD, a procedure for depositing a copper film on a substrate is carried out by utilizing a first CVD module in which film deposition is carried out under first film deposition conditions where the film deposition rate is low and the filling characteristics are good, and a second CVD module in which film deposition is carried out under second film deposition conditions where the film deposition rate is high and the filling characteristics are poor. One CVD film deposition process in which a metal film for wiring purposes is deposited is carried out with sub-processes based on two different sets of film deposition conditions.

Single substrate processing CVD procedure for depositing a metal film using first and second CVD processes in first and second process chambers

A method of cleaning metallic films built up within a thin film deposition apparatus is disclosed. The method includes an oxidation step to oxidize the metallic film and produce a film of the oxide thereof, a complexing step to complex the oxide film and produce a complex thereof, and a sublimation step to sublimate the complex. The conditions of these cleaning steps are set so that the oxidation step is the rate-determining step.

Method of cleaning metallic films built up within thin film deposition

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Yokohama, Japan

Osamu Okada