Mitsui Toatsu Chemicals, Incorporated

Osamu Narimatsu

Kazuyoshi Komatsu

Yasuo Takemura

Michiyasu Ito

Yoko Takeuchi

Yasuhiro Shibata

Mitsunobu Fujita

Toshirou Ryuno

Susumu Waki

Masayuki Makihara

Toshiyuki Konishi

The present invention provides a method for polishing the surface of the transparent substrate layer of a color filter unit comprising a transparent substrate layer, a color filter layer, a protective film layer and a transparent electrode layer, which method comprises attaching, to the surface of the transparent electrode layer, a pressure-sensitive tape consisting of a base film layer and a pressure-sensitive adhesive layer giving substantially no staining to said surface of the transparent electrode layer, formed on one surface of the base film layer, as well as a pressure-sensitive tape used in the method. When the surface of the transparent substrate layer is polished according to the present method, there occurs no breakage of the color filter unit. Further, there occurs no staining of the surface of the transparent electrode layer owing to the adhesion of residual pressure-sensitive adhesive, abrasive, polishing refuse, etc. Consequently, a color filter unit giving a good image clearness can be obtained at high productivity.

Method for polishing surface of transparent substrate layer of color

Wafer processing films

The present invention provides a water processing film fitted on one side of the base film with a pressure-sensitive adhesive layer and further with a release film on the surface of the pressure-sensitive adhesive layer, and coated on the back side of the base film a phosphoric surfactant wherein ionic components are not detected by ion chromatography, and can prevent failure of an integrated circuit dye static electricity generated in the handling of the wafer processing film and can also inhibit contamination and corrosion of the wafer by surfactant.

Wafer processing film

The present invention relates to a container for an integrated circuit wafer comprising a tray-shaped member having a recess and a complimentary sheet member sized to attach to and cover said recess, at least one of said members being made from a material selected from the group consisting of a single layer of a high nitrile resin, and a laminated layer of a high nitrile resin, a polyvinylidene chloride resin, an ethylene vinyl alcohol copolymer or a polyvinyl alcohol resin, and a method for storing the wafer.

Method of packaging an integrated circuit in an inert gas

This invention provides a wafer processing film comprising a base film having a Shore D hardness of 40 or less and an adhesive layer disposed on one surface of the base film. In grinding the surfaces of wafers such as silicon and similar wafers, breakage can be prevented by affixing the wafers to the adhesive layer of the processing film and then grinding them.

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Nagoya, Japan

Osamu Narimatsu