Matsushita Electric Industrial Co., Ltd.

Osamu Nakao

Makoto Imanishi

Masanori Yasutake

Akihiro Yamamoto

Shinji Kanayama

Takeshi Takeda

Toshihiko Tsujikawa

Takahiro Yonezawa

Kazuhiro Ikurumi

Kenji Okamoto

Masaharu Tsujimura

Kenji Takahashi

Akira Kabeshita

Satoshi Shida

Noriaki Yoshida

Wataru Hirai

Koichi Yoshida

Shinzo Eguchi

Makoto Kawai

Akira Shiomi

The component handling tool ( ) is moved linearly up and down on a moving mechanism ( ) by feedback control of a linear motor ( ) for performing pickup and mounting actions of components ( ). The linear motor is controlled to effect a downward movement of the component handling tool for bringing the component handling tool or the component held thereby closer to the component or to a mounting object, and upon detecting changes in control information when contact is made with the component or the mounting object, control of the linear motor is switched to a pressing operation, whereby the holding or mounting of the component in a prescribed pressed condition is accomplished.

Component mounting method and apparatus

A motion of a printed circuit board ( ) is detected by an encoder ( ) arranged aside a belt conveyer ( ), and the encoder generates a detection signal (S ) which activates a timing signal generator unit ( ) for generating an image pickup start timing signal which is fed to a time measuring unit ( ) for measuring the image storing time which corresponds to the time interval of the image pickup start signal (S ). According to the image storing time, the image signal (S ) generated by the line CCD camera ( ) is normalized by the normalizing calculation means ( ), and thereafter, the mounting condition of the printed circuit board is judged by the image recognizing section (B) with the use of the image data (D) to thereby realize a simple and convenient mechanism at a low cost and at a high precision.

System for inspecting an apparatus of a printed circuit board

A method of controlling a mounting unit having a shaft operated under servo control using a current driven actuator, comprises the steps of detecting interrruption of the servo control, and switching from a positioning control mode to a constant current control mode for supplying an constant amount of current to the shaft actuator to suspend the shaft. In an embodiment the method further includes engaging a gripping device, for holding the shaft, so as to keep the shaft from free-falling when interruption of the servo control is detected, and maintaining the constant current control mode at least until the gripping device grips the shaft. Still further, the current control mode optionally includes the steps of maintaining the supply of the constant amount of current for a predetermined period of time, and disengaging power supplied to the actuator after the predetermined period of time has elapsed.

Electronic component mounting method

A motion of a printed circuit board (1) is detected by an encoder (4) arranged aside a belt conveyer (2), and the encoder generates a detection signal (S.sub.3) which activates a timing signal generator unit (5) for generating an image pickup start timing signal which is fed to a time measuring unit (6) for measuring the image storing time which corresponds to the time interval of the image pickup start signal (S1). According to the image storing time, the image signal (S2) generated by the line CCD camera (3) is normalized by the normalizing calculation means (7), and thereafter, the mounting condition of the printed circuit board is judged by the image recognizing section (B) with the use of the image data (D) to thereby realize a simple and convenient mechanism at a low cost and at a high precision.

System for inspecting an appearance of a printed circuit board

The present invention provides a bump bonding method that can prevent bumps from being inappropriately shaped. The bump bonding method comprises forming a gold ball (16) at the tip of a gold wire (1) that is inserted through a capillary (3), lowering the capillary (3) while using a displacement detection sensor to detect the vertical displacement of the capillary (3), detecting the position of that portion of an IC (11) in which an electrode is formed, based on the displacement of the capillary (3) detected by the displacement detection sensor when the gold ball (16) abuts the IC (11), pressing he gold ball (16) against the electrode forming portion to form a bump pedestal (17), elevating the capillary (3) a specified amount while moving it in the horizontal direction a specified amount, setting the height S of a position at which the capillary (3) is stopped based on the height H1 of the bump pedestal (17) detected by the displacement detection sensor, again lowering the capillary (3) down to the stop position height S to join the gold wire (1) to the bump pedestal (17), and then lifting the gold wire (1) to break the joint between the bump pedestal (17) and the gold wire (1).

Bump bonding method and bump bonding apparatus

A bump leveling method and a bump leveling apparatus in which the leveled height of bumps can be made constant and meet the change in thickness of an IC chip. A pressing force under which one bump is deformed to a prescribed height is measured. Thus, the pressing force under which a plurality of bumps can be deformed and leveled can be set. A load cell detects that a prescribed pressing force is exerted on the bumps and this pressing force is maintained, so that the plurality of bumps can be leveled up to the same prescribed height.

Bump levelling method and bump levelling apparatus

A linear actuating apparatus includes a shaft moved by a linear actuator means to slide along a center axis. A vertical position detector are provide for detecting the current position of the shaft to produce position signals indicative of detected positions. An actuation controller controls the movement of the shaft based on the position signals from the position detector.

Linear actuating apparatus

A component mounting apparatus and method for mounting components on to-be-mounted positions of works, includes a carrying device for continuously and successively carrying the works in a working area, and a first component-mounting device for picking up one component from component supply units in a first component supply section and mounting the picked-up component on the to-be-mounted position of one of the works being continuously and successively carried in the work area.

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Osaka, Japan

Osamu Nakao