Fujikura Limited

Fibertech Co., Ltd

Fujitsu Corporation

Ddk Ltd.

Osamu Nakao

Reiji Higuchi

Shouji Itou

Masahiro Okamoto

Takuya Aizawa

Hitoshi Nishimura

Kenichi Nakatate

Takeshi Ishizuka

Mitsuru Kamikatano

Akihito Kurosaka

Takanao Suzuki

Yusuke Matsuda

Kazuhisa Itoi

Shoji Ito

Katsubumi Nagasu

Shigekazu Kawai

Syouji Ito

Masahiro Sato

Yusuke Uemichi

Yasuo Fukuda

Satoshi Yamamoto

Satoshi Okude

Haruo Tominaga

Kenichi Ohmori

Shoji Ajimura

Masakatsu Nagata

Ryoichi Kishihara

Hiroki Hashiba

Shoji Iwasaki

Kazuhiko Tomomatu

Light guide for dental light irradiator

Light guide rod for dental light irradiator

A base material () is arranged on top of at least one first internal layer base material (), and a second internal base material () is arranged underneath the base material (). And thereafter a surface layer circuitry conductive foil () is arranged underneath the base material (), and subsequently these materials are colaminated for forming a colaminated body (). While this colaminating operation, conductive portions being formed in the base materialsare aligned to electrically connect one another for forming an internal circuitry. And thereafter, an interlayer conductive portion () being electrically connected to the internal circuitry is formed, and a minute circuitry is formed on the top of the base material () and the conductive foil () accordingly.

Multi-layer board manufacturing method thereof

Provided is a flux gate sensor comprising the following: a magnetic core having a first wiring layer formed on a board, a first insulating layer formed in such a way as to cover the aforementioned first wiring layer, and a magnetic core which is formed on the aforementioned first insulating layer and which has a central portion and an end portion that continues to the aforementioned central portion, that has a width larger than the width of the aforementioned central portion, and that is located on either side of the aforementioned central portion; a second insulating layer which covers the aforementioned magnetic core and which is formed on the aforementioned first insulating layer; and a second wiring layer formed on the aforementioned second insulating layer.

Fluxgate sensor and electronic compass making use thereof

Provided is a resin multilayer device having a balun, wherein the resin multilayer device comprises: a substrate; a first resin layer formed on the substrate; two balanced signal transmission lines that are electrically independently disposed on the first resin layer; a second resin layer formed on the two balanced signal transmission lines and the first resin layer; an unbalanced signal transmission line disposed on the second resin layer and facing the two balanced signal transmission lines; and a third resin layer formed on the unbalanced signal transmission line and the second resin layer.

Resin multilayer device and method for manufacturing same

At least one base material having a wiring circuit that has been formed into a predetermined outer shape is bonded to a motherboard. The motherboard wiring board and the base material having a wiring circuit are electrically connected to each other at least one portion through an inner via hole. The outer shape of the base material having a wiring circuit is smaller than the outer shape of the motherboard, with the base material having a wiring circuit having an island shape on the motherboard.

Process for producing multilayer printed wiring board

A configuration according to the invention includes at least one wired base material configured with an insulating base material having an adhesion property, and an electric conductive layer formed on one side of the insulating base material, a plugging electrode made of an electric conductive paste, connected to the electric conductive layer, and penetrating the insulating base material, and an IC chip having a re-wiring portion, the IC chip being buried in an interlayer binding material, with the re-wiring portion connected to the plugging electrode, having a supporting board disposed on an opposite side to the re-wiring portion of the IC chip, with an adhesion layer in between, and having a re-wiring layer configured with the wired base material and the re-wiring portion. According to the invention, therefore, it is allowed to provide a multi-layer printed wing board with highly defined components implemented, allowing for a fabrication by facile processes, without causing, among others, increased costs or decreased yields.

Method of manufacturing a printed wiring board

A magnetic device comprises a magnetic element, a first magnetic field application device, and a second magnetic field application device. The first and second magnetic field applying means are disposed on mutually opposite sides of the magnetic element. The magnetic element is, for example, an element in which a soft magnetic film is formed in a meandering shape on a nonmagnetic substrate. The first and second magnetic field application device create a magnetic field in one direction from the first magnetic field application device toward the second magnetic field application device. The bias magnetic field in one direction is thereby applied to the entire soft magnetic film in the magnetic element disposed between the first and second magnetic field application device.

Magnetic device

A magnetic device comprises a magnetic element, a first magnetic field applying means, and a second magnetic field applying means. The first and second magnetic field applying means are disposed on mutually opposite sides of the magnetic element. The magnetic element is, for example, an element in which a soft magnetic film is formed in a meandering shape on a nonmagnetic substrate. The first and second magnetic field applying means create a magnetic field in one direction from the first magnetic field applying means toward the second magnetic field applying means. The bias magnetic field in one direction is thereby applied to the entire soft magnetic film in the magnetic element disposed between the first and second magnetic field applying means.

Multilayer board manufacturing method

A multilayer wiring board assembly component comprises: an insulating substrate component (the insulating resin layer); a conductive layerformed on one surface of said insulating substrate componentin the form of an electrode pattern; an adhesive layerformed on the other surface of said insulating substrate component; and a conductive resin compositionwith which is filled a through hole passing through said insulating substrate component, said adhesive layer and said conductive layer in order to make interlayer interconnection. The bore diameter of the conductive layer portionof the through holeis smaller than the bore diameter of the insulating resin layer portion and the adhesive layer portionto establish electrical connection between the conductive resin compositionand the conductive layerby the rare surfaceof the conductive layer

Multilayer wiring board, base for multilayer wiring board, printed wiring board and its manufacturing method

A multilayer wiring board assembly, a multilayer wiring board assembly component and a method of manufacture thereof are described in which it is possible to easily laminate together flexible FPCs having highly packing densities by via-on-via and chip-on-via. The multilayer wiring board assembly is laminated by laminating together a plurality of multilayer wiring board assembly components, each of which is made by preparing a copper plated resin filmmade of a copper plated resin film made of a resin film having adhesivity which is provided with a copper foil bonded to one surface thereof and in which a through hole is opened through said copper foil and said resin film, and a conductive paste filler embedded by screen printing in the through hole of said copper plated resin film from said copper foil with a leading end of said conductive paste filler being projected from said resin film.

Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof

A multilayer wiring board assembly, a multilayer wiring board assembly component, and a method of manufacture thereof. The multilayer wiring board assembly is formed by laminating together a plurality of multilayer wiring board assembly components having a flexible resin film with a copper foil bonded to one surface and an adhesive layer bonded to the other surface, opening a through hole in the copper plated resin film through the copper foil, resin film, and the adhesive layer, filling the through hole with a conductive paste projecting from the adhesive layer and laterally extending beyond through hole opening of the copper foil.

A Dry-Film resist formed of, for example, a photosensitive film is stacked on the electroconductive material and these portions, other than a projection electrode formation area, formed on a wiring board's electrode serving as a portion of a circuit pattern are masked with a mask. After this, the wiring board is exposed to light and, after the removal of the mask, a development process is performed, thus eliminating the Dry-Film resist on the wiring board at the portion other than the projection electrode formation area. Then the electroconductive material of the wiring board is etched under an etching process to provide a projection electrode having a bump with a pointed tapering end in vertical cross-section. Finally, the wiring board is exposed to a Dry-Film resist elimination solution to remove remaining Dry-Film resist from the projection electrode. And a plating process is performed on the electroconductive material to form a plated layer and hence complete the projection electrode.

Method of forming a projection electrode

Growing community of inventors

Sakura, Japan

Osamu Nakao