Mitsubishi Denki Kabushiki Kaisha

Osamu Nakagawa

Tetsuya Ueda

Kazunari Michii

Toshinobu Banjo

Seiji Takemura

Kou Shimomura

Ikuo Sasaki

Koji Yanagitani

A packaged semiconductor device includes a semiconductor chip having first and second surfaces, a plurality of electrodes formed on the first surface of the semiconductor chip, a die pad bonded to the second surface of the semiconductor chip for supporting the semiconductor chip, a plurality of leads having first and second ends, the first ends being connected to corresponding electrodes of the semiconductor chip, a heat spreading plate disposed in opposed relation to the die pad and having an area larger than that of the die pad, at least one end portion of the heat spreading plate lying in the same plane as the second ends of the plurality of leads, and a resin package body encapsulating the semiconductor chip, the die pad, the first ends of the plurality of leads, and the heat spreading plate.

Encapsulated semiconductor device having a hanging heat spreading plate

A carrier tape includes an insulating film supporting a plurality of leads. The film has a center device hole for receiving a semiconductor chip therein, a plurality of outer lead holes formed at the periphery of the center device hole, a lead supporting portion positioned between the center device hole and the outer lead holes, and a link portion positioned between a pair of adjacent outer lead holes and connected to the lead supporting portion for directing the flow of molten resin during encapsulation of the semiconductor chip. The link portion includes an opening or recess. The plurality of leads of the carrier tape are supported on the lead supporting of the film, with one end portion of each lead projecting into the center device hole of the film. During manufacture, a semiconductor chip having a plurality of electrodes is positioned within the center device hole, and the leads are electrically connected to respective electrodes of the semiconductor chip. The resultant chip is placed within a cavity of a mold, and a molten resin is injected into the cavity through the opening or recess passage formed in the link portion of the film.

Carrier tape

A metal mold for plastic molding a semiconductor device by a transfer-molding method with the use of thermo-hardening plastics. The mold includes a pot section into which plastic is injected; a cavity section where a product is formed; a runner section constituting a path for the plastic from the pot section to the cavity section; a gate section provided between the runner section and the cavity section so as to reduce the cross-sectional area for the flow of the plastic which flows therethrough from the runner section to the cavity section; a flow restriction section provided in the path of the runner section so as to reduce the cross-sectional area of the flow of plastic.

Method of molding a semiconductor device

Growing community of inventors

Itami, Japan

Osamu Nakagawa