Mitsubishi Denki Kabushiki Kaisha

Fujifilm Corporation

Daicel Chemical Industries, Ltd.

Hudson Soft Co., Ltd.

Mitsubishi Plastics Industries Limited

Kett Electric Laboratory

Jal Data Communication & Systems Co., Ltd.

Osamu Murakami

Katsunori Ochi

Syojiro Kodai

Yasunobu Sakaguchi

Yasunori Narukawa

Koichi Sugimoto

Masahiko Sakamoto

Masaru Imaizumi

Yasushi Kawashima

Masahiro Otani

Katsutoshi Kamakura

Tsutomu Fujino

Isamu Higashioka

Makoto Kobayashi

Tuguo Kurisu

Akimasa Yuuki

Tomohiro Sasagawa

Toshiyuki Manabe

Naoko Iwasaki

Masanori Hiraishi

Junichi Matsuura

Masanari Ohnishi

Shojiro Kodai

Keiichi Takeuchi

An IP cover having a light-shielding property is detachably mounted on an IP. The IP includes a stimulable phosphor layer on one surface thereof. The IP cover is mounted on the stimulable phosphor layer so as to be closely attached to the stimulable phosphor layer. The IP and the IP cover include notches, and a part of an inspection target is inserted into the notches at the time of inspection. An IP unit is mounted on a blade welded portion of an impeller. Radiation is applied from a radiation irradiation device and a radiation image of the blade welded portion is recorded on the IP as a latent image. The IP cover is detached from the IP unit and the IP is set on a template. The IP is set at an image reading position of a radiation image reading device by the template, and the radiation image is read.

Imaging plate unit and application thereof

A radiation image obtained by imaging a test object irradiated with radiation is acquired. A standard image which is a normal radiation image of the test object imaged under the same imaging condition as in the acquired radiation image is stored in a standard image storage unit. Differential values of pixel values between corresponding pixels of the radiation image acquired by the radiation image acquisition unit and the standard image stored in the standard image storage unit are detected. A differential region between the radiation image and the standard image so that positive and negative of the differential values in the differential region can be determined on the basis of a detection result of the differential value detection unit is displayed on a display unit.

Image processing device, image processing method, and program

Protective cover of imaging plate for X-ray inspection

A code disk for a high-resolution encoder that can detect an absolute position and a method for manufacturing a mold to produce the code disk are provided. The code disk is formed by using transparent substrate. The code disk includes a plurality of tracks provided on the transparent substrate and an area provided between the plurality of tracks. Each surface of the plurality of tracks has a different pattern. A level of the area is different from that of the each surface of the plurality of tracks. The method for manufacturing the mold includes steps of processing a plurality of tracks with a flat surface on material; processing an area with a level different from that of each surface, between the plurality of tracks; forming different patterns on the each surface; plating the first material; and peeling plating from the first material to obtain a mold.

Code disk with a plurality of tracks having different patterns

A transmissive display apparatus comprises a liquid crystal display unit; and a plane light source unit that comprises a tubular light source, a light guide, and a light-diffusing film having anisotropy that provides a consistent luminance in a display surface, and/or ultraviolet (UV) absorbability that absorbs the UV from the light source and prevents deterioration of a prism sheet in the display unit and liquid display cell. In the film, a light-scattering characteristic F(&#x3b8;) represents a relationship between the light-scattering angle &#x3b8; and a scattered light intensity F fulfills Fy(&#x3b8;)/Fx(&#x3b8;)&#x2267;1.01 over a range of &#x3b8;=4 to 30&#xb0;, wherein Fx(&#x3b8;) and Fy(&#x3b8;) represent the light-scattering characteristics in an X-axial direction and Y-axial direction of the film, respectively. The film comprises a light-diffusing layer composed of a plurality of resins which are different from each other in refractive index, and a transparent layer laminated on at least one side thereof.

Light diffusion film, plane light source device and liquid crystal display apparatus for enhancing a constant luminance and diffusing a light

A method for producing an IC card including filling a confined space with a mixture including a foaming resin, the mixture having not been foamed yet, the space being confined by a frame having cut-out portions on inner edges and at least one through-hole passing through the frame in the lateral direction between the inside and the outside of the frame, a circuit board on which functional components are mounted and having edges fitted to one of the cut-out portions of the frame so that the surface of the circuit board on which functional components are mounted faces inward, the frame and the circuit board forming a substantially flat outer surface, and a thin plate having edges fitted to another of the cut-out portions of the frame with the thin plate opposing the circuit board, the frame and the thin plate forming a substantially flat outer surface; foaming the mixture at a predetermined temperature for a predetermined time, thus filling the confined space with foamed resin, and thus making the foamed resin a structural member having mechanical strength, molding the frame, the circuit board, and the thin plate into one body; and removing excess foamed resin from the through-hole in the frame.

Method of making IC card

An IC card production method includes the steps of mounting a card board (12) having a through opening onto a lower mold (16) of molding dies (15), mounting a semiconductor module (2) onto the opening of said card board (12), tightening an upper die (17) of the molding dies (15) having a gate (19) onto a lower die (16), and molding by injecting resin (13) into the opening from the gate (19) in a state in which only an electrode terminal face (7) for external connection of the semiconductor module (2) is exposed. The IC card includes a card board (12) having a through opening, a semiconductor module (2) mounted onto this opening, and a molded resin (13) injected into said opening so that the resin moding is formed under such condition that only an electrode terminal face for external connection (7) of said semiconductor module (2) is made to expose.

Production method for an IC card

An IC card includes: a circuit board on which functional components are mounted; and a frame covered with a thin plate, the circuit board being disposed in the frame, the inside of the frame being filled with a foamed resin. As a result of the above arrangement, an IC card having a strong resistance to various external forces is produced. Furthermore, because it is possible to incorporate a surface material with a design in an integrally molded device, thus it is also possible to produce an IC card device having an excellent appearance.

IC card including frame with lateral hole for injecting encapsulating

An information collecting system comprises an access terminal connectable to a data base through a network and a host computer, an IC memory card adapted for removable insertion into the access terminal, and a portable personal terminal. Requests for an item of information, from a customer, are inputted and recorded in the IC memory card using the personal terminal and the IC memory card is inserted into the access terminal. The request for information is transmitted through the access terminal to the data base and the requested information, transmitted from the data base, is stored in the IC memory card. Thereafter, the IC memory card, storing the information, is inserted into the personal terminal whereby the requested information is displayed on a display formed in the personal terminal.

Information collecting and/or service furnishing systems by which a user

An IC card comprises a card board having first and second major surfaces and a semiconductor module having an electrode terminal face. The semiconductor module is mounted in the card board, so that the electrode terminal face is exposed onto the first major surface of the card board. The card board comprises a board frame and a resin which is molded inside the board frame. Part of the semiconductor module surface which is opposite to the electrode terminal face, is covered with the resin.

Production method for an IC card and its IC card

A manufacturing method for a thin semiconductor device assembly includes forming an internal frame for positioning an IC module within an external frame that forms the periphery of the thin semiconductor device assembly, positioning the IC module in the internal frame so that an electrode terminal surface of the IC module is exposed, and fixing the IC module in place by filling the external and internal frames with resin.

Manufacturing method for thin semiconductor device assemblies

An IC card includes a thin plate forming an external surface of the card, a circuit board formed on an internal surface of the thin plate, and a frame surrounding peripheries of the thin plate and the circuit board. A space defined by the frame and the surface plate is filled with molded resin. A portion of an inner peripheral surface of the frame projects into the resin. The molded resin completely covers a surface of the circuit board and integrates the frame and the thin plate.

Growing community of inventors

Tokyo, Japan

Osamu Murakami