Shindengen Electric Manufacturing Company Limited

Osamu Matsuzaki

Kosuke Ikeda

Yuji Morinaga

An electronic module has a first substrate, a first electronic element, a second electronic element, a second substrate, a first terminal partprovided on a side of the first substrateand a second terminal partprovided on a side of the second substrate. The first terminal parthas a first surface direction extending partand a first normal direction extending partextending toward one side or the other side. The second terminal parthas a second surface direction extending partand a second normal direction extending partextending toward one side or the other side. The second surface direction extending partis provided on one side of the first surface direction extending part, and the first surface direction extending partand the second surface direction extending partoverlap one another in a surface direction.

Electronic module

An electronic module has a first substrate, an electronic elementdisposed on one side of the first substrate, a second substratedisposed on one side of the electronic element, a first coupling bodydisposed between the first substrateand the second substrate, a second coupling bodydisposed between the first substrateand the second substrate, and shorter than the first coupling body, and a sealing partwhich seals at least the electronic element. The first coupling bodyis not electrically connected to the electronic element. The second coupling bodyis electrically connected to the electronic element

Electronic module and method for manufacturing electronic module

An electronic module has a first electronic element, a first connectorprovided in one side of the first electronic element, and having a first columnar partextending to another side and a first groove partprovided in a one-side surface, and a second electronic elementprovided in one side of the first connectorvia a conductive adhesive agent provided inside a circumference of the first groove part. The first connectorhas a first concave parton one side at a position corresponding to the first columnar part

Electronic module, method of manufacturing connector, and method of manufacturing electronic module

An electronic module has a first substrate, a first electronic elementprovided on one side of the first substrate, a first connection bodyprovided on one side of the first electronic element, a second electronic elementprovided on one side of the first connection body, a second substrateprovided on one side of the second electronic element, and an abutment bodythat abuts on a face on one side of the second electronic elementand is capable of imparting a force toward one side with respect to the second substrate

An electronic module has a first substrate, a first conductor layerthat is provided on one side of the first substrate, a first electronic elementthat is provided on one side of the first conductor layer, a second electronic elementthat is provided on one side of the first electronic element, and a second connecting bodythat has a second head partprovided on one side of the second electronic elementand an extending partextending from the second head partto the other side and abutting against the first substrateor the first conductor layer

A method of manufacturing a chip module comprises a step of disposing a first electronic elementon a first jig, a step of disposing a first connectoron the first electronic elementvia a conductive adhesive, a step of disposing a second electronic elementon the first connectorvia a conductive adhesive, a step of disposing a second connectoron a second jig, a step of reversing the second jig in a state where the second connectoris fixed to the second jigand disposing the second connectoron the second electronic elementvia a conductive adhesive, and a step of curing the conductive adhesives

Method of manufacturing chip module

An electronic module has a first electronic unit having a first substratea first conductor layerprovided on one side of the first substrateand a first electronic elementprovided on one side of the first conductor layera first connection bodyprovided on one side of the first electronic elementand a second electronic unit having a second electronic elementprovided on one side of the first connection bodyThe first connection bodyhas a first head partand a plurality of support partsextending from the first head partThe electronic module is characterized by that the support partabuts on the first substrateor the first conductor layer

An electronic module has a first substrate, a first electronic element, a second electronic element, a second substrate, a first terminal partand a second terminal part. The first terminal parthas a first terminal base end part, a first terminal outer part, and a first bending partthat is provided between the first terminal base end partand the first terminal outer partand that is bent toward the other side on a side of the first terminal base end part. The second terminal parthas a second terminal base end part, a second terminal outer part, and a second bending partthat is provided between the second terminal base end partand the second terminal outer partand that is bent toward one side on a side of the second terminal base end part

Electronic module, lead frame and manufacturing method for electronic module

An electronic module comprises a substrate, an other-side electronic componentprovided on the other side of the substrate, a one-side electronic componentprovided on one side of the substrateand a connecting terminalhaving an other-side extending partextending to circumferential outside of the substrateon the other side of the substrate, a one-side extending partextending to circumferential outside of the substrateon one side of the substrate, and a connecting partconnecting the other-side extending partwith the one-side extending partat the circumferential outside of the substrate

The present invention provides a heat dissipating structure with high heat dissipation performance while reducing the electric resistance. A heat dissipating structure includes: a heat sink having a base portion, and a plurality of heat dissipating fins provided upright on a first surface of the base portion; a first heat generating component provided on a side of the first surface of the base portion while being in contact with at least one heat dissipating fin of the plurality of heat dissipating fins; a circuit board joined to a second surface, opposite to the first face, of the base portion while being electrically connected to the first heat generating component; a second heat generating component provided on the circuit board, the second heat generating component generating a smaller amount of heat than the first heat generating component; and a connector electrically connecting the first heat generating component and the second heat generating component. The connector has a first outlet into which a first connecting terminal on a side of the first heat generating component is insertable, and a second outlet into which a second connecting terminal on a side of the second heat generating component is insertable.

Heat dissipating structure

A heat sink according to one embodiment of the present invention includes: a base portion having a first surface and a second surface which oppose each other; at least one heat dissipating fin extending vertically from the first surface, each of the at least one heat dissipating fin having an insertion groove extending from an end portion thereof toward the base portion, and a first fin portion and a second fin portion which are separated by the insertion move; and a connector included in the base portion, the connector being above the insertion groove in plan view, and the connector being configured to electrically connect a first heat generating component to be inserted into the insertion groove from a side of the first surface and a second heat generating component to be disposed on a side of the second surface.

A semiconductor module according to one embodiment of the present invention includes: a first circuit board having thermal conductivity; a second circuit board having thermal conductivity and disposed opposing the first circuit board; a first semiconductor element joined to an opposing surface of the first circuit board opposing the second circuit board; a second semiconductor element joined to an opposing surface of the second circuit board opposing the first circuit board; and a connector electrically connecting the first semiconductor element and the second semiconductor element. The connector includes a portion which is sandwiched between the first semiconductor element and the second circuit board without through the second semiconductor element, and which is in contact with the first semiconductor element and the second circuit board.

Growing community of inventors

Hanno, Japan

Osamu Matsuzaki