Konica-minolta Holdings, Inc.

Konica Corporation

Konica Minolta, Inc.

Crestec Corporation

Osamu Masuda

Kazumi Furuta

Masahiro Morikawa

Hiroshi Miyakoshi

Makiko Imae

Kazuhiko Kobayashi

Hiroaki Arita

Kazuo Shiozawa

Yuichi Akanabe

Hirofumi Tanaka

Kunito Hayashi

Makiko Saito

Kazuhiko Hirabayashi

Koji Nakashima

Akiko Kuji

An optical characteristic evaluation method evaluates unevenness of an optical characteristic in an optical film based on analysis of a polarized state of light transmitting through an optical film and an analyzer. The method includes the following, measuring a phase difference and an orientation angle in a plurality of positions; and quantifying and evaluating the unevenness of the optical characteristic based on a parameter of a vector of output light calculated by a formula 1 using a vector showing a polarized state of input light and a matrix showing a polarizing characteristic of the optical film and the analyzer. The formula 1 is as follows, formula 1: F2=M&#xd7;F1, F1: Stokes vector or Jones vector of input light, F2: Stokes vector or Jones vector of output light, M: Mueller matrix or Jones matrix of the optical film as the evaluation target and the analyzer.

Optical characteristic evaluation method and optical characteristic evaluation system

A method for inspecting an electronic device, in which inspection of electrical characteristics is carried out, uses conduction to pass a current to an electronic device while the electronic device is being continuously conveyed.

Method for inspecting electronic device and electronic device inspection apparatus

A quarter-wave plate includes a base member including a ridge and trough periodic structure with a structural period of &#x3bb;/2&#x3c;P&#x3c;&#x3bb;arranged on one side of the base member, where &#x3bb;is the minimum wavelength among the wavelengths of a plurality of light fluxes which pass the quarter-wave plate. In the quarter-wave plate, refractive index of a ridge portion of the ridge and trough periodic structure for the wavelength &#x3bb;and a light transmittance have predetermined values. The ridge and trough periodic structure satisfies the predetermined condition relating to the structural height and the structural width of the ridge portion.

Quarter-wave plate, and optical pickup device

An optical element includes: opposing surfaces each including two areas each of which includes a fine-periodic structure. The fine-periodic structures of the two areas have different directions from each other in each of the opposing surfaces. One of the opposing surfaces with the fine-periodic structures works as a quarter-wave plate and the other of the opposing surfaces with the fine-periodic structures works as a polarization separating element. A boundary of the two areas in one of the opposing surfaces and a boundary of the two areas in the other of the opposing surfaces are positionally identical.

Optical element, optical element manufacturing method and optical pickup device

A producing method of an optical element such as quarter-wave plate wherein preparing a first member which has a coefficient of elasticity of 1-4 (GPa) at normal temperature, setting the temperature of a die having microscopic shape with high aspect ratio to be higher than the glass transition temperature of the first member and pressing the die against the first member to transfer a microscopic shape on the first member, a microstructure is formed on the first member. In the same manner, a second microstructure is formed on a second member. Afterwards, by connecting the first member and the second member, an optical element in which the first member and the second member are connected having microstructures with high aspect ratio face each other, is obtained.

Optical element producing method and optical element

There is described a molding method for molding a product, having a microscopic structure of high aspect ratio. The molding method includes the steps of: setting a temperature of a mold, having a microscopic shape, at a value higher than a glass transition temperature of a material being deformable with heat; pushing the mold against the material at a first velocity, after the material is positioned opposite to the mold so that the microscopic shape contacts the material; pushing the mold against the material at a second velocity being faster than the first velocity; and releasing the mold from the material. The pushing pressure for pushing the mold against the material at the first velocity is equal to or smaller than a half of that for pushing the mold against the material at the second velocity.

Molding method, cooling apparatus and optical element

A wide-band wave plate having at least two wave plates, each of which has a microstructure to generate a phase difference, the microstructure having a cycle not shorter than 1/nof a shortest wavelength of light in use, wherein the two wave plates are arranged to face opposite with their main axes in non-parallel with each other, wherein nis a refractive index of a wave plate material with respect to the shortest wavelength.

Wide-band wave plate and a controlling method thereof

There is described a method for depicting a predetermined pattern, such as a diffraction pattern employed in an optical element, on a substrate. The method includes the steps of: acquiring shape data of the predetermined pattern; generating a first input signal for deflecting an electron beam emitted from an electron gun in a main-scanning direction, and a second input signal for deflecting the electron beam in a sub-scanning direction, based on the shape data of the predetermined pattern; adjusting an alternating bias signal, having a specific frequency, according to the shape data of the predetermined pattern; superposing the alternating bias signal on the second input signal; and deflecting the electron beam emitted from the electron gun in the sub-scanning direction according to the second input signal on which the alternating bias signal is superposed, while scanning the electron beam by deflecting it in a main-scanning direction.

Electron beam depicting method, mother die manufacturing method, mother die, metallic mold manufacturing method, metallic mold and optical element

A method of producing an optical element forming die, includes the steps of: cutting a base member to form a base optical surface of the base member while rotating the base member; cutting an outer circumferential surface of the base member so that an optical axis of the base optical surface is identical to a rotation center of the outer circumferential surface of the base member while rotating the base member; forming an optical surface having a predetermined pattern onto the base optical surface of the base member; forming an electroforming mold having an optical transfer surface complementary to the optical surface of the base member by electroforming wherein the electroforming is conducted with the base member; and cutting an outer circumferential surface of the electroforming mold on the basis of the outer circumferential surface of the base member.

Producing method for optical element molding die and producing method for optical element

A pattern drawing method of drawing a desired pattern on a base material by irradiating an electronic beam and scanning the base material with the electronic beam with a predetermined dose amount, comprising: a first step of drawing a first region on the base material by scanning with the electronic beam with a first dose amount; a second step of drawing a second region on the base material by scanning with the electronic beam with a second dose amount; and a inclining step of inclining a boundary between the first region and the second region to form an inclined surface by conducting a first scanning to scan with the electronic beam with the first dose amount and a second scanning to scan with the electronic beam with the second does amount in a mixed arrangement.

Pattern drawing method by scanning beam and pattern drawing apparatus

A method of drawing a pattern on a base material by scanning a beam, comprising: drawing a pattern including ring-shaped zones on a first pattern-drawn field on a base material by scanning a beam on a first pattern-drawn field; shifting at least one of the beam source and the base material to scan the beam on a second pattern-drawn field located next to the first pattern-drawn field in such a way that a boundary between the first pattern-drawn field and the second pattern-drawn field is positioned at a joint portion between a slope portion and a side wall portion of the ring-shaped zones; and drawing the pattern on the second pattern-drawn field by scanning a beam so that the joint portion between the slope portion and the side wall portion is drawn at the boundary between the first pattern-drawn field and the second pattern-drawn field.

Method of drawing a pattern on a base material by scanning a beam

The present invention aims at providing a device and method for writing a line with a high degree of precision at high speed. Distance calculation meanscalculates the start-to-end point distance L of a writing pattern (S), and number-of-scan-clocks calculating meanscalculates the number of scan clocks required to write the writing pattern based on the start-to-end point distance L and a unit distance corresponding to the minimum time resolution for a high-speed D/A converter(S). Count conversion meansseparates the start-to-end point distance L into X and Y components to convert them in an equation using the number of scan clocks (S). Based on the equation, variable rate calculating meanscalculates an extinction ratio to determine the extinction ratio at a variable attenuator(S). ATT D/A converterspecifies the extinction ratio at the attenuatorto reduce the unit distance corresponding to the resolving power of the high-speed D/A converterso that an electron beam will be irradiated and scanned at intervals of the reduced unit distance to perform writing.

Electron-beam writing device and electron-beam writing method

A method of coating a coating liquid on a base material having a curved surface portion, includes processes of: a coating process of coating a coating liquid on a base material; and a rotating process of rotating the base material coated with the coating liquid.

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Machida, Japan

Osamu Masuda