Matsushita Electric Industrial Co., Ltd.

Osamu Makino

Eiichi Uriu

Hironobu Chiba

Chisa Yokota

Toru Ishida

Michio Matsuoka

Seiichi Nakatani

Hideyuki Okinaka

Satoru Yuhaku

Hirotoshi Watanabe

Tatsuro Kikuchi

Mikio Matsuura

Kazuo Eda

Takeshi Iseki

Yasuharu Kikuchi

Nobuji Nishi

Mitsuo Ioka

A lamination ceramic chip inductor includes at least one pair of insulation layers; and at least one conductive pattern which is interposed between the at least one pair of insulation layers and forming a conductive coil. At least one conductive pattern includes a conductive pattern formed as a result of electroforming.

Inductor and method for producing the same

Method for producing a lamination ceramic chi

Method for producing an inductor

A method for producing a conductive pattern includes the steps of forming a mask layer on a conductive base plate, the mask layer having a pattern defining an exposed area of the conductive base plate; forming a conductive pattern on the exposed area of the conductive base plate by electroforming using a plating liquid which substantially maintains the pattern of the mask layer; and transferring the conductive pattern onto a support layer without removing the mask layer.

Method for producing a conductive pattern and method for producing a

The invention relates to glaze resistors which are used for electronic parts of hybrid integrated circuit devices, chip resistors, resistor network, etc. The glaze resistor comprises 4.0 to 70.0 wt % of a conductive component composed of a metal silicide and a metal boride and 30.0 to 96.0 wt % of glass in which a rate of said metal boride is 1.0 to 68.0 wt %. Thus, the glaze resistor can be formed by sintering in a non-oxidizing atmosphere and can provide a circuit, together with conductor pattern of base metals such as Cu.

Glaze resistor

A manufacturing method for a multilayered ceramic body using Cu, Ni, Co or Fe as a conductor material, and a conductor forming paste of particular composition of CuO, NiO, CoO or Fe.sub.2 O.sub.3 as the main component, the paste being applied to the multilayered body. The manufacturing method comprises: a process of forming the multilayered body with conductor paste of CuO, NiO, CoO or Fe.sub.2 O.sub.3 as the main component and insulating paste formed of glass and/or ceramic, so that a binder is removed from the laminate by heat treatment in an oxidizing atmosphere; a process of heat treatment for reducing the oxide; and a sintering process for sintering the laminate in a nitrogen atmosphere.

Conductor paste and method of manufacturing a multilayered ceramic body

A manufacturing method for a multilayered ceramic body using Cu, Ni, Co or Fe as a conductor material, and a conductor forming paste of a particular composition of CuO, NiO, CoO or Fe.sub.2 O.sub.3 as the main component, the paste being applied to the multilayered body. The manufacturing method comprises: a process of forming the multilayered body with conductor paste of CuO, NiO, CoO or Fe.sub.2 O.sub.3 as the main component and insulating paste formed of glass and/or ceramic, so that a binder is removed from the laminate by heat treatment in an oxidizing atmosphere; a process of heat treatment for reducing the oxide; and a sintering process for sintering the laminate in a nitrogen atmosphere.

A thick film resistor composition, comprising a silicide powder composed of a molybdenum disilicide, a tantalum disilicide and a magnesium silicide, and an alkaline earth borosilicate glass powder dispersed in a vehicle containing a heat-depolymerizing organic polymer. The thick film resistor composition, employing this heat-depolymerizing organic polymer, can be fired in a nonoxidizing atmosphere and coexist with base metal materials such as copper electrodes. Owing to the Nb.sub.2 O.sub.5 and Ta.sub.2 O.sub.5 contained in the alkaline earth borosilicate glass powder, the thick film resistor composition is free from sheet resistivity fluctuation, according to resistor length, which would result from diffusion of the electrode material into the resistor.

Thick film resistor composition

The present invention provides a voltage-dependent resistor of the bulk-type in which zinc oxide (ZnO) powder and additives are admixed to form a sintered body composition having as the main constituent, zinc oxide, and in which the mixture is formed into a resistor body, the body is sintered, and electrodes are applied to the opposite surfaces of the sintered body, the improvement comprising the step of, prior to sintering and admixture with said zinc oxide, admixing all amount of boron oxide (B.sub.2 O.sub.3) with other additives in the form of a borosilicate glass, which is composed of 5 to 30 weight percent of boron oxide (B.sub.2 O.sub.3) and 70 to 95 weight percent of silicon oxide (SiO.sub.2). A process for the production of said resistor is also provided.

Voltage-dependent resistor and method of making the same

A process for making a bulk-type voltage-dependent resistor and more particularly to a varistor comprising a zinc oxide sintered body using heat-treated zinc oxide powder. By heat-treating zinc oxide powder before the sintering step, a bulk-type voltage-dependent resistor is obtainable which is characterized by a high n-value in a region of current higher than 10A/cm.sup.2 and high power dissipation as well as a lower C-value.

Process for making a voltage dependent resistor

A voltage-dependent resistor comprising a sintered body comprising ZnO as a major part and Bi.sub.2 O.sub.3 and GeO.sub.2 as additives with electrodes applied to the opposite surfaces of the sintered body. This voltage-dependent resistor has a low C-value and a high n-value in I=(V/C).sup.n along with high power dissipation for surge energy and high stability to a high D.C. load. Further, other additives such as NiO, Co.sub.2 O.sub.3, MnO, TiO.sub.2 and Cr.sub.2 O.sub.3 can advantageously be added to the sintered body.

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Hirakata, Japan

Osamu Makino