Fujitsu Media Devices Limited

Osamu Kawauchi

Masanori Ueda

Toshio Nishizawa

Hiroyuki Furusato

Kiyohide Misawa

A surface acoustic wave device includes a package having a coefficient of linear expansion; and a piezoelectric element forming a surface acoustic wave element, and mounted on the package by a flip chip bonding. The piezoelectric element has different coefficients of linear expansion in a direction of propagation of surface acoustic waves generated by an interdigital electrode of the surface acoustic wave element and in a vertical direction thereto, and further has a long side existing to a direction having a coefficient of linear expansion close to the coefficient of linear expansion of the package. The piezoelectric element is cut out from a single crystal having X, Y, and Z crystal axes, and the X crystal axis agrees with a direction of propagation of the surface acoustic wave.

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Nagano, Japan

Osamu Kawauchi