Kabushiki Kaisha Shinkawa

Hitachi, Ltd.

Hitachi Tokyo Electronics

Hitachi Tokyo Engineering Co., Ltd.

Osamu Kakutani

Yutaka Kondo

Tsutomu Mimata

Kohei Seyama

Ryuichi Kyomasu

Yoshihiko Seino

Kenji Watanabe

Isamu Yamazaki

Nobuhiro Takasugi

An ultrasonic horn used in, for instance, a wire bonding apparatus and formed with mounting flanges, including a slit and a cross-sectional shape varying portion; the slit being on the central axis in the horn's longitudinal direction and extending fore and aft relative to the center of the mounting flanges, the length of the slit(s) being equal to or greater than the width direction of a flange region that is between the opposing flanges, and at least a part of the cross-sectional shape varying portion being on the outer surface of the horn at a slit region in which the slit is formed. The stress center point in the cross-section of the ultrasonic horn at the flange region is positioned more to the inside than a straight line joining the stress center points in the cross-sections of the ultrasonic horn at the front and rear end portions of the slit.

Ultrasonic horn

A bonding arm swinging type bonding apparatus that has a rotational centerof the bonding armbeneath the bonding arm. The rotating shaft partsof circular arc form rotary motorsthat rotate about the rotational centerof the bonding armare attached to the bonding arm, and the rotating shaft partsof circular arc form air bearingsthat rotate about this rotational centerare provided so that the rotating shaft parts of the circular arc form air bearingsare rotatable as a unit with the rotating shaft partsof the rotary motors

Bonding arm swinging type bonding apparatus

A bonding apparatus including a front link whose lower end is rotatably connected to a bonding arm and upper portion is rotatably connected to bonding head, and a rear link whose lower end is rotatably connected to the rear end of the bonding arm and upper portion is rotatably connected to the bonding head; and a hypothetical rotational center of capillary of the bonding arm is on a bonding surface and set to be the intersection of a line that connects upper and lower rotational centers of the front link and a line that connects upper and lower rotational centers of the rear link, wherein the immovable element of motor is fastened to the bonding head, and the rotational element of the motor is attached to the upper end of the rear link so that the rotational element rotates about the upper rotational center of the rear link.

Bonding apparatus

A wire bonder including two link driving mechanisms and a head supporting stage provided with a bonding head via fluid pressure so that the bonding head is movable in the horizontal plane. Each link driving mechanism is formed by a motor, a driving arm, and a movable arm. The movable arm that extends from the driving arm of the first link driving mechanism is fastened to the bonding head, and the movable arm that extends from the driving arm of the second link driving mechanism is rotatably connected at its one end to the bonding head. A thrust aiming at the center of gravity of the bonding head is applied to the bonding head by the movable arms, thus moving the bonding head around.

A bonding apparatus including, on a supporting standtwo linear motorsandand a bonding head supporting stagewhich supports the bonding headby means of fluid pressure so that the bonding headis movable in the horizontal plane. The linear motorsandrespectively include driving sectionsandand movable coil assembliesandAn armextending from the movable coil assemblyof the first linear motoris fastened to the bonding headand an armextending from the movable coil assemblyof the second linear motoris engaged with the bonding headA driving force aimed at the center of gravity of the bonding headis applied to the bonding headvia the armsandso that the bonding headis moved.

A transducer vibrated by a vibrator and used in a bonding apparatus, the transducer including holding portions and connecting portions. The holding portions are provided so as to protrude at at least two locations that correspond to the nodes of vibration of a transducer main body, and the connecting portions each connects the tip ends of two protruding holding portions to each other. The external force applied to one of the holding portions is thus dispersed in each of the respective holding portions connected by the connecting portions, deformation of the holding portions is prevented, and the respective holding portions can be formed extremely thin in the axial direction of the transducer main body.

Transducer and a bonding apparatus using the same

A die packing device including die holding mechanism comprising a connecting wire receiving shaft which is movable up and down, a pair of die holding levers which have die holding sections for holding the die and are installed so that these levers are free to open and close, and opening-and-closing levers that open and close the die holding levers. A die formed with connecting wires on its upper surface is pushed up by a die push-up device and the wires of to die come into contact with the connecting wire receiving shaft of the die holding mechanism. When the connecting wire receiving shaft is raised by a given amount by the upward movement of the die, the die holding levers are closed so that the die holding sections of the die holding levers are positioned beneath the undersurface of the die. Afterward, the push-up needles of the die push-up device are lowered, resulting in that the die is held by the die holding levers. The die holding mechanism is moved to above a tray or a substrate so that the die is packed in the tray or bonded to the substrate.

Die packing device

A die holding mechanism comprising a connecting wire receiving shaft which is movable up and down, a pair of die holding levers which have die holding sections for holding the die and are installed so that these levers are free to open and close, and opening-and-closing levers that open and close the die holding levers. A die formed with connecting wires on its upper surface is pushed up by a die push-up device and the wires of the die come into contact with the connecting wire receiving shaft of the die holding mechanism. When the connecting wire receiving shaft is raised by a given amount by the upward movement of the die, the die holding levers are closed so that the die holding sections of the die holding levers are positioned beneath the undersurface of the die. Afterward, the push-up needles of the die push-up device are lowered, resulting in that the die is held by the die holding levers. The die holding mechanism is moved to above a tray or a substrate so that the die is packed in the tray or bonded to the substrate.

Die holding mechanism for a die with connecting wires thereon

A multi-chip bonding method and apparatus, in which a first wafer ring which has electronic components of a first type is held by a holding device; substrates are fed out to a conveying device from the first storing section; the electronic components of the first type on the holding device are successively bonded to the substrates; the substrates with the electronic components of the first type bonded is accommodated in the second storing section; the first wafer ring held by the holding device is exchanged for a second wafer ring which has electronic components of a second type; the substrates accommodated in the second storing section is fed out to the conveying device; the electronic components of the second type are successively bonded to the substrates; and the substrates with the electronic components of the second type bonded is accommodated in the first storing section.

Multi-chip bonding method and apparatus

The invention relates to a manufacturing apparatus which comprises moving means which continuously moves the works that are transferred along a frame chute, and detector means which detects at least a portion of the work that is moved. The moving means is controlled by kind-of-work data and by a work position signal from the detector means, and the work is set to a predetermined position. Hence, even a work of a different kind can be set to an optimum bonding position without the need of exchanging the unit, making it possible to perform the operation fully automatically and to meet general purposes. Further, provision is made of means which moves the frame chute in a direction at right angles with the direction in which the work is moved, so that even that work that has different widths and shapes in the widthwise direction can be placed in position and subjected to the bonding fully automatically. The detector means can be provided not only at the bonding position but also at a position on the upstream side having a relation relative to the bonding position. The invention can be adapted particularly effectively to a wire bonder and a pellet bonder.

Growing community of inventors

Oume, Japan

Osamu Kakutani