Seiko Epson Corporation

Osamu Iwamoto

Hidenobu Ota

Yukihiro Endo

Koichi Morozumi

Yuji Mitsui

Akinori Yamada

Takashi Yamazaki

Takahiro Sato

Shigemi Sato

Yuji Oda

Yasuhiro Shiohara

Atsuo Kobayashi

A vibrator element includes: a base portion; and a vibrating arm extending from the base portion, the vibrating arm including a piezoelectric film that contains Cu at a crystal grain boundary.

Piezoelectric film producing process, vibrator element, vibrator, oscillator, electronic device, and moving object

A resonator element includes a base portion which includes one end portion and the other end portion opposing the one end portion in a plan view, and a pair of vibrating arms which extend along a first direction from the one end portion of the base portion. The base portion includes a reduced width portion in which a width is gradually decreased along a second direction intersecting the first direction toward a direction side which is separated from the base portion along the first direction, in at least one of the one end portion and the other end portion, and a fixing portion is provided between the one end portion and the other end portion of the base portion.

Resonator element, resonator, oscillator, electronic apparatus, and moving object having reduced vibration leakage

A method of forming an inorganic alignment film made substantially of an inorganic material on a base substrate is provided comprising a milling process of irradiating ion beams onto the surface of the base substrate, on which the inorganic alignment film is to be formed, from a direction inclined at a predetermined angle &#x3b8;with respect to a direction vertical to the surface, and a film-forming process of forming the inorganic alignment film on the base substrate onto which the ion beams are irradiated. In the milling process, the predetermined angle &#x3b8;is preferably 2&#xb0; or more. In the milling process, an acceleration voltage of the ion beams during the irradiation of the ion beams is preferably 400 to 1400 V.

Method of forming inorganic alignment film, inorganic alignment film, substrate for electronic device, liquid crystal panel and electronic apparatus

A method of forming an inorganic alignment film on a base substrate is provided comprising forming a film made substantially of an inorganic material on the base substrate, and irradiating ion beams onto the surface of the film from a direction inclined at a predetermined angle &#x3b8;with respect to the direction vertical to the surface. By irradiating the ion beams onto the film, concave portions having a predetermined directivity are formed on the film. The predetermined angle &#x3b8;is preferably 2&#xb0; or more.

A method of forming an inorganic alignment film is provided comprising a first milling step of irradiating ion beams to a surface of a base substrate, on which the inorganic alignment film is to be formed, from a direction inclined at a predetermined angle &#x3b8;with respect to a direction orthogonal to the surface of the base substrate, a film-forming step of forming a film made substantially of an inorganic material on the base substrate to which the ion beams are irradiated, and a second milling step of irradiating ion beams to a surface of the film from a direction inclined at a predetermined angle &#x3b8;with respect to the direction orthogonal to the surface of the film.

An infrared sensing element of the present invention includes a base including a thin film portion and a thick wall portion arranged around the thin film portion, and a thermopile including a plurality of thermocouples connected in series so that cold junctions are located on the thick wall portion and hot junctions are located on the thin film portion, wherein a thermosensitive portion is provided in contact with the thick wall portion so that a reference temperature with high accuracy can be used for determining temperature based on output from the thermopile. A PN junction formed on a semiconductor substrate serves as the thermosensitive portion, and it is used to provide for a compact infrared sensing element with high performance at low cost.

Infrared sensing element and temperature measuring device

A surface acoustic wave device is provided having a substrate made of quartz, a pair of inter digital transducer-shaped electrodes made of an aluminum layer, an electrode pad, and a pair of lattice-shaped reflectors made of the same material as the electrode. The crystal structure of the aluminum layer composing the electrode is a twin crystal structure, where crystal grains of the (&minus;1 1 1) plane and the (0 0 2) plane and crystal grains of the (1 &minus;1 &minus;1) plane and the (0 0 &minus;2) plane are in a twin crystal relationship with the (&minus;1 1 &minus;1) plane and the (1 &minus;1 1) plane of aluminum as the twin boundaries. Also, the &lcub;1 1 1&rcub; plane of the aluminum layer is oriented to an 8&deg; inclination relative to the &lcub;0 1 0&rcub; plane of quartz composing the substrate.

Surface acoustic wave device

A surface acoustic wave device is provided having a substrate made of quartz, a pair of inter digital transducer-shape electrode made of an aluminum layer, an electrode pad, and a pair of lattice-shaped reflectors made of the same material as the electrode. The crystal structure of the aluminum layer composing the electrode is a twin crystal structure, where crystal grains of the (&minus;1 1 1) plane and the (0 0 2) plane and crystal grains of the (1 &minus;1 &minus;1) plane and the (0 0 &minus;2) plane are in a twin crystal relationship with the (&minus;1 1 &minus;1) plane and the (1 &minus;1 1) plane of aluminum as the twin boundaries. Also, the &lcub;1 1 1&rcub; plane of the aluminum layer is oriented to an 8&deg; inclination relative to the &lcub;0 1 0&rcub; plane of quartz composing the substrate.

An improved composite magnetic recording head having a core chip with two opposed magnetic members via a magnetic gap and a nonmagnetic layer is disposed on at least one of the magnetic members and a thin magnetic layer is disposed on the non-magnetic layer. The thin magnetic layer has a higher saturation flux density than the magnetic members and the non-magnetic layer increases the adhesive strength between the thin magnetic layer and the magnetic member. The core chip fits into a slide member and is integrated using an adhesive glass.

Growing community of inventors

Chino, Japan

Osamu Iwamoto