Matsushita Electric Industrial Co., Ltd.

Osamu Ikeda

Yuzuru Inaba

Takashi Sasaki

Hitoshi Nakahira

Toshiyuki Kinou

Hiroyuki Miyake

Kanji Uchida

Takashi Azuma

Component suction head for electronic component mounting machines

An application method of adhesive for applying an adhesive by an application nozzle on an application object. Each application object is positioned in a direction intersecting the conveying direction by the move of each tables and the individual application heads corresponding to the tables are individually moved and positioned in the conveying direction, and the adhesive is applied simultaneously to necessary positions of the application objects by the application heads, so that the production efficiency of electronic circuit boards is enhanced in various aspects without increasing the size of the apparatus.

Method and apparatus for application of adhesive

An application method of adhesive for applying an adhesive by an application nozzle on an application object. Each application object is positioned in a direction intersecting the conveying direction by the move of each table, and the individual application heads corresponding to the tables are individually moved and positioned in the conveying direction, and the adhesive is applied simultaneously to necessary positions of the application objects by the application heads, so that the production efficiency of electronic circuit boards is enhanced in various aspects without increasing the size of the apparatus.

Growing community of inventors

Nirasaki, Japan

Osamu Ikeda