Canon Kabushiki Kaisha

Nikon Corporation

Hitachi, Ltd.

Kabushiki Kaisha Toshiba

Dia Semicon Systems Incorporated

Renesas Technology Corp.

Chiyoda Corporation

Dena Co., Ltd.

Nec Corporation

Hitachi Metals, Ltd.

Konami Digital Entertainment Co., Ltd.

Konami Co., Ltd.

Konami Corporation

Hitachi Power Semiconductor Device, Ltd.

Konami Computer Entertainmant Tokyo, Inc.

Osamu Ikeda

Shigeyuki Matsumoto

Masahide Okamoto

Yoshio Nakamura

Takeshi Ichikawa

Hayao Ohzu

Minori Kajimoto

Matsuomi Nishimura

Mamoru Miyawaki

Kazuo Takahashi

Kazuaki Ohmi

Tetsunobu Kohchi

Riichiro Shirota

Kazuyuki Kazami

Masato Nakamura

Shunsuke Inoue

Shin Kikuchi

Masaki Momodomi

Shinji Hiramitsu

Satoshi Matsuyoshi

Nobuhiro Fujinawa

Koji Sasaki

Eisaku Maeda

Masashi Tazawa

Genzo Monma

Yukihiro Satou

Kenji Toyoda

Mikichi Ban

Toshiya Aikawa

Hiroi Oka

Shinya Kawakita

Marco Brandestini

Satoshi Ohta

Takuto Yamaguchi

Richard A Ferraro

Takaaki Miyazaki

Hiroshi Sato

Seiichi Aritome

Yuji Takeuchi

Hiroyuki Ohta

Norikazu Yokonuma

Kazuya Takahashi

Kazunori Katakura

Toshiyuki Hata

Hiromitsu Kuroda

Masahiro Juen

Isamu Yoshida

Yukihiko Sakashita

Jun Iwasaki

Hidetoshi Tsuzuki

Akira Yamashita

Akira Muto

Shohei Hata

Tetsuya Nakatsuka

Koichiro Kawamura

Masaki Kuribayashi

Fumio Murooka

Tetsuo Asaba

Hitoshi Shindo

Nobuo Matsukawa

Kuniharu Muto

Yasuaki Ishiguro

Takashi Kamono

Shinzo Uchiyama

Shosaku Ishihara

Toshihiko Ichise

Kazunari Egami

Yoshimi Okada

Kazuma Kuroki

Tomoyuki Mikuriya

Hidemasa Kagii

Hitoshi Araki

Kenichi Imagawa

Miki Hiraoka

Masayuki Kyoi

Hiroyuki Nakamura

Yousuke Kowno

Masanori Hatakeyama

Hironori Kawai

Yuuichiro Murahama

Ryouichi Kajiwara

Hironao Kimura

Yuichi Oda

Masamitsu Yahata

Kenichiro Kunitomo

Susumu Ishida

Takayuki Kushima

Katsuhiro Sato

Hisato Ide

Masato Shiraga

Tatsuo Ishiyama

Shinji Okubo

Tomotake Touhei

Masashi Umemura

Koichi Higashi

Toshiki Furukawa

Yuhi Ozaki

Yuki Murasato

Masaya Aihara

Provided is a method of molding a composite material by laser metal deposition in which a powder metal material is irradiated with a laser beam while supplying the powder metal material onto a surface of a base material, in which the powder metal material is a mixed powder of an Fe alloy powder and a Cu powder, and a mixing ratio of the Fe alloy powder and the Cu powder is 15% or more and 30% or less by weight % of the Cu powder, and in which the composite material having anisotropy is molded by setting energy of the laser beam to be 9 KJ/g or more and 10 KJ/g or less in a mixed powder ratio.

Method of molding anisotropic composite material and die using anisotropic composite material

A soldering device capable of shortening operation time of soldering and suppressing solder non-wetting is provided. A soldering device includes: a plurality of tubular solder piece guide tubes which have space therein for a solder piece supplied from a supply port to pass through; a first holding unit which holds the solder piece guide tubes; and a heating unit which heats the first holding unit. Tip end portions of the solder piece guide tubes on a soldering side are arranged on an inner side of the first holding unit.

Soldering device

Provided is a sealing structure including a housing that houses a heat generating member or a heat dissipation member thereinside, and a resin that is filled in the housing. In a sectional view, the housing includes a first recess portion in a position facing the heat generating member or the heat dissipation member.

Sealing structure and manufacturing method thereof

Provided is a system and a method which allow hydrogen to be produced both efficiently and in a stable manner when using exhaust gas produced by power generation as a heat source for the dehydrogenation reaction, controlling the temperature of the dehydrogenation reaction within an appropriate range. The system () for producing hydrogen comprises a dehydrogenation reaction unit () for producing hydrogen from an organic hydride by a dehydrogenation reaction in presence of a dehydrogenation catalyst; a first power generation unit () for generating electric power from energy of combustion gas produced by combustion of fuel; a waste heat recovery unit () for receiving heat from exhaust gas expelled from the first power generation unit; a heat exchanger () provided in the waste heat recovery unit for exchanging heat between the exhaust gas and a heat medium; and a circulation line (L-L) for introducing the heat medium heated in the heat exchanger to the dehydrogenation reaction unit in liquid form, and returning the heat medium expelled from the dehydrogenation reaction unit to the heat exchanger; wherein the heat medium is introduced into the dehydrogenation reaction unit at an introduction temperature ranging between 352&#xb0; C. and 392&#xb0; C., the heat medium is expelled from the dehydrogenation reaction unit at an expulsion temperature ranging between 337 &#xb0; C. and 367 &#xb0; C., and a difference between the introduction temperature and the expulsion temperature ranges between 10&#xb0; C. and 50&#xb0; C.

System and method for producing hydrogen

A semiconductor device is provided, the semiconductor device having: a semiconductor chip; a wiring substrate which supports the semiconductor chip and is electrically connected to the semiconductor chip; a first metal plate which supports the wiring substrate; a second metal plate which is arranged between the wiring substrate and the first metal plate; a first bonding part which bonds the wiring substrate and the second metal plate; and a second bonding part which bonds the first metal plate and the second metal plate, and having a thickness of an outer circumferential part of the second metal plate being larger than a thickness of a center part of the second metal plate.

Semiconductor device and power electronics apparatus

To reduce the emission of carbon dioxide and improve the energy efficiency in a hydrogen supply system. The hydrogen supply system () comprises: a reformer () for performing steam reforming of a hydrocarbon; a shift reaction unit () for producing a gas containing hydrogen and carbon dioxide by causing a water gas shift reaction of a gas obtained from the reformer; a first absorber () for absorbing the carbon dioxide contained in the gas obtained from the shift reaction unit in an absorption liquid; a hydrogenation reaction unit () for producing a hydrogenated aromatic compound by causing a hydrogenation reaction of an aromatic compound with a gas that has passed through the first absorber; and a regenerator () for separating the carbon dioxide from the absorption liquid by re-circulating the absorption liquid from the first absorber and heating the absorption liquid with heat generated from the hydrogenation reaction.

Systems and methods for producing hydrogen from a hydrocarbon and using the produced hydrogen in a hydrogenation reaction

A power module includes: a ceramic substrate that includes a principal surface and a back surface, and is provided with a plurality of metal wirings on the principal surface; a semiconductor chip mounted on any metal wiring of the plurality of metal wirings; and a resin part disposed around each of the plurality of metal wirings. Further, side faces of the metal wirings each have: a first region in which a plating film is formed; a second region that is positioned above the first region and that is a non-plating region; and a third region that is positioned between the first region and the second region and in which metal particles are formed. The resin part is bonded to the metal particles, the plating film, and the principal surface of the ceramic substrate.

Semiconductor device

An image signal recording/reproduction apparatus having a generating apparatus that generates a dynamic image signal or a still image signal of a subject captured by an imaging apparatus; an operation apparatus that starts recording of the dynamic image signal or the still image signal generated by the generating apparatus; a recording apparatus that records the dynamic image signal or the still image signal into a recording medium through mechanical drive; a reproduction apparatus that reproduces the dynamic image signal or the still image signal recorded at the recording medium through mechanical drive; and a control apparatus that implements control so that the mechanical drive is sustained if the operation apparatus is operated while the dynamic image signal or the still image signal is being reproduced by the reproduction apparatus and so that the recording apparatus records the dynamic image signal or the still image signal in the recording medium.

Image signal recording/reproduction apparatus, method employed therein, and image signal recording apparatus

The disclosed junction material, manufacturing method thereof, and manufacturing method of junction structure utilize lead-free materials and ensure a high reliability of the junction between a semiconductor element and a frame or substrate, or, between a metal plate and another metal plate. For junctions between a semiconductor element and a frame or substrate, by using as the JUNCTION MATERIAL a laminate material comprising a Zn-based metallic layer (), Al-based metallic layers () on both sides thereof, and X-based metallic layers () (X=Cu, Au, Ag or Sn) on the outside of both the Al-based metallic layers (), even in an oxygen-rich environment, the superficial X-based metallic layers protect the Zn and Al from oxidation until said junction material melts, preserving the wettability and bondability of said junction material as solder and securing the high reliability of the junction.

Junction material, manufacturing method thereof, and manufacturing method of junction structure

One object is to provide a video game system that can technically restrain real money trade. In accordance with one aspect, a server deviceaccording to an embodiment of the present invention includes: a determination unitconfigured to determine whether an exchange of exhibited game contents and bid game contents is concluded based on a game content parameter value characterizing the exhibited game contents and the game content parameter value characterizing the bid game contents; and an updating unitconfigured to update an owned game content storage unitsuch that, only when the determination unitdetermines that the exchange is concluded, the exhibited game contents are stored in association with player identification information of a bidder player and the bid game contents are stored in association with player identification information of an exhibitor player.

Game system

The purpose of the present invention is to increase the reliability of a semiconductor device in which a semiconductor element and a substrate are connected by solder and which is molded by resin. Solder containing easily volatized metals (Zn, Mg, Sb) is used for a solder material, and after a semiconductor elementis connected to a lead frameand wire bonding is carried out, vacuum heat treatment is applied, the easily volatized metals in the solder are volatized to adhere to a substrate surface, and an alloywith the lead frame is formed, thereby roughening the substrate surface and improving the adhesive strength of a sealing resinand the substrate.

Semiconductor device and method for manufacturing same

An electronic camera having a plurality of functions including capturing and recording images is provided. The electronic camera includes an operation input unit for inputting external operations that designate corresponding functions of the camera to be performed, an image pickup unit for capturing the image of an object, and a recorder for recording the image captured by the image pickup unit. The electronic camera further includes a playback unit for at least playing back image information that is recorded on the recording medium and a mode selector for selecting one operation mode of the camera from a plurality of available operation modes that include an operation explanation mode. If the operation explanation mode is selected at the mode selector, the playback unit plays back an operation guide that is pre-stored in a memory, the operation guide explaining at least one of the camera operations and functions thereof.

Electronic camera with self-explanation/diagnosis mode

An image processing apparatus provided with a display unit for displaying an operation picture, showing control indicia (e.g., icons) corresponding to multiple image processing functions, is operated to display the operation picture on an external display device. The operator selects one of the indicia shown on the external display device by operating an input device, such as touch screen of the apparatus or a remote control, to indicate the position of the desired one of the indicia. The operator can thereby quickly and reliably select an image processing function to be executed, without any need to view an operation picture on the display unit when making the selection.

Image processing apparatus and method

Provided is a connecting part for a semiconductor device including a semiconductor element, a frame, and a connecting part which connects the semiconductor element and the frame to each other, in which an interface between the connecting part and the semiconductor element and an interface between the connecting part and the frame respectively have the area of Al oxide film which is more than 0% and less than 5% of entire area of the respective interfaces. The connecting part has an Al-based layer and first and second Zn-based layers on main surfaces of the Al-based layer, a thickness ratio of the Al-based layer relative to the Zn-based layers being less than 0.59.

Connecting member for connecting a semiconductor element and a frame, formed of an Al-based layer and first and second Zn-based layers provided on surfaces of the Al-based layer

Growing community of inventors

Yokohama, Japan

Osamu Ikeda