Nuflare Technology, Inc.

Osamu Iizuka

Kenji Ohtoshi

Yukitaka Shimizu

Takahito Nakayama

Hikaru Yamamura

Sumito Nakada

Hirofumi Morita

Kiyoshi Hattori

Hitoshi Sunaoshi

Tsubasa Nanao

Hideyuki Tsurumaki

Ryoichi Kakehi

Shunji Shinkawa

Eita Fujisaki

In one embodiment, a multi charged particle beam writing apparatus includes a measurement unit measuring a first beam shape of a multi-beam based on a beam current of each beam of the multi-beam or an intensity of charged particles reflected from a reflection mark provided on a stage, an amounts of adjustment calculator calculating amounts of adjustment of a reduction ratio and a rotation angle of the multi-beam based on the first beam shape, a correction map generation unit generating a first correction map in which an amount of displacement is defined that is obtained for each beam of the multi-beam based on a difference between a beam shape based on the amounts of adjustment and the first beam shape, a writing data processor generating shot data in which an amount of irradiation with each beam of the multi-beam is defined by converting writing data in which information regarding a graphic pattern to be written is defined, and correcting the amount of irradiation with each beam defined in the shot data based on the first correction map, and a controller controlling the reduction ratio and rotation angle of the multi-beam based on the amounts of adjustment.

Multi charged particle beam writing apparatus and multi charged particle beam writing method

In one embodiment, a multi charged particle beam writing apparatus includes a stage position detector detecting a position of the stage which holds a substrate to be written, a mark disposed on the stage, a beam position detector detecting a beam position of each beam by allowing the multiple beams to pass over the mark, a beam shape detector detecting a beam shape of the multiple beams at predetermined time intervals based on the detected beam position and the detected position of the stage, the multiple beams being used to irradiate the substrate, and a writing data processor calculating an amount of irradiation correction of each beam for correcting the beam shape based on the detected beam shape.

In one embodiment, a multi-charged-particle-beam writing apparatus includes a shaping aperture array plate including a plurality of first apertures through which a charged particle beam passes to form multiple beams, a movable stage on which a writing target substrate is placed, an inspection aperture plate disposed on the stage, the inspection aperture plate including a second aperture through which one of the multiple beams passes, a current detector detecting a current of the beam that has passed through the second aperture of the inspection aperture plate, a deflector deflecting the multiple beams, the deflector controlling deflection of one of the multiple beams such that the one beam is located at a predetermined position in a region including the second aperture and a surrounding region of the second aperture, and a calculator obtaining a beam position based on the beam current detected by the current detector.

Multi-charged-particle-beam writing apparatus and beam evaluating method for the same

In one embodiment, a multi charged particle beam writing apparatus includes a plurality of reflective marks disposed on a stage, an inspection aperture member configured to allow one beam to pass therethrough, a first detector detecting a beam current of a beam passed through the inspection aperture member, a second detector detecting charged particles reflected from the reflective marks, a first beam shape calculator generating a beam image based on the beam currents detected by the first detector and calculating a reference beam shape, and a second beam shape calculator calculating a beam shape based on changes in intensity of the reflected charged particles and a position of the stage. The reference beam shape is calculated before writing. During writing, the beam shape based on reflected charged particles is calculated, and variation of the beam shape is added to the reference beam shape.

An aperture array alignment method according to the present embodiment includes switching on and off of each of multiple beams using a blanking aperture array plate, and detecting beam current on a stage using a detector. At least one of the multiple beams is turned on to scan the blanking aperture array plate, and a current map is generated on the basis of a result of detection of the beam current made by the detector and a position of the blanking aperture array plate. An on-beam is switched from one to another to generate the current map for each of the on-beams. The position of the blanking aperture array plate is adjusted on the basis of the current maps for the on-beams.

Aperture array alignment method and multi charged particle beam writing apparatus

In one embodiment, a multi charged particle beam writing apparatus includes an aperture plate having a plurality of holes to form multiple beams, a blanking aperture array having a plurality of blankers which switch ON-OFF of corresponding respective beams among the multiple beams, a stage on which a writing target substrate is placed, an inspection aperture provided on the stage and that allows one beam among the multiple beams to pass therethrough, a deflector deflecting the multiple beams, a current detector detecting a beam current of each of the multiple beams that has passed through the inspection aperture in a case where the multiple beams are scanned on the inspection aperture, and a control computing machine that generates a beam image based on the detected beam current and detects a defect of the blanking aperture array or the aperture plate based on the beam image.

According to one embodiment, a multi charged particle beam writing apparatus includes an objective lens adjusting a focus position of multiple beams, a coil correcting astigmatism of the multiple beams, an inspection aperture disposed in a stage and configured to allow one beam of the multiple beams to pass therethrough, a deflector deflecting the multiple beams, a current detector detecting a beam current of each beam of the multiple beams scanned over the inspection aperture in the XY direction and passed through the inspection aperture, and a controller generating a beam image on the basis of the detected beam current, calculating a feature quantity of the beam image, and controlling the objective lens or the coil on the basis of the feature quantity.

In one embodiment, a multi charged particle beam writing apparatus includes an aperture plate forming multiple beams, a stage on which a writing target substrate is placed, a stage position detector detecting the position of the stage, an inspection aperture plate provided in the stage, the inspection aperture plate permitting one of the multiple beams to pass through the inspection aperture plate, a deflector deflecting the multiple beams, a current detector detecting a beam current of each of the multiple beams scanned over the inspection aperture plate in X and Y directions and passed through the inspection aperture plate, and a control computer generating a beam image based on the detected beam currents and calculating positions of the beams based on the beam image and the position of the stage.

In one embodiment, a multi charged particle beam drawing apparatus includes an emitter emitting a charged particle beam, a shaping aperture array in which a plurality of first openings are formed, and which receives irradiation of the charged particle beam in an area including the plurality of first openings, and forms a multi-beam by allowing part of the charged particle beam to pass through a corresponding one of the plurality of first openings, a blanking aperture array in which a plurality of second openings are formed, through each of which a beam is passed, corresponding to part of the multi-beam which has passed through the plurality of first openings, the plurality of second openings each including a blanker that performs blanking deflection of a beam, and a movement controller moving the shaping aperture array or the blanking aperture array, and adjusting space between the shaping aperture array and the blanking aperture array.

Multi charged particle beam drawing apparatus and multi charged particle beam drawing method

In one embodiment, a multi charged-particle beam writing apparatus includes a plurality of blankers switching between ON and OFF state of a corresponding beam among multiple beams, a main deflector deflecting beams having been subjected to blanking deflection to a writing position of the beams in accordance with movement of a stage, a detector scanning a mark on the stage with each of the beams having been deflected by the main deflector and detecting a beam position from a change in intensity of reflected charged particles and a position of the stage, and a beam shape calculator switching an ON beam, scanning the mark with the ON beam, and calculating a shape of the multiple beams from a beam position. A shape of a deflection field of the main deflector is corrected by using a polynomial representing an amount of beam position shift that is dependent on a beam deflection position of the main deflector and then the mark is scanned with the ON beam. The polynomial is different for each ON beam.

Multi charged-particle beam writing apparatus and adjustment method for the same

A multi charged particle beam apparatus includes a forming aperture array substrate, where there are formed a plurality of first openings and a plurality of second openings on the periphery of the whole plurality of first openings, each being larger than each of the plurality of first openings, to form multi-beams by the plurality of first openings, and to be able to form a plurality of calibration beams by the plurality of second openings, a shutter to select, one by one, one of the plurality of calibration beams formed by passing through the plurality of second openings, in accordance with a slide position, and a detector to detect a secondary electron including a reflected electron generated by scanning a mark by deflecting the selected calibration beam, in the state of all the multi-beams controlled to be OFF.

Multi charged particle beam apparatus, and shape adjustment method of multi charged particle beam image

A method of measuring beam positions of multi charged particle beams includes acquiring a number of multi charged particle beams needed for the measurement reproducibility of a current amount to be within the range of an allowable value. The method further includes setting measurement points depending on a desired dimensional accuracy value in an irradiation region irradiated by the whole of the multi charged particle beams, and setting, for each of a plurality of measurement points, a beam region, including a measurement point of measurement points irradiated by a plurality of beams whose number is the number of beams needed for the measurement reproducibility in the multi charged particle beams. Further, the method includes measuring, for each of a plurality of measurement points, the position of a measurement point concerned in a plurality of measurement points by using a plurality of beams of a corresponding beam region.

Method of measuring beam position of multi charged particle beam, and multi charged particle beam writing apparatus

A writing apparatus includes a writing unit to include a deflector for deflecting a charged particle beam and write a pattern on a target object by the charged particle beam, a decision unit to decide a representative position of a deflection result range in which the charged particle beam was deflected with respect to a writing direction by the deflector, and a correction unit to correct drift of the charged particle beam by using a drift amount at the representative position of the deflection result range.

Method for correcting drift of charged particle beam, and charged particle beam writing apparatus

According to one aspect of the present invention, a rotation angle measuring method of a multi-charged particle beam image includes two-dimensionally scanning a mark arranged on a stage in a multi-charged particle beam writing apparatus using, among multi-charged particle beams that can be used for exposure, a plurality of representative beams of which number is smaller than the number of beams constituting the multi-charged particle beams, creating a two-dimensional image of the plurality of representative beams based on signals obtained by two-dimensional scanning, and acquiring a rotation angle of the multi-charged particle beam image using the two-dimensional image.

Rotation angle measuring method of multi-charged particle beam image, rotation angle adjustment method of multi-charged particle beam image, and multi-charged particle beam writing apparatus

A charged particle beam writing method according to embodiments of the present disclosure includes: storing in a charged particle beam writing apparatus a position coordinate at which a drift amount is diagnosed; storing in the charged particle beam writing apparatus first and second time interval patterns which define time intervals to diagnose the drift amount of the charged particle beam; performing first writing of irradiating a target object with the charged particle beam, and writing a writing pattern on the target object while diagnosing the drift amount based on the first time interval pattern during the writing; and performing second writing of writing a predetermined writing pattern while diagnosing the drift amount when the writing reaches the position coordinate and diagnosing the drift amount based on the second time interval pattern during the writing after the writing reaches the position coordinate.

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Yokohama, Japan

Osamu Iizuka