Tokyo Electron Limited

Tokyo Electron Kyushu Limited

Osamu Hirose

Kiyohisa Tateyama

Tetsuya Sada

A cooling device for cooling an object to be processed to a target temperature comprises a plurality of contact members mounted on a placing table, for supporting the object such that the object opposes a top surface of the placing table with an interval, temperature sensors for outputting temperature information of the object supported by the contact members, a first cooling unit for cooling the placing table to a temperature lower than the target temperature to cool the object, a second cooling unit for heating the object cooled by the first cooling unit to a temperature almost equal to the target temperature, and a contrast circuit for performing a switching operation between cooling by the first cooling unit and heating by the second cooling unit on the basis of the temperature information from the temperature sensors.

Cooling device and cooling method

The processing apparatus prevents difficulty in separation of the substrate from the base because of charges on the substrate when the substrate is lifted from the base for substrate placing during processing. The processing apparatus comprises pins to lift up the substrate on the base and a neutralization apparatus to discharge ionized gas to the gap between the bottom of the substrate lifted from the base by the pins and the top of the base. When ionized gas is discharged to the substrate and the base, the charges are neutralized. In addition, the processing apparatus comprises three or more of proximity pins, which form gap between the bottom of the substrate on the base and the top of the base to prevent a frictional electricity being formed therein.

Processing apparatus and a processing method

A substrate heat treating apparatus with a substrate support plate having a plurality of holes, a heating element to heat the substrate through the support plate, and substrate support pins extending through the plurality of holes in the support plate. Each support pin is mounted so that it is slidable in a horizontal direction within each of the plurality of holes in the support plate.

Heat treating apparatus

The processing apparatus prevents difficulty in separation of the substrate from the base because of charges on the substrate when the substrate is lifted from the base for substrate placing during processing. The processing apparatus comprises pins to lift up the substrate on the base and a neutralization apparatus to discharge ionized gas to the gap between the bottom of the substrate lifted from the base by the pins and the top of the base. When ionized gas is discharged to the substrate and the base, the charges are neutralized.

The present invention is a heat treating apparatus, including a support plate having an object to be treated disposed thereon, heating member for heating the object through the support plate, and support pins extending through the support plate so as to support the object, wherein the support plate is provided with holes each sized large enough to permit a horizontal movement of the support pin, and the support pin is movable in a horizontal direction within the hole made in the support plate. The present invention also is a heat treating apparatus, including a support plate arranged within a treating chamber and having an object to be treated disposed thereon, heating member for heating the object through the support plate, a cover member arranged in the treating chamber to define a treating space between the support plate and the cover member, a shutter member partitioning the treating space and capable of opening/closing the partitioned treating space, and a gap setting member disposed between the cover member and the shutter member.

A substrate treatment apparatus according to an aspect of the invention includes a table for placing thereon an object to be treated, heating means for heating the object with the table interposed therebetween, and a plurality of support members which project from the table for supporting the object with a space interposed between the object and the table. The height of each of the support members can be varied in accordance with a surface temperature distribution of the object during treatment. A substrate treatment apparatus according to another aspect of the invention includes a table for placing thereon an object to be treated, and heating means for heating the object with the table interposed therebetween. The table has a surface thereof divided into regions of different heat radiation states in accordance with a surface temperature distribution of the object during treatment of the object.

Substrate heat treatment table apparatus

A substrate processing apparatus includes a plurality of easily removable processing units including at least a heating unit for heating a substrate and a cooling unit for cooling the substrate, and an outer frame having a plurality of compartments. Each compartment has an opening through which a processing unit may be inserted or removed. The plurality of compartments are arranged vertically. Each compartment has a plurality of first joint members connected to utility lines including those of an electrical system, a control system, and a fluid system. The electrical, control, and fluid systems are necessary for operating the processing units. Each processing unit has a plurality of second joint members connected to the first joint members.

Growing community of inventors

Kumamoto, Japan

Osamu Hirose