Tdk Corporation

Osamu Hirose

Yukihiko Shirakawa

Shintaro Kon

Tatsuo Inagaki

Masahiko Konno

Hiroyuki Matsumoto

Akira Nakamura

Yoshinori Sato

Takashi Fukui

Hisayuki Abe

Toru Yoshida

Masanori Abe

Hisashi Kobuke

Isao Nakahata

Hiroshi Tsuyuki

Yoji Tozawa

Satoshi Kurimoto

Ko Onodera

Kazunari Kimura

Noriyuki Saito

Makikazu Takehana

Akira Suda

Toshiaki Ochiai

Taketo Sasaki

A magnetic core excellent in productivity, having stable magnetic characteristics, and easy to handle for a coil device including a conductor and is formed by stacking a plurality of soft magnetic thin ribbons divided into small pieces.

Magnetic core and method for manufacturing same, and coil component

A laminated electronic component includes an element body formed by laminating an insulating layer and having a bottom surface used as a mounting surface, and a bottom surface electrode formed on the bottom surface of the element body and containing glass and a sintered metal. The bottom surface electrode includes a first electrode layer and a second electrode layer formed on the element body side from the first electrode layer, an edge portion of the second electrode layer is covered with an overcoat layer which is a part of the element body, the first electrode layer is laminated on the second electrode layer with the overcoat layer interposed therebetween, and a content of glass in the first electrode layer is larger than a content of glass in the second electrode layer.

Laminated electronic component with differing glass content electrodes

Provided is a more versatile black marker composition which achieves excellent adhesion between a mark and an electronic component element body and excellent contrast of a mark regardless of the composition of the electronic component element body, the black marker composition containing borosilicate glass and a black oxide, in which a crystallization temperature of the borosilicate glass is less than 910&#xb0; C., and an amount of Zn in terms of ZnO is 0.05% by mass or less based on 100% by mass of an inorganic solid content in terms of an oxide contained in the black marker composition.

Black marker composition and electronic component using the same

An electronic component comprises an element body and an outer electrode. The element body has a pair of end faces opposing each other, a pair of main faces opposing each other while extending so as to connect the pair of end faces to each other, and a pair of side faces opposing each other while extending so as to connect the pair of main faces to each other. The outer electrode is formed on the end face side of the element body and covers a portion of the main and side faces adjacent to the end face. At least a surface of an electrode portion of the outer electrode located on the side face side thereof is covered with an insulating layer.

Electronic component and method of manufacturing electronic component

A chip element in the form of a substantially rectangular parallelepiped having end surfaces and side surfaces is formed (step of forming chip element). An electrically conductive green sheet is formed (step of forming electrically conductive green sheet). An electrically conductive paste is applied to the end surfaces of the chip element (step of application electrically conductive paste). A chip element is formed in which the electrically conductive green sheet is attached to the end surface via the electrically conductive paste applied to the end surface of the chip element (step of attaching electrically conductive sheet). In the step of attaching, the end surface of the electrically conductive green sheet on the side of the side surfaces is positioned on the outside of the side surfaces, and the electrically conductive paste applied to the end surface is pressed out into a space between the electrically conductive green sheet and ridge portions.

Method for manufacturing electronic component

The multilayer chip varistor of the present invention includes a varistor body including a plurality of varistor layers and inner electrodes arranged to sandwich each of the varistor layers, terminal electrodes formed on each ends of the varistor body and connected to the inner electrodes, and glass layers formed between the varistor body and the terminal electrodes. In addition, a plated layers and are formed on the surface of the terminal electrodes.

Multilayer chip varistor and method of manufacturing the same

The present invention provides a conductive pattern that has low electric resistivity, is superior in adhesion to a substrate and does not cause substrate cracking during plating, a multilayered substrate incorporating such a conductive pattern, and a fabricating method for a multilayered substrate. At first, a conductive composition including a metal powder containing not less than 95 mass % of Ag, a sintering restrainer containing Cr and/or Cr compound, a dielectric loss conditioner containing Mn and/or Mn compound, and a vehicle is prepared. Next, electrodes made of the conductive composition are formed on a plurality of green sheets. The plurality of green sheets formed with the electrodes are then laminated to form a laminated product, whereafter the laminated product is sintered.

Conductive pattern incorporated in a multilayered substrate, multilayered substrate incorporating a conductive pattern, and a method of fabricating a multilayered substrate

Growing community of inventors

Tokyo, Japan

Osamu Hirose