Tokyo Electron Limited

Intel Corporation

Tel Kyushu Limited

Nikon Corporation

Tokyo Electron Kyushu Limited

Osamu Hirakawa

Masami Akimoto

Xavier Francois Brun

Masaru Honda

Taro Yamamoto

Noriyuki Anai

Charles Wayne Singleton, Jr

Hiroyuki Nagasaka

Yoshio Kimura

Takeshi Tamura

Akira Fukutomi

Yasuharu Iwashita

Naoto Yoshitaka

Yasuhiro Sakamoto

Mitsuru Ushijima

Yoshitaka Otsuka

Kazutaka Noda

Takayuki Toshima

Shinichi Hayashi

Yasushi Hayashida

Masanori Tateyama

Masataka Matsunaga

Eiji Manabe

Masashi Moriyama

Norihiko Okamoto

Takashi Sakaue

Yasutaka Soma

Katsuhiro Iino

Jiro Harada

Keisuke Shigaki

Hiroshi Komeda

An apparatus for removing at least one foreign substance includes a detection unit detecting the at least one foreign substance adhered to a holding surface of a suction holding unit configured to suck and hold a substrate, a removal unit removing the at least one foreign substance adhered to the holding surface using fluid, and a movement mechanism configured to move the detection unit and the removal unit.

Foreign substance removal apparatus and foreign substance detection apparatus

A separation apparatus for separating a superposed substrate in which a processing target substrate and a supporting substrate are joined together with an adhesive, into the processing target substrate and the supporting substrate, includes: a first holding unit which holds the processing target substrate; a second holding unit which holds the supporting substrate; a moving mechanism which relatively moves the first holding unit or the second holding unit in a horizontal direction; a load measurement unit which measures a load acting on the processing target substrate and the supporting substrate when the processing target substrate and the supporting substrate are separated; and a control unit which controls the moving mechanism based on the load measured by the load measurement unit.

Separation apparatus, separation system, and separation method

A method includes: a first step of disposing the superposed substrate at a position where the superposed substrate is not in contact with a first holding unit and a second holding unit in a space between the first holding unit and the second holding unit, and supplying an inert gas into the space; a second step of thereafter relatively moving the first holding unit and the second holding unit in the vertical direction, and holding the processing target substrate by the first holding unit and holding the supporting substrate by the second holding unit; and a third step of thereafter relatively moving the first holding unit and the second holding unit in the horizontal direction while heating the processing target substrate held by the first holding unit and the supporting substrate held by the second holding unit, to separate the processing target substrate and the supporting substrate from each other.

Separation method, separation apparatus, and separation system

A peeling device for peeling off a substrate to be processed and a support substrate from an overlapped substrate, the overlapped substrate being formed by bonding the substrate to be processed and the support substrate by an adhesive, which includes: a first holding unit configured to heat the substrate to be processed and configured to hold the substrate to be processed; a second holding unit configured to heat the support substrate and configured to hold the support substrate; a moving mechanism configured to horizontally move at least one of the first holding unit and the second holding unit relative to each other; and an inert gas supply mechanism configured to supply an inert gas onto a bonding surface of the substrate to be processed or a bonding surface of the support substrate.

Peeling device, peeling system and peeling method

A separation apparatus for separating a superposed substrate in which a processing target substrate and a supporting substrate are joined together with an adhesive, into the processing target substrate and the supporting substrate includes: a first holding unit that includes a heating mechanism heating the processing target substrate and holds the processing target substrate; a second holding unit that includes a heating mechanism heating the supporting substrate and holds the supporting substrate; a moving mechanism that relatively moves at least the first holding unit or the second holding unit in a horizontal direction; and a porous part that is annularly provided along an outer peripheral portion of the first holding unit and formed with a plurality of pores, and supplies an inert gas to the outer peripheral portion of the first holding unit holding the processing target substrate.

Disclosed is a substrate conveyance apparatus capable of suppressing a substrate from being damaged. The substrate conveyance apparatus includes a plurality of nozzles, and a main body unit. The plurality of nozzles are configured to jet a gas toward a surface of a substrate to hold the substrate in a non-contact manner. The main body unit is provided with the plurality of nozzles. At least surfaces of the plurality of nozzles are formed of a resin.

Substrate conveyance apparatus and substrate peeling system

A cleaning method that peels off an overlapped substrate and cleans a bonding surface of a peeled substrate to be processed, the overlapped substrate including the substrate to be processed and a support substrate bonded together with a protectant, a peeling agent and an adhesive stacked in order therebetween from the substrate to be processed, the cleaning method comprising: removing the protectant by supplying a solvent of the protectant from a solvent supply part to the bonding surface of the substrate to be processed; and removing the peeling agent by absorbing the peeling agent, which has been peeled from the bonding surface of the substrate to be processed, using a peeling agent absorption part.

Cleaning device, peeling system, cleaning method and computer-readable storage medium

In accordance with some embodiments of the present disclosure, a substrate holding apparatus is provided. The substrate holding apparatus includes a first holding part, a second holding part and a controller. The first holding part adsorbs and holds a first region including a central portion of a substrate. The second holding part adsorbs and holds a second region located outside the first region of the substrate. The second holding part adsorbs and holds the second region of the substrate after the first holding part adsorbs and holds the first region of the substrate.

Substrate holding apparatus and substrate holding method

The present invention is used for separating a superposed substrate in which a processing target substrate and a supporting substrate are joined together with an adhesive into the processing target substrate and the supporting substrate, and includes: a separation processing station performing predetermined processing on the processing target substrate, the supporting substrate, and the superposed substrate; a transfer-in/out station transferring the substrates into/from the separation processing station; and a transfer unit transferring the substrates between the separation processing station and the transfer-in/out station, wherein the separation processing station includes: a separation unit separating the superposed substrate into the processing target substrate and the supporting substrate; a first cleaning unit cleaning the processing target substrate separated in the separation unit; and a second cleaning unit cleaning the supporting substrate separated in the separation unit.

Separation system, separation method, program and computer storage medium

A delamination system delaminates a laminated substrate, in which a first substrate and a second substrate are bonded together, into the first substrate and the second substrate. The delamination system has a first processing block processing the laminated substrate or the delaminated first substrate and a second processing block processing the delaminated second substrate. The first processing block has a delamination station having a delamination device that delaminates the laminated substrate transferred by a first transfer device into the first substrate and the second substrate. The second processing block has a second cleaning station and a delivery station. The second cleaning station has a second cleaning device cleaning the delaminated second substrate. The delivery station is disposed between the second cleaning station and the delamination station. The delivery station receives the delaminated second substrate from the delamination station and delivers it to the second cleaning station.

Delamination system

According to an embodiment of the present disclosure, a substrate inverting device for inverting front and rear surfaces of a substrate is provided. The substrate includes a first holding unit configured to hold one surface of the substrate and a second holding unit disposed to face the first holding unit and configured to hold one surface of the substrate. Further, the substrate includes a moving mechanism configured to relatively move at least one of the first holding unit and the second holding unit to approach each other and stay spaced apart from each other, and a transfer mechanism configured to hold the one surface of the substrate. In this case, a support of the substrate in the first holding unit, the second holding unit and the transfer mechanism is performed by a Bernoulli chuck.

Substrate inverting device, substrate inverting method, and peeling system

A joint apparatus of the present invention includes: a pre-thermal processing unit including a first thermal processing plate mounting and thermally processing a superposed substrate where substrates are superposed on each other with joint portions of the substrates in contact with each other, and a first pressure reducing mechanism; a joint unit including a second thermal processing plate mounting and thermally processing the superposed substrate processed in the pre-thermal processing unit, a pressurizing mechanism pressing the superposed substrate on the second thermal processing plate toward the second thermal processing plate side, and a second pressure reducing mechanism; and a post-thermal processing unit including a third thermal processing plate mounting and thermally processing the superposed substrate processed in the joint unit, and a third pressure reducing mechanism, wherein each of the pre-thermal processing unit and the post-thermal processing unit is hermetically connected to the joint unit.

Joint apparatus, joint method, and computer storage medium

An exposure apparatus for emitting exposure light onto a substrate via a projection optical system and a liquid to expose the substrate includes a supply pipe which supplies the liquid; a recovery pipe which recovers the liquid; a connection pipe which connects the supply pipe and the recovery pipe; and a switching device which switches a flow path of the liquid so that when liquid supply is stopped, the liquid that has flowed into the supply pipe flows to the recovery pipe via the connection pipe. The apparatus may further include a temperature regulation apparatus connected to the supply pipe, which performs temperature regulation of the liquid supplied to the supply pipe, and has a rough temperature regulator which roughly regulates the temperature of the liquid, and a fine temperature regulator which is arranged between the rough temperature regulator and the supply pipe and performs fine regulation of this temperature.

Exposure apparatus and device manufacturing method

An exposure apparatus exposes a substrate by projecting a pattern image onto the substrate via a projection optical system and a liquid. The exposure apparatus includes a liquid supply device which supplies liquid onto the substrate from above the substrate through a first and second supply ports disposed in a vicinity of a projection area onto which the pattern image is projected, and a liquid recovery device which recovers liquid on the substrate from above the substrate through an inside recovery port disposed outside the first and second supply ports and an outside the second recovery port disposed outside the inside recovery port.

Growing community of inventors

Koshi, Japan

Osamu Hirakawa