Fujitsu Corporation

Osamu Higashi

Hiroshi Yamada

Tomomi Okamoto

Naoaki Nakamura

Ryuji Ito

There is provided a heat sink for measuring temperature of electronic component. The heat sink includes a heat radiating plate, a fin, a heat receiving plate, and a temperature detector. The heat radiating plate has a first surface that receives heat from the electronic component. The fin is for radiating heat energy conducting through the heat radiating plate and is connected to the heat radiating plate. The heat receiving plate arranged apart from the heat radiating plate has a second surface movable to be parallel to the first surface. The temperature detector that detects a temperature is disposed on the heat receiving plate.

Heat sink for measuring temperature of electronic component

A bath apparatusreserves a liquidas a heating medium and includes an input partition bath, a first intermediate partition bath, a heat partition bath, a second intermediate partition bathand a removing partition baththat are divided by gatesthroughand sequentially arranged in a direction in which a printed board assembly where components are loaded onto a printed board moves. The temperatures of liquids-and-in the input partition bathand the first partition bathare a preheating temperature. The temperature of a liquid-in the heat partition bathis a soldering temperature. The gateis gradually opened while the printed board assemblyis located in the first intermediate partition bathand before the printed board assemblyis conveyed into the heat partition bath. The liquid in the heat partition bathis mixed with the liquid in the first intermediate partition bath, and thus the temperature of the first intermediate partition bathis gradually increased to the soldering temperature. The temperature of the printed board assemblyis gradually increased from the preheating temperature to the soldering temperature.

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Kawasaki, Japan

Osamu Higashi