Renesas Technology Corp.

Sumitomo Bakelite Company Limited

Panasonic Holdings Corporation

Taisei Corporation

Mitsubishi Denki Kabushiki Kaisha

Panasonic Corporation

Fuji Electric Systems Co. Ltd.

Osamu Hashimoto

Koji Yoshino

Masayuki Kubo

Ryosuke Suga

Masafumi Sadahira

Yoshihiro Tanaka

Kazuhiko Nishi

Jun Sakamoto

Masaaki Tanimura

Kazuyuki Najima

Ryuji Nozaki

Nobuyuki Kobayashi

Yoshiharu Oomori

Yasuhiro Okuma

Mitsuhiro Hamada

Hirokazu Tokuda

Hiroyuki Matsuo

Tatsuya Hayashida

Goro Tanaka

A microwave treatment apparatus includes a treatment chamber, a microwave supply, and a resonator unit. The treatment chamber is surrounded by a plurality of walls, and accommodates a heating target. The microwave supply supplies a microwave to the treatment chamber. The resonator unit is provided on one wall of the plurality of walls, and the resonator unit has a resonance frequency in a frequency band of the microwave. In this embodiment, the impedance of the surface of the resonator unit can be changed by controlling the frequency of the microwave supplied to the treatment chamber. This makes it possible to control the standing wave distribution within the treatment chamber, that is, the microwave energy distribution within the treatment chamber. As a result, in the cases where a plurality of heating targets need to be heated simultaneously, desired dielectric heating is conducted for each of the heating targets.

Microwave processing device

A microwave heating device includes a heating chamber that accommodates an object to be heated, a microwave generator configured to generate microwaves, a wave guide tube configured to guide the microwaves to the heating chamber, and an electromagnetic field distribution adjustment device that is provided in a two-dimensional region located in at least a part of a wall face within the heating chamber. The electromagnetic field distribution adjustment device has a plurality of metal pieces arranged to fill a predetermined two-dimensional region, and a switch provided between two metal pieces adjacent to each other among the plurality of metal pieces. The switch is connected to the two metal pieces adjacent to each other through two conductors each of which is provided on a corresponding one of the two metal pieces adjacent to each other, and smaller than the two metal pieces adjacent to each other. According to the present aspect, uneven heating, which is caused by heating an object to be heated with a microwave heating device, can be reduced.

Electromagnetic field distribution adjustment device and microwave heating device

A microwave heating device includes a heating chamber that accommodates an object to be heated, a microwave generator configured to generate microwaves, a wave guide tube configured to guide the microwaves to the heating chamber, and an electromagnetic field distribution adjustment device provided in a predetermined two-dimensional region within the heating chamber. The electromagnetic field distribution adjustment device has a plurality of metal pieces and a plurality of switches. The plurality of metal pieces are arranged to fill the predetermined two-dimensional region. The plurality of switches connect the plurality of metal pieces with one another. A serially connected row of metal pieces is configured by connecting one metal piece among the plurality of metal pieces to at most two metal pieces adjacent to the one metal piece through at least two of the plurality of switches. The present exemplary embodiment can achieve a low-cost electromagnetic field distribution adjustment device that heats an object to be heated more uniformly, while preventing a drop in heating efficiency.

There are provided heating chamber, and reflection angle control device provided on upper wall configuring at least part of walls of heating chamber and configured to control a reflection angle of a microwave to control standing wave distribution in heating chamber. Reflection angle control device controls the reflection angle of the microwave when the microwave radiated from microwave radiation device is not directly absorbed into heating target but is reflected by the wall. Standing wave distribution in heating chamber can thus be controlled to be different from ordinary distribution for improvement in local heating performance.

Microwave heating device

Provided is a fiber reinforced cement based mixed material having high tensile strength and high toughness, the mixed material comprising a cementitious composition with fast development of early strength; a small hydration heat temperature; and a small shrinkage during curing. The fiber reinforced cement based mixed material contains 100 wt. parts of cement, 5-30 wt. parts of silica fume, 30-80 wt. parts of at least one pozzolanic material excluding the silica fume, 5-25 wt. parts of limestone powder, at least one chemical admixture, water, 70-150 wt. parts of aggregate having a largest aggregate diameter of 1.2-3.5 mm, and fibers, wherein at least some of the fibers comprise a fiber having asperities formed in the surface, the fiber having asperities being formed such that a ratio (h/H) of a depth h of each of recessed portions among the asperities to a smallest cross-sectional diameter H thereof is 0.05-0.8.

Fiber reinforced cement based mixed material

A cementitious matrix in which the development of early strength is fast, the hydration heat temperature is small, and the amount of shrinkage during curing is small, while keeping the fluidity when concrete is fresh, is provided. The cementitious matrix is characterized by comprising 100 parts by weight of Portland cement, 5 to 30 parts by weight of silica fume, 5 to 25 parts by weight of limestone powder, 30 to 80 parts by weight of at least one of ground blast furnace slag or fly ash, at least one chemical admixture, water, and 70 to 150 parts by weight of aggregate having a largest aggregate diameter of 1.2 to 3.5 mm.

Cementitious matrix and fiber reinforced cement based mixture

Provided is a fiber reinforced cement based mixed material capable of securing high tensile strength and high toughness even after development of a crack. A fiber reinforced cement based mixed material contains cement, a mineral admixture, water, a chemical admixture, aggregate particles, and fibers, the aggregate particles contained in the fiber reinforced cement based mixed material in a proportion of 50 to 95% in terms of a weight ratio to the total weight of the cement and the mineral admixture, wherein a mean particle diameter of the aggregate particles is 0.2 to 0.8 mm, and at least some of the fibers is formed to be a bumpy fiber having asperities formed in the surface thereof, and a ratio (h/H) of a depth h of each of recessed portions among the asperities of the bumpy fiber to a smallest cross-sectional diameter H thereof is 0.05 to 0.8.

A power conversion apparatus includes serially connected arms U and X, serially connected arms V and Y, serially connected arms W and Z, and a capacitor, the pairs of serially connected arms and the capacitor all connected in parallel to one another. The input-side arms U and X and the output-side arms W and Z are subjected to PWM control so that the arms W and Z are controlled to have a voltage that is lower than that of the arms U and X, thereby providing a step down operation. A step up operation also can be provided by an opposite relation in which the arms W and Z are controlled to have a voltage that is higher than that of the arms U and X, thereby to expand the range within which the output voltage is controlled with the effect of reducing distortion.

Power conversion apparatus

A method of manufacturing molded materials of a thermosetting resin composition in a method of granulating a molding material of the thermosetting resin composition, in which a sheet producing step for transferring the molding material in a molten state to a subsequent stage while processing the same material into a sheet type material of a predetermined thickness, a first processing step for cutting the sheet type material, which has thus been transferred to a stage for carrying out this step, in parallel with the transfer direction thereof to a predetermined width, and thereby obtaining a processed body of laterally arranged rows of elongated string-like materials, a step of cutting the processed body, which is obtained in the first processing step, to a predetermined length with respect to the transfer direction, a transfer direction changing step for transferring the processed body, which has been subjected to the cutting step, to a subsequent stage by changing the transfer direction of the processed body at 90 degrees with respect to the longitudinal processed body cutting line, and a second processing step for cutting the processed body, the transfer direction of which has been changed, in parallel with the processed body transferring direction to a predetermined width, and thereby obtaining granulated materials are carried out in order.

Method of and apparatus for manufacturing molded materials of thermosetting resin composition

A bare chip carrier for holding a bare chip includes a bare chip carrier base member, a bump electrode which is located above a principal surface of the bare chip carrier base member and which is to be connected to a pad electrode of the bare chip, a bare chip carrier electrode which is formed on a back surface of the bare chip carrier base member and which has a recessed portion, and a wiring that connects the bump electrode to the bare chip carrier electrode.

Bare chip carrier and method for manufacturing semiconductor device using the bare chip carrier

Versatility of an inspection apparatus suitable for use in a burn-in inspection operation is improved so as to enable inspection of various semiconductor integrated circuits. A plurality of relay pins which are electrically connected to wiring patterns laid on a base board are provided. Sockets for receiving a semiconductor integrated circuits are mounted on a base board. An exchange board is provided for electrically connecting socket terminals of the socket to specific relay pins. The exchange board is mounted on the base board via spacers. In accordance with the type of semiconductor integrated circuits, the exchange board and the socket are replaced.

Apparatus and method of inspecting semiconductor integrated circuit

An apparatus to be inspected is mounted on one surface of a socket board. An auxiliary inspecting apparatus for adjusting timing of write signals transmitted from a semiconductor inspecting apparatus is mounted on the other surface of the socket board. Input/output (I/O) pins of the auxiliary inspecting apparatus are connected to corresponding I/O pins of the inspected device via through holes in the socket board on a one-to-one basis. This semiconductor inspecting method is thus capable of easily suppressing the delay difference between a plurality of signals output from the semiconductor inspecting apparatus.

Semiconductor inspecting system for inspecting a semiconductor integrated circuit device, and semiconductor inspecting method using the same

A function test circuit inside a burn-in apparatus is mounted on a burn-in board and specifies a plurality of checked devices which operate normally. An average voltage calculating circuit calculates average voltage for test voltage applied to a plurality of checked devices specified on a mounting section. A voltage correction circuit receives the average voltage and outputs a control signal to control set voltage output from a device power supply generation circuit. Therefore, this burn-in apparatus can set the test voltage applied to the checked devices readily with high accuracy.

Burn-in apparatus having average voltage calculating circuit

The peak of the current dissipated by semiconductor devices is dispersed and suppressed to a level below the current supply capability of a burn-in apparatus. As a result, there is obtained a semiconductor manufacturing-and-inspection apparatus which enables easy performance of a burn-in test without involvement of anomalies arising in the burn-in apparatus or limitations on the number of semiconductor devices mounted on the burn-in board. A semiconductor manufacturing-and-inspection system, which tests semiconductor devices provided in a plurality of areas on a burn-in board through use of a burn-in apparatus, includes a driver for supplying a drive signal to the semiconductor devices provided in the plurality of areas, a delay circuit which is provided for one of a plurality of drive signals output from the signal generation apparatus and delays the drive signal relative to the other drive signal; and a driver for controlling the delaying operation of the delay apparatus.

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Tokyo, Japan

Osamu Hashimoto