Kabushiki Kaisha Toshiba

Tokyo Shibaura Denki Kabushiki Kaisha

Fujitsu Media Devices Limited

Nf Corporation

Marcon Electronics Co., Ltde.

Osamu Furukawa

Hideyuki Kanai

Takashi Takahashi

Motomasa Imai

Mitsuo Harata

Yohachi Yamashita

Hitoshi Chiyoma

Kenichi Donuma

Kazuhisa Yabukawa

Takaaki Yasumoto

Yuuki Okada

Toshihiko Murata

Hiroshi Endo

Osamu Kawachi

Osamu Ikata

Nobuo Iwase

Kumi Okuwada

Masao Segawa

Masaru Hayashi

Shingo Fujii

Hiroki Yabu

Noriaki Taniguchi

Hideo Okuma

Satoshi Mukaeda

Kiyoji Handa

Osamu Hirao

Seiichi Yoshida

An isolated power conversion apparatus has an isolation transformer, a series circuit including a load and an inductor connected in series with each other, the series circuit being disposed on a secondary side of the isolation transformer, and one or a plurality of switching means disposed between the series circuit and the secondary side of the isolation transformer, the switching means being bidirectional. This apparatus sends out power from a DC power supply of a primary side of the isolation transformer toward the load as DC power or AC power of an arbitrary polarity, or regenerates and supplies the DC power or AC power from the load to the DC power supply.

Power conversion apparatus

In three-dimensional data generation unit, data edition unit, generates a spreadsheet data that includes information relating to a plurality of node points on a continuous arrangement route of target components by interactive process with a user, and stores the data in storage unit. Three-dimensional data conversion unit, on the basis of spreadsheet data, arranges the node points in a three-dimensional space, connects node points having a predetermined relationship using line segments, and imparts cross-sectional shapes to the connected line segments, to carry out thereby conversion into target component arrangement three-dimensional data. Three-dimensional data management unitstores the obtained target component arrangement three-dimensional data in storage unit, in a format readable by three-dimensional CAD or three-dimensional review system, and outputs the data in response to an output instruction from interface unit

Three-dimensional data generation device, method and program thereof

The present invention reduces the number of diagrams and the workload of management and the like, by aggregating spools of a common format, in plant design technology using a three-dimensional CAD system. Format specific data which is stored separately according to spool format is obtained by aggregating the respective spools in the internal data, which is generated by a data acquisition means, into respective common formats by a spool aggregation means. In this process, a comparison and classification means compares the contents of the control point tables relating to the respective spools, between each and every pair of the spools, so as to confirm whether there exist control point tables which are the same, with taking all of the start points of each spool as a point of origin, thereby determines whether both spools of each pair are matching based on prescribed common characteristics, as the result of this determination, in cases where both spools are matching, then creates format specific data which is stored separately with respect to each spool format.

CAD system, control method and control program for same

More compact, thinner, shorter and lighter surface-mounted electronic component modules and their manufacturing methods at low costs, thus making them industrially highly valuable are available. Such the component includes a wiring substrate having wiring patterns formed on one side and external connection terminals formed on the other side, the wiring patterns and the external connection terminals being connected with each other by via holes or through holes; a plurality of electronic component devices mounted on the one side of the wiring substrate; and an exterior resin layer formed on the wiring substrate which covers the plurality of electronic component devices, wherein at least one of the plurality of electronic component devices is fastened face up to the one side of the wiring substrate, the connection terminal of the electronic component device fastened face up and the wiring pattern or the connection terminal of another electronic component device being connected with each other by wire.

Surface-mounted electronic component module and method for manufacturing the same

The present invention permits further miniaturization and shortening of a surface acoustic wave device while avoiding the influence of the surface acoustic wave device on the inductance value and performance index (Q value) of the spiral inductor. The chip on which the spiral inductor is formed is flip-chip mounted in a package together with another surface acoustic wave device chip. The package is provided with a hermetically sealed lid. A conductor pattern is formed on a face of the package that opposes the spiral inductor. Further, the overlap between the region of the spiral inductor and the conductor pattern is 7% or less.

Surface acoustic wave device

A surface acoustic wave device used in, for example, a mobile communications field as a filter or duplexer and the like to handle high frequencies of about several GHz is fabricated by flip-chip-connecting a surface of a piezoelectric substrate to a base board facing thereto, emitting particulate first sealing material from above a back face of the piezoelectric substrate to apply the first sealing material to the back face of the piezoelectric substrate and hang the first sealing material from edges of the piezoelectric substrate to the base board to form bridging, and forming second sealing material on the first sealing material. These operations provide a manufacturing method of a small-sized surface-mounting surface acoustic wave device appropriate for flip-chip connection.

Surface acoustic wave device and method of manufacturing the device

An electronic device and a fabricating method for fabricating the electronic device, the electronic device comprising; a surface acoustic wave device having a main surface thereon having a transducer portion and wiring patterns connected electrically to the transducer portion; a printed circuit board having wiring patterns formed at least on one main surface thereof; a plurality of conductive bumps which connect electrically both of the mutually opposed wiring patterns and form a space portion between the surface acoustic wave device and a printed circuit board ; and resin portion which, by heating/melting and hardening, makes an intimate contact with other main surface of the device and coats the device and seals the device together with the printed circuit board , wherein, by employing a highly thixotropic and viscous thermo-setting resin compared with a conventional one, an electronic device having a simple structure can be provided and fabricating process for fabricating the electronic device can be simplified.

Electronic component and method of production thereof

An electronic device and a fabricating method for fabricating the electronic device, the electronic device comprising; a surface acoustic wave device having a main surface thereon having a transducer portion and wiring patterns connected electrically to the transducer portion; a printed circuit board having wiring patterns formed at least on one main surface thereof; a plurality of conductive bumps which connect electrically both of the mutually opposed wiring patterns and form a space portion between the surface acoustic wave device and a printed circuit board and resin portion which, by heating/melting and hardening, makes an intimate contact with other main surface of the device and coats the device and seals the device together with the printed circuit board wherein, by employing a highly thixotropic and viscous thermo-setting resin compared with a conventional one, an electronic device having a simple structure can be provided and fabricating process for fabricating the electronic device can be simplified.

A surface acoustic wave device with an electrode structure that suppresses the deterioration of a withstand voltage against an overvoltage such as a surge voltage or noise applied to a balanced signal terminal is provided. A serial resonator that blocks a voltage is disposed among IDTs and a signal output terminal of the surface acoustic wave device. In addition, a serial resonator is disposed among the IDTs and a signal output terminal The serial resonators and operate as part of IDTs to extract a desired band signal. The structure of the serial resonator should be almost the same as that of the serial resonator

Surface acoustic wave device and communication apparatus

An electronic device and a fabricating method for fabricating the electronic device, the electronic device comprising; a surface acoustic wave device,having a main surface thereon having a transducer portion,and wiring patterns,connected electrically to the transducer portion; a printed circuit board,having wiring patterns,formed at least on one main surface thereof; a plurality of conductive bumps,which connect electrically both of the mutually opposed wiring patterns and form a space portion,between the surface acoustic wave device,and a printed circuit board,; and resin portion,which, by heating/melting and hardening, makes an intimate contact with other main surface of the device and coats the device,and seals the device,together with the printed circuit board,, wherein, by employing a highly thixotropic and viscous thermo-setting resin compared with a conventional one, an electronic device having a simple structure can be provided and fabricating process for fabricating the electronic device can be simplified.

Ceramic composition and electronic part using the same

A ceramic capacitor includes at least two opposing electrodes, and a dielectric ceramic composition arranged between the electrodes, wherein the ceramic composition is represented by a formula (Pb.sub.1-x Ae.sub.x) (Zr.sub.1-y Ti.sub.y)O.sub.3 (wherein x represents 0.15 to 0.90, y represents 0 to 0.80, and Ae represents at least one type of an element selected from the group consisting of Ca and Sr), and has a composition in which assuming that the total number of moles of elements constituting a site A consisting of Pb and Ae is (A) and that the total number of moles of elements constituting a site B consisting of Zr and Ti is (B), (A)/(B) is 1.00 or less. The site A of the dielectric ceramic composition may be partially substituted with Ba. The dielectric ceramic composition may be obtained by adding Nb, Cu, Bi, Mn, Co, Ag, Si, Ta, Mg, Zn, W and/or Ni to a composition which is represented by a formula (Pb.sub.1-x Ae.sub.x) (Zr.sub.1-y Ti.sub.y)O.sub.3 (wherein x represents 0.15 to 0.90, y represents 0 to 0.80, and Ae represents at least one type of an element selected from the group consisting of Ca, Sr, and Ba), and in which assuming that the total number of moles of elements constituting a site A consisting of Pb and Ae is (A) and that the total number of moles of elements constituting a site B consisting of Zr and Ti is (B), (A)/(B) is 1.00 or less. The dielectric ceramic composition is preferably formed by using a powder synthesized by a hydrothermal synthesis as a material, and its grain size is preferably 3 .mu.m or less.

Ceramic capacitor

A high-dielectric constant ceramic composite is provided in which an appropriate amount of glass component is added to a composite of the BaTiO.sub.3 -PbMO.sub.3 group having a low temperature coefficient in the dielectric constant thereof. The added glass component serves to maintain the satisfactory properties of the ceramic composite even after various types of reliability tests.

High-dielectric constant ceramic composite and ceramic capacitor elements

When a portion of the Pb of a Pb(Zn.sub.1/3 Nb.sub.2/3)O.sub.3 -based ceramic composition within the region bounded by lines connecting a, b, c, d, e and f points in the ternary composition diagram of the accompanying FIG. 1 is substituted by a small amount of Ca, a high dielectric constant type ceramic composition is obtained which has a small temperature coefficient of dielectric constant and which is effective as a material for multilayer ceramic capacitors.

High dielectric constant type ceramic composition

When a portion of the Pb of a Pb(Zn.sub.1/3 Nb.sub.2/3)O.sub.3 -based ceramic composition within the region bounded by lines connecting a, b, c and d points in the ternary composition diagram of the accompanying FIG. 1 is substituted by a small amount of Ba and/or Sr, a high dielectric constant type ceramic composition which has a small temperature coefficient of dielectric constant and which is effective as a material for multilayer ceramic capacitors is obtained.

Growing community of inventors

Yokohama, Japan

Osamu Furukawa